Patents by Inventor KUO-JEN CHANG

KUO-JEN CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113071
    Abstract: An integrated circuit package including electrically floating metal lines and a method of forming are provided. The integrated circuit package may include integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure on the encapsulant, a first electrically floating metal line disposed on the redistribution structure, a first electrical component connected to the redistribution structure, and an underfill between the first electrical component and the redistribution structure. A first opening in the underfill may expose a top surface of the first electrically floating metal line.
    Type: Application
    Filed: January 5, 2023
    Publication date: April 4, 2024
    Inventors: Chung-Shi Liu, Mao-Yen Chang, Yu-Chia Lai, Kuo-Lung Pan, Hao-Yi Tsai, Ching-Hua Hsieh, Hsiu-Jen Lin, Po-Yuan Teng, Cheng-Chieh Wu, Jen-Chun Liao
  • Publication number: 20230408342
    Abstract: A temperature measurement calibration method without interference of a shutter of a thermal imaging module comprises steps: at a temperature of a core chip of a thermal imaging module, obtaining a response value generated by measuring a blackbody temperature after the shutter is started at a frame time; performing a linear regression analysis of the response value to obtain a correction response value equation; inputting the response value into the correction response value equation; and obtaining a correction response value of measuring the blackbody temperature.
    Type: Application
    Filed: June 21, 2022
    Publication date: December 21, 2023
    Inventors: SHIANG-FENG TANG, SHUN-LUNG YEN, KUO-JEN CHANG, HSIN-CHANG CHEN
  • Publication number: 20230314238
    Abstract: A method of stabilizing temperature sensing in presence of temperature-sensing component temperature variation includes steps of: obtaining response value caused by black body at first temperature of a thermal imager core chip; obtaining high-temperature first-order linear function of high-temperature black body response value versus thermal imager core chip temperature; obtaining low-temperature first-order linear function of low-temperature black body response value versus thermal imager core chip temperature; obtaining response value of high-temperature first-order linear function at first temperature, response value of high-temperature first-order linear function at second temperature of the thermal imager core chip, response value of low-temperature first-order linear function at first temperature, response value of low-temperature first-order linear function at second temperature, and response value of black body and substituting the five values into an equation for correcting the response values; and o
    Type: Application
    Filed: March 30, 2022
    Publication date: October 5, 2023
    Inventors: SHIANG-FENG TANG, SHUN-LUNG YEN, KUO-JEN CHANG, HSIN-CHANG CHEN
  • Publication number: 20100102253
    Abstract: The invention discloses a sterilization apparatus for a fabric and shoes. The sterilization apparatus of the invention includes an organization member for containing the fabric or shoes. The sterilization apparatus of the invention further includes a light sterilization type member and/or an exsiccating member disposed with the organization member for sterilizing or drying the fabric or shoes.
    Type: Application
    Filed: September 21, 2009
    Publication date: April 29, 2010
    Inventors: KUO-JEN CHANG, Kun-Chia Wu