Abstract: An image sensor structure includes a semiconductor substrate, a plurality of image sensing elements, a reflective element, and a high-k dielectric structure. The image sensing elements are in the semiconductor substrate. The reflective element is in the semiconductor substrate and between the image sensing elements. The high-k dielectric structure is between the reflective element and the image sensing elements.

Abstract: A method of removing a sacrificial substructure from a support structure is disclosed. The method includes receiving the support structure, where the support structure has the sacrificial substructure connected thereto, the sacrificial substructure having functioning electrical devices removed therefrom. The method also includes applying a barrier to the sacrificial substructure, puncturing the sacrificial substructure with a puncture plate to secure the sacrificial substructure to the puncture plate, and detaching the sacrificial substructure from the support structure by moving the puncture plate with respect to the support structure.

Abstract: A wafer alignment assembly is provided. The wafer alignment assembly includes: a first tapered wall extending in a first horizontal direction; a first spring wall attached to an inner surface of the first tapered wall; a first set of conveyor rollers configured to rotate; a second tapered wall extending in the first horizontal direction, wherein the first tapered wall and the second tapered wall are characterized by a tapered shape that facilitates entry of a wafer assembly; a second spring wall attached to an inner surface of the first tapered wall; and a second set of conveyor rollers configured to rotate.

Abstract: At least one embodiment, a vacuum chuck includes a moisture gate structure that allows for moisture to escape to reduce an amount of warpage in a workpiece when present on the vacuum chuck. The moisture gate structure includes a base portion that extends laterally outward from a central vacuum portion of the vacuum chuck, and a plurality of protrusions are spaced apart from the central vacuum portion and extend outward from the base portion. End surfaces of the plurality of protrusions contact a backside surface of the workpiece (e.g., a wafer on a carrier) when the workpiece is present on the vacuum chuck. The vacuum chuck may further include one or more guide portions that act as guides such that the workpiece remains properly aligned and within position when present on the vacuum chuck.

Abstract: A package includes a die, first conductive structures, second conductive structures, and an encapsulant. The die has a rear surface. The first conductive structures and the second conductive structures surround the die. The first conductive structures include cylindrical columns and the second conductive structures include elliptical columns. At least one of the second conductive structures is closer to the die than the first conductive structures. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures.

Abstract: A package includes a die, first conductive structures, second conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The first conductive structures and the second conductive structures surround the die. A shape of the first conductive structures is different a shape of the second conductive structures. The second conductive structures include elliptical columns having straight sidewalls. A distance between the first conductive structure that is closest to the die and the die is greater than a distance between the second conductive structure that is closest to the die and the die. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures. The redistribution structure is over the die and the encapsulant. The redistribution structure is electrically connected to the die, the first conductive structures, and the second conductive structures.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a gate stack over a semiconductor substrate and a cap element over the gate stack. The cap element has an upper portion and a lower portion, and the upper portion is wider than the lower portion. The semiconductor device structure also includes a spacer element over a sidewall of the cap element and a sidewall of the gate stack.

Abstract: A package includes a die, first conductive structures, second conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The first conductive structures and the second conductive structures surround the die. A shape of the first conductive structures is different a shape of the second conductive structures. The second conductive structures include elliptical columns having straight sidewalls. A distance between the first conductive structure that is closest to the die and the die is greater than a distance between the second conductive structure that is closest to the die and the die. The encapsulant encapsulates the die, the first conductive structures, and the second conductive structures. The redistribution structure is over the die and the encapsulant. The redistribution structure is electrically connected to the die, the first conductive structures, and the second conductive structures.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a gate stack over a semiconductor substrate and a cap element over the gate stack. The cap element has an upper portion and a lower portion, and the upper portion is wider than the lower portion. The semiconductor device structure also includes a spacer element over a sidewall of the cap element and a sidewall of the gate stack.

Abstract: A package includes a die, a plurality of conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The conductive structures include elliptical columns. The encapsulant encapsulates the die and the conductive structures. The redistribution structure is over the active surface of the die and the encapsulant. The redistribution structure is electrically connected to the die and the conductive structures.

Abstract: A visibility meter, a street light device and an operation method thereof are provided. The visibility measurement method includes: transmitting a visible laser through an optical transmitter; receiving the visible laser through an optical sensor to generate a sensed result; and calculating a visibility according to the sensed result.

Abstract: The present invention discloses a light emitting device. The light emitting device includes a housing, a first light emitting module and a second light emitting module. The first light emitting module is provided with a first light emitting area and is disposed on the housing. The second light emitting module is provided with a second light emitting area and is disposed on the housing and surrounds the first light emitting module. A first luminance in the first light emitting area is higher than a second luminance in the second light emitting area, and the first luminance and the second luminance are separately controlled.

Abstract: Structures and formation methods of a semiconductor device structure are provided. The semiconductor device structure includes a gate stack over a semiconductor substrate and a cap element over the gate stack. The cap element has an upper portion and a lower portion, and the upper portion is wider than the lower portion. The semiconductor device structure also includes a spacer element over a sidewall of the cap element and a sidewall of the gate stack.

Abstract: The present invention discloses a light emitting device. The light emitting device includes a housing, a first light emitting module and a second light emitting module. The first light emitting module is provided with a first light emitting area and is disposed on the housing. The second light emitting module is provided with a second light emitting area and is disposed on the housing and surrounds the first light emitting module. A first luminance in the first light emitting area is higher than a second luminance in the second light emitting area, and the first luminance and the second luminance are separately controlled.

Abstract: A lighting device including a light emitting module, a light pattern determination module, and a controller is provided. The light emitting module is configured to emit an illumination light. The light pattern determination module includes a first lens and a second lens. The first lens corresponds to a first light pattern, the second lens corresponds to a second light pattern, and the first light pattern is different from the second light pattern. The controller is configured to adjust at least one of the light emitting module and the light pattern determination module, so as to control an illumination light pattern of the illumination light passed through the light pattern determination module. In addition, a lighting method of the lighting device and a lighting system using the lighting device are also provided.

Abstract: A visibility meter, a street light device and an operation method thereof are provided. The visibility measurement method includes: transmitting a visible laser through an optical transmitter; receiving the visible laser through an optical sensor to generate a sensed result; and calculating a visibility according to the sensed result.

Abstract: A brake system including a base, a driving motor, a cam, a braking pump, a rotating column, and a bearing shaft. The base has an accommodating space. The driving motor is disposed on the base and located in the accommodating space. The cam is pivoted to the driving motor, and the driving motor is adapted to drive the cam to rotate relative to the base. The braking pump is disposed outside the base. The rotating column is rotatably disposed outside the base and connected to the braking pump. The bearing shaft is connected to the rotating column and extended into the accommodating space so as to radially in contact with the cam.

Abstract: A lighting device including a light emitting module, a light pattern determination module, and a controller is provided. The light emitting module is configured to emit an illumination light. The light pattern determination module includes a first lens and a second lens. The first lens corresponds to a first light pattern, the second lens corresponds to a second light pattern, and the first light pattern is different from the second light pattern. The controller is configured to adjust at least one of the light emitting module and the light pattern determination module, so as to control an illumination light pattern of the illumination light passed through the light pattern determination module. In addition, a lighting method of the lighting device and a lighting system using the lighting device are also provided.

Abstract: A package includes a die, a plurality of conductive structures, an encapsulant, and a redistribution structure. The die has an active surface and a rear surface opposite to the active surface. The conductive structures surround the die. The conductive structures include elliptical columns. The encapsulant encapsulates the die and the conductive structures. The redistribution structure is over the active surface of the die and the encapsulant. The redistribution structure is electrically connected to the die and the conductive structures.

Abstract: A brake system including a base, a driving motor, a cam, a braking pump, a rotating column, and a bearing shaft. The base has an accommodating space. The driving motor is disposed on the base and located in the accommodating space. The cam is pivoted to the driving motor, and the driving motor is adapted to drive the cam to rotate relative to the base. The braking pump is disposed outside the base. The rotating column is rotatably disposed outside the base and connected to the braking pump. The bearing shaft is connected to the rotating column and extended into the accommodating space so as to radially in contact with the cam.