Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Abstract: A package includes a package substrate, an interposer over and bonded to the package substrate, a first wafer over and bonding to the interposer, and a second wafer over and bonding to the first wafer. The first wafer has independent passive device dies therein. The second wafer has active device dies therein.

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Abstract: An optical device package is provided. The optical device package includes a sensor and a light-transmitting region. The sensor includes a sensing region. The light-transmitting region is at least partially in the sensor, and the light-transmitting region allows an external light to transmit therethrough and reach the sensing region. A width of the light-transmitting region adjacent to a level of the sensing region is equal to or smaller than a width of the sensing region.

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

Abstract: The present disclosure provides a semiconductor package structure. The semiconductor package structure includes a substrate, a first electronic component and a support component. The first electronic component is disposed on the substrate. The first electronic component has a backside surface facing a first surface of the substrate. The support component is disposed between the backside surface of the first electronic component and the first surface of the substrate. The backside surface of the first electronic component has a first portion connected to the support component and a second portion exposed from the support component.

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

Abstract: A semiconductor package structure includes an organic substrate having a first surface, a first recess depressed from the first surface, a first chip over the first surface and covering the first recess, thereby defining a first cavity enclosed by a back surface of the first chip and the first recess, and a second chip over the first chip. The first cavity is an air cavity or a vacuum cavity.

Abstract: An optical defect detection method and a system thereof are disclosed. The detection method includes a process of detecting an image of an optical film by an optical detector. The image is converted into a clean detection image by conducting the following processes: uniforming the brightness, enhancing the contrast, filtering off the noise, smoothing the image and binarizing the image. A relative relation between a pixel and the surrounding pixels of the clean detection image is converted into a spatial relation sequence model. The spatial relation sequence model is compared to the different types of the defect sequence model, so that the defect type of the optical film is identified as a point defect, a lack of material defect or a ripple defect.

Abstract: A real time monitoring system and a method thereof of an optical film manufacturing process are provided. The real time monitoring system includes a plurality of production systems and a cloud big data platform which connects to the plurality of production systems. The process data of the production line is collected by as production line data collector of the production system. The process data is uploaded to a database of the cloud big data platform. The historical process data across the plurality of production systems can be combined as a process waveform feature by a profile database. A processor connects to the database and the profile database. The differences between the process data and the process waveform feature are compared in real time. When the difference value exceeds a threshold value, an abnormal message is sent to the corresponding production line.

Abstract: An optical defect detection method and a system thereof are disclosed. The detection method includes a process of detecting an image of an optical film by an optical detector. The image is converted into a clean detection image by conducting the following processes: uniforming the brightness, enhancing the contrast, filtering off the noise, smoothing the image and binarizing the image. A relative relation between a pixel and the surrounding pixels of the clean detection image is converted into a spatial relation sequence model. The spatial relation sequence model is compared to the different types of the defect sequence model, so that the defect type of the optical film is identified as a point defect, a lack of material defect or a ripple defect.

Abstract: A fuel efficiency analysis system is provided, which includes a capture device, an analysis process unit and a transform unit. The capture device captures driving data of automobile which is driven by a driver during at least one driving course, the analysis process unit analyzes the driving data to obtain inefficient driving period, and processes the inefficient driving period to generate a plurality of driving time intervals, and the transform unit transforms the plurality of driving time intervals into a plurality of driving efficiencies, and then the plurality of driving efficiencies is transformed into ODE (overall driving effectiveness). A method for analyzing fuel efficiency is also disclosed.

Abstract: A driving behavior analysis method and a system thereof are provided. The system includes a storage unit, a window splitting unit and a processing unit. The storage unit stores a history fuel-consumption sequence, a driving fuel-consumption sequence and a history reference unit. The history fuel-consumption sequence includes history fuel-consumption data and the driving fuel-consumption sequence includes current fuel-consumption data. The window splitting unit separates history fuel-consumption sequence into multiple basic units and separates driving fuel-consumption sequence into multiple consumption units by utilizing a sliding window to move on the two sequences. By ordering the history fuel-consumption data for each basic unit of the history fuel-consumption sequence in a decreasing order, the processing unit generates a decreasing fuel-consumption sequence.

Abstract: A power-saving apparatus for transportation vehicle is provided. The power-saving apparatus includes an identification module for identifying a user, a positioning module for retrieving a traveled path, a connection interface for retrieving energy consumption data, a memory unit for storing the user data, the traveled path, and the energy consumption data, a microprocessor for calculating an instantaneous energy consumption, an average energy consumption associated with the traveled path. The power-saving apparatus further includes a warning module for generating a warning signal. When the instantaneous energy consumption associated with a first road segment is determined to be larger than a first average energy consumption and/or the instantaneous energy consumption associated with a second road segment is determined to be larger than a second average energy consumption, the warning module operatively generates the warning signal.