Patents by Inventor Kuo Hsun Lee

Kuo Hsun Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240131819
    Abstract: A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.
    Type: Application
    Filed: May 3, 2023
    Publication date: April 25, 2024
    Inventors: KAI-WEI LO, WEN-FENG LEE, HSIANG-YUN YANG, KUO-HSUN CHEN
  • Patent number: 7269238
    Abstract: The invention relates to a receiver and a receiving method in a receiver of a radio system. The method comprises: receiving (500) signal with an array antenna comprising at least two antenna elements, oversampling (504) the received signal, measuring (900) the spatial and temporal colour of the received oversampled signal, combining (9089 the received signal with combined maximum ratio combining and space-time interference rejection combining, controlling (902-904) the combining of the received signal on the basis of the measurement result.
    Type: Grant
    Filed: September 16, 2003
    Date of Patent: September 11, 2007
    Assignee: Nokia Corporation
    Inventors: Kuo Hsun Lee, Sathiaseelan Sundaralingam, Gilles Charbit, Mikko Säily