Patents by Inventor KUO-JUNG FAN
KUO-JUNG FAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230402292Abstract: A method of manufacturing an electronic device includes providing a substrate, providing an intermediate layer on the substrate, and providing an isolation layer on the intermediate layer. The substrate includes an active region and a peripheral region. The peripheral region is adjacent to the active region, and the ratio of the area of the active region to the area of the substrate surface is between 75% and 92%. The isolation layer includes a first surface and at least one slope. The first surface of the isolation layer is correspondingly disposed in the active region. The at least one slope of the isolation layer is correspondingly disposed in the peripheral region and at a first angle with respect to the substrate surface.Type: ApplicationFiled: June 27, 2022Publication date: December 14, 2023Applicant: InnoLux CorporationInventors: Chuan-Ming YEH, Heng-Shen YEH, Sheng-Hui CHIU, Kuo-Jung FAN
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Publication number: 20230377904Abstract: The embodiment of the disclosure provides a composite layer circuit element of an electronic device. The composite layer circuit element includes a first dielectric layer, a first circuit layer and a second dielectric layer. The first circuit layer is disposed on the first dielectric layer, and the second dielectric layer is disposed on the first circuit layer. A thickness of the first dielectric layer is greater than a thickness of the second dielectric layer in a cross section view.Type: ApplicationFiled: August 7, 2023Publication date: November 23, 2023Applicant: Innolux CorporationInventors: Chuan-Ming Yeh, Heng-Shen Yeh, Kuo-Jung Fan, Cheng-Chi Wang
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Patent number: 11764077Abstract: The embodiment of the disclosure provides a composite layer circuit element and a manufacturing method thereof. The manufacturing method of the composite layer circuit element includes the following. A carrier is provided. A first dielectric layer is formed on the carrier, and the first dielectric layer is patterned. The carrier on which the first dielectric layer is formed is disposed on a first curved-surface mold, and the first dielectric layer is cured. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer is patterned. The carrier on which the first dielectric layer and the second dielectric layer are formed is disposed on a second curved-surface mold, and the second dielectric layer is cured. A thickness of a projection of the first curved-surface mold is smaller than a thickness of a projection of the second curved-surface mold.Type: GrantFiled: November 11, 2021Date of Patent: September 19, 2023Assignee: Innolux CorporationInventors: Chuan-Ming Yeh, Heng-Shen Yeh, Kuo-Jung Fan, Cheng-Chi Wang
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Publication number: 20230026151Abstract: The embodiment of the disclosure provides a composite layer circuit element and a manufacturing method thereof. The manufacturing method of the composite layer circuit element includes the following. A carrier is provided. A first dielectric layer is formed on the carrier, and the first dielectric layer is patterned. The carrier on which the first dielectric layer is formed is disposed on a first curved-surface mold, and the first dielectric layer is cured. A second dielectric layer is formed on the first dielectric layer. The second dielectric layer is patterned. The carrier on which the first dielectric layer and the second dielectric layer are formed is disposed on a second curved-surface mold, and the second dielectric layer is cured. A thickness of a projection of the first curved-surface mold is smaller than a thickness of a projection of the second curved-surface mold.Type: ApplicationFiled: November 11, 2021Publication date: January 26, 2023Applicant: Innolux CorporationInventors: Chuan-Ming Yeh, Heng-Shen Yeh, Kuo-Jung Fan, Cheng-Chi Wang
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Publication number: 20220189863Abstract: A redistribution layer structure is provided. The redistribution layer structure includes a first metal layer, a first dielectric layer disposed on the first metal layer, a second metal layer disposed on the first dielectric layer, and a second dielectric layer disposed on the second metal layer. A coefficient of thermal expansion of the first dielectric layer is less than a coefficient of thermal expansion of the second dielectric layer.Type: ApplicationFiled: November 21, 2021Publication date: June 16, 2022Applicant: Innolux CorporationInventors: Hung-Sheng Chou, Wen-Hsiang Liao, Kuo-Jung Fan, Heng-Shen Yeh, Cheng-Chi Wang
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Publication number: 20220189862Abstract: A redistribution layer structure is provided. The redistribution layer structure includes a first metal layer and a first dielectric layer disposed on the first metal layer. A range of a difference between a coefficient of thermal expansion of the first dielectric layer and a coefficient of thermal expansion of the first metal layer is 0% to 70% of the coefficient of thermal expansion of the first dielectric layer.Type: ApplicationFiled: November 18, 2021Publication date: June 16, 2022Applicant: Innolux CorporationInventors: Hung-Sheng Chou, Wen-Hsiang Liao, Kuo-Jung Fan, Heng-Shen Yeh, Cheng-Chi Wang
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Publication number: 20220181242Abstract: A redistribution layer structure and the manufacturing method thereof are provided. The redistribution layer structure includes a first metal layer, a first dielectric layer, a second metal layer, and a second dielectric layer. The first dielectric layer is disposed on the first metal layer. The second metal layer is disposed on the first dielectric layer. The second dielectric layer is disposed on the second metal layer. A chemical resistance of the first dielectric layer is greater than a chemical resistance of the second dielectric layer.Type: ApplicationFiled: November 22, 2021Publication date: June 9, 2022Applicant: Innolux CorporationInventors: Kuo-Jung Fan, Cheng-Chi Wang, Heng-Shen Yeh, Chuan-Ming Yeh
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Patent number: 10906288Abstract: A method for manufacturing a display device is disclosed, the method at least includes the following step: Firstly, a temporary substrate is provided, a hydrogen containing structure is formed on the temporary substrate, a polymer film is formed on the hydrogen containing structure, and a display element is formed on the polymer film. Afterwards, a laser beam process is performed, to focus a laser beam on the hydrogen containing structure, and the temporary substrate is then removed.Type: GrantFiled: April 8, 2019Date of Patent: February 2, 2021Assignee: InnoLux CorporationInventors: Wen-Chien Lin, Kuo-Jung Fan
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Publication number: 20200316932Abstract: A method for manufacturing a display device is disclosed, the method at least includes the following step: Firstly, a temporary substrate is provided, a hydrogen containing structure is formed on the temporary substrate, a polymer film is formed on the hydrogen containing structure, and a display element is formed on the polymer film. Afterwards, a laser beam process is performed, to focus a laser beam on the hydrogen containing structure, and the temporary substrate is then removed.Type: ApplicationFiled: April 8, 2019Publication date: October 8, 2020Inventors: Wen-Chien Lin, Kuo-Jung Fan
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Patent number: 9983438Abstract: A display panel includes a first substrate, a second substrate, a display medium layer, a color filter layer, a third substrate, a backlight module, and a quantum dot pattern layer. The display medium layer and the color filter layer are disposed between the first and second substrates. The color filter layer includes a first color filter pattern. The backlight module is disposed on one side of the second substrate. The second and the third substrate are disposed between the backlight module and the display medium layer, and between the backlight module and the second substrate, respectively. The quantum dot pattern layer is disposed on the third substrate and between the third substrate and the second substrate, and includes at least one first quantum dot pattern corresponding to first color filter pattern. The first quantum dot pattern's color is equal to the first color filter pattern's color.Type: GrantFiled: October 21, 2015Date of Patent: May 29, 2018Assignee: INNOLUX CORPORATIONInventors: Kuo-Jung Fan, Li-Wei Mao
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Publication number: 20160116801Abstract: A display panel includes a first substrate, a second substrate, a display medium layer, a color filter layer, a third substrate, a backlight module, and a quantum dot pattern layer. The display medium layer and the color filter layer are disposed between the first and second substrates. The color filter layer includes a first color filter pattern. The backlight module is disposed on one side of the second substrate. The second and the third substrate are disposed between the backlight module and the display medium layer, and between the backlight module and the second substrate, respectively. The quantum dot pattern layer is disposed on the third substrate and between the third substrate and the second substrate, and includes at least one first quantum dot pattern corresponding to first color filter pattern. The first quantum dot pattern's color is equal to the first color filter pattern's color.Type: ApplicationFiled: October 21, 2015Publication date: April 28, 2016Inventors: KUO-JUNG FAN, LI-WEI MAO