Abstract: A method includes forming a first conductive feature over a semiconductor substrate, forming an ILD layer over the first conductive feature, patterning the ILD layer to form a trench, and forming a conductive layer over the patterned ILD layer to fill the trench. The method further includes polishing the conductive layer to form a via contact configured to interconnect the first conductive feature with a second conductive feature, where polishing the conductive layer exposes a top surface of the ILD layer, polishing the exposed top surface of the ILD layer, such that a top portion of the via contact protrudes from the exposed top surface of the ILD layer, and forming the second conductive feature over the via contact, such that the top portion of the via contact extends into the second conductive feature.

Abstract: The shoe has a body, an insole, illuminating device and a shoe-pad. The body is formed as a single piece and has a recess, a heel, and a cavity. The cavity is formed in the body near the heel and communicates with the recess. The insole is mounted in the recess and has a crevice, a containing hole and a fixing hole. The crevice is formed in the bottom of the insole and corresponds to the cavity in the body. The containing hole is formed in the insole and corresponds to the cavity, and the fixing hole is formed in the periphery of the insole. The illuminating device is mounted between the body and the insole and has two wires, a power source, a circuit board, multiple illuminating elements and a switch. The shoe-pad is attached to insole and has a through hole and a cover.