Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: A light emitting diode (LED) lamp. Brightness of the LED lamp is controlled by a dimmer and an external alternating current (AC) source is received via the dimmer. The LED lamp includes at least one LED, a rectifying-modulating-driving apparatus and a current holding compensator. The rectifying-modulating-driving apparatus is coupled between the LED and the dimmer for bridge-rectifying and modulating an AC source with a conducting angle from the dimmer to drive the LED. The current holding compensator is coupled to the rectifying-modulating-driving apparatus to provide a compensation current when the AC source with the conducting angle is lower than a voltage after being bridge-rectified.