Abstract: The present invention discloses a slotted retaining ring for use in a chemical mechanical polishing head which can be fabricated by providing a plurality of slot recesses in a bottom surface of the retaining ring. Each of the plurality of slot recesses may be formed in a tapered shape with a base portion adjacent to the outer periphery of the ring and a tip portion of a smaller width than the base portion adjacent to the inner periphery of the retaining ring. The tip portion of the tapered shape is normally spaced apart from the inner periphery such that excessive polishing of the wafer edge can be avoided. The present invention further discloses a method for chemical mechanical polishing a semiconductor wafer by using the slotted retaining ring for holding a polishing head therein.

Abstract: An apparatus for cleaning a process chamber that includes a ventilation hood which has a fluid flow channel attached to an inner peripheral wall of the hood body equipped with a plurality of fluid nozzles pointing downwardly toward a process chamber cavity when the hood is positioned on such process chamber, and a method for using the apparatus. A purge gas flown through the fluid nozzles carries substantially all contaminating fumes or particles away from the process chamber cavity into an air evacuation system such as a factory vacuum exhaust system such that contamination of the process chamber can be essentially eliminated.