Patents by Inventor Kuo-Hsiung Wang

Kuo-Hsiung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10428164
    Abstract: A printing material for a three-dimensional (3D) printing apparatus is provided. The printing material includes a core and a shell covering the core, wherein the Shore hardness of the core is A45-A90, the Shore hardness of the shell is D40-D85, the Shore hardness of the shell is higher than the Shore hardness of the core, the volume percentage of the shell is 10% to 30%, and the volume percentage of the core is 70% to 90%. Since the printing material has a specific structure, feed abnormality during the printing material passing through a narrow inlet hole and guide tube may be prevented in the use of low-hardness material as the core.
    Type: Grant
    Filed: March 30, 2017
    Date of Patent: October 1, 2019
    Assignees: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Kuo-Hsiung Wang, Chun-Wei Peng
  • Publication number: 20180229441
    Abstract: A printing material for a three-dimensional (3D) printing apparatus is provided. The printing material includes a core and a shell covering the core, wherein the Shore hardness of the core is A45-A90, the Shore hardness of the shell is D40-D85, the Shore hardness of the shell is higher than the Shore hardness of the core, the volume percentage of the shell is 10% to 30%, and the volume percentage of the core is 70% to 90%. Since the printing material has a specific structure, feed abnormality during the printing material passing through a narrow inlet hole and guide tube may be prevented in the use of low-hardness material as the core.
    Type: Application
    Filed: March 30, 2017
    Publication date: August 16, 2018
    Applicants: XYZprinting, Inc., Kinpo Electronics, Inc.
    Inventors: Kuo-Hsiung Wang, Chun-Wei Peng
  • Publication number: 20130295332
    Abstract: An method for manufacturing an imitation leather includes preparing an animal skin powder, blending the animal skin powder and a matrix to form the imitation plastic material and then the imitation plastic material being cooled and granulated to form granules and melting and feeding the granules of the imitation plastic material to a sheet extruding equipment to extrude the flexible sheet imitation leather. The animal skin powder comprises an animal epidermis powder and has a particle size of 0.2 um-0.3 mm. The matrix comprises an elastic material. The animal skin powder and the matrix are blended under a blending temperature between 100-160° C. and the animal skin powder is present in the imitation plastic material in an amount of 30-70 wt %, based on the total weight of the imitation plastic material.
    Type: Application
    Filed: May 7, 2012
    Publication date: November 7, 2013
    Inventors: Chih-Hsien Huang, Kuo-Hsiung Wang
  • Publication number: 20110244170
    Abstract: A thermally formed three-dimensional mesh fabric comprises a flexible three dimensional permeable sheet and a thermally formed cover. The flexible three dimensional permeable sheet has a surface and a softening temperature. The thermally formed cover is applied to at least a portion of the surface of the three dimensional permeable sheet, is low-temperature thermoplastic polyester and has a softening temperature lower than that of the three dimensional permeable sheet. Thus, thermal forming three-dimensional mesh fabric is permeable, lightweight and has good support and is suitable for applications such as splints, plaster bandages and safety protectors.
    Type: Application
    Filed: April 2, 2010
    Publication date: October 6, 2011
    Inventors: Sun Fu Hsu, Mei Jan Chu, Kuo Hsiung Wang, Yi-Che Huang, Qi-Wen Lu, Chien-Cheng Lin
  • Patent number: 7609131
    Abstract: The present invention provides a surface mount design (SMD) coupling filter device with a fixed coupling coefficient having a pair of hollow coils. Theoretically, coupling coefficients of two hollow coils may vary with the parameter such as distance, number of windings, inner radius, wire size, medium coefficient. When a desired coil coupling distance is derived from the above parameters, a pair of hollow coils then is fastened fixed by either a house fastening approach or an adhesive injection fastening approach, such that the desired coil coupling distance can be fixed by using an adhesive with a specific medium coefficient.
    Type: Grant
    Filed: August 23, 2007
    Date of Patent: October 27, 2009
    Assignee: Prosperity Dielectrics Co., Ltd.
    Inventors: Kuo-Hsiung Wang, Wei-Ching Shih
  • Publication number: 20080048801
    Abstract: The present invention provides a surface mount design (SMD) coupling filter device with a fixed coupling coefficient having a pair of hollow coils. Theoretically, coupling coefficients of two hollow coils may vary with the parameter such as distance, number of windings, inner radius, wire size, medium coefficient. When a desired coil coupling distance is derived from the above parameters, a pair of hollow coils then is fastened fixed by either a house fastening approach or an adhesive injection fastening approach, such that the desired coil coupling distance can be fixed by using an adhesive with a specific medium coefficient.
    Type: Application
    Filed: August 23, 2007
    Publication date: February 28, 2008
    Inventors: Kuo-Hsiung Wang, Wei-Ching Shih