Patents by Inventor Kuo J. Tseng

Kuo J. Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead with slits for reducing solder overflow and eliminating air gaps in the execution of solder joints
    Patent number: 5631806
    Abstract: The portion of the lead which is soldered between electrical components in a circuit module includes one or more radially extending slits. Once heated, the fluid solder is drawn into the slits by capillary action. Trapped air escapes, eliminating air pockets or gaps. The result is a stronger joint and a reduction in solder overflow.
    Type: Grant
    Filed: July 31, 1995
    Date of Patent: May 20, 1997
    Inventors: Robert Fried, Kuo J. Tseng, Hsi Y. Hsiao