Abstract: A layer stack including a first bonding dielectric material layer, a dielectric metal oxide layer, and a second bonding dielectric material layer is formed over a top surface of a substrate including a substrate semiconductor layer. A conductive material layer is formed by depositing a conductive material over the second bonding dielectric material layer. The substrate semiconductor layer is thinned by removing portions of the substrate semiconductor layer that are distal from the layer stack, whereby a remaining portion of the substrate semiconductor layer includes a top semiconductor layer. A semiconductor device may be formed on the top semiconductor layer.

Abstract: An electronic device has a narrow viewing angle state and a wide viewing angle state, and includes a panel and a light source providing a light passing through the panel. In the narrow viewing angle state, the light has a first relative light intensity and a second relative light intensity. The first relative light intensity is the strongest light intensity, the second relative light intensity is 50% of the strongest light intensity, the first relative light intensity corresponds to an angle of 0°, the second relative light intensity corresponds to a half-value angle, and the half-value angle is between ?15° and 15°. In the narrow angle state, a third relative light intensity at each angle between 20° and 60° or each angle between ?20° and ?60° is lower than 20% of the strongest light intensity.

Abstract: A semiconductor die package includes an inductor-capacitor (LC) semiconductor die that is directly bonded with a logic semiconductor die. The LC semiconductor die includes inductors and capacitors that are integrated into a single die. The inductors and capacitors of the LC semiconductor die may be electrically connected with transistors and other logic components on the logic semiconductor die to form a voltage regulator circuit of the semiconductor die package. The integration of passive components (e.g., the inductors and capacitors) of the voltage regulator circuit into a single semiconductor die reduces signal propagation distances in the voltage regulator circuit, which may increase the operating efficiency of the voltage regulator circuit, may reduce the formfactor for the semiconductor die package, may reduce parasitic capacitance and/or may reduce parasitic inductance in the voltage regulator circuit (thereby improving the performance of the voltage regulator circuit), among other examples.

Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.

Abstract: The present invention discloses a display including a display panel and a light redirecting film disposed on the viewing side of the display panel. The light redirecting film comprises a light redistribution layer, and a light guide layer disposed on the light redistribution layer. The light redistribution layer includes a plurality of strip-shaped micro prisms extending along a first direction and arranged at intervals and a plurality of diffraction gratings arranged at the bottom of the intervals between the adjacent strip-shaped micro prisms, wherein each of the strip-shaped micro prisms has at least one inclined light-guide surface, and the bottom of each interval has at least one set of diffraction gratings, and the light guide layer is in contact with the strip-shaped micro prisms and the diffraction gratings.

Abstract: The address conversion system includes a storage device, a memory bus, and a processor. The processor is configured to execute the following steps: generating a real buffer on the storage device; generating a fake buffer in a fake capacity of the storage device by a fake buffer algorithm; establishing a coupling relationship between the real buffer and the fake buffer through a coupling algorithm by the coupler of the memory bus; receiving a compressed data from a first device by the real buffer; when a second device wants to read the fake buffer, the coupler guides the second device to the real buffer through the coupling relationship for reading; transmitting the compressed data of the real buffer to the coupler by the memory bus; decompressing the compressed data into a decompressed data by the coupler; and transmitting the decompressed data to the second device by the memory bus.

Abstract: A display device including a first light emitting unit, a second light emitting unit, a first optical layer and a second optical layer is disclosed. The first optical layer is disposed on at least one of the first light emitting unit and the second light emitting unit, and the first optical layer includes a collimating layer. The second optical layer is disposed on the first light emitting unit. The second optical layer is configured to scatter a first light emitted from the first light emitting unit but does not scatter a second light emitted from the second light emitting unit.

Abstract: An electronic device which has a narrow viewing angle state and a wide viewing angle state includes a diffuser layer, a panel and a light source. The panel is disposed on the diffuser layer. The light source provides a light passing through the panel. In the narrow viewing angle state, the light has a first relative light intensity and a second relative light intensity. The first relative light intensity is the strongest light intensity, and the second relative light intensity is 50% of the strongest light intensity. The first relative light intensity corresponds to an angle of 0°, the second relative light intensity corresponds to a half-value angle, and the half-value angle is between ?15° and 15°.

Abstract: A display device including a first light emitting unit, a second light emitting unit, a first optical layer and a second optical layer is disclosed. The first optical layer is disposed on at least one of the first light emitting unit and the second light emitting unit, and the first optical layer includes a collimating layer. The second optical layer is disposed on the first light emitting unit. The second optical layer is configured to scatter a first light emitted from the first light emitting unit but does not scatter a second light emitted from the second light emitting unit.

Abstract: A backlight module and a display device using the same are disclosed. The backlight module includes at least one first light emitting unit, at least one second light emitting unit, a first optical layer and a second optical layer. The first light emitting unit emits a first light, and the second light emitting unit emits a second light. The first optical layer is disposed on a light exiting side of the first light emitting unit and the second light emitting unit, and the first optical layer collimates the first light and the second light. The second optical layer is disposed on a light exiting side of the first optical layer, and the second optical layer scatters the first light but does not scatter the second light.

Abstract: An electronic device which has a narrow viewing angle state and a wide viewing angle state includes a diffuser layer, a panel and a light source. The panel is disposed on the diffuser layer. The light source provides a light passing through the panel. In the narrow viewing angle state, the light has a first relative light intensity and a second relative light intensity. The first relative light intensity is the strongest light intensity, and the second relative light intensity is 50% of the strongest light intensity. The first relative light intensity corresponds to an angle of 0°, the second relative light intensity corresponds to a half-value angle, and the half-value angle is between ?15° and 15°.

Abstract: An electronic device includes a panel having a working area and a peripheral area, signal lines, sub-pixels, bio-sensor units, a first switch unit and a second switch unit. The signal lines are disposed on the panel and have a first signal line and a second signal line. The sub-pixels and the bio-sensor units are disposed in the working area. The sub-pixels have a first sub-pixel and a second sub-pixel. The bio-sensor units have a first bio-sensor unit which is electrically connected to the first signal line. The first switch unit and the second switch unit are disposed in the peripheral area and respectively electrically connected to the first sub-pixel and the second sub-pixel through the first signal line and the second signal line. A first time period that the first switch unit is turned on is longer than a second time period that the second switch unit is turned on.

Abstract: A semiconductor component burn-in test module includes a burn-in board and an external power transmission component. The burn-in board includes a plurality of burn-in seats, wherein a plurality of chips are disposed on the burn-in seats. The external power transmission component is arranged at opposite two sides of the burn-in board, where the external power transmission component includes a plurality of conductive members and a plurality of terminal seats. The burn-in board is provided with a plurality of wirings corresponding to the external power transmission component. As such, electric power can be conveyed to the plural burn-in seats of the burn-in board, through the plural terminal seats and the plural conductive strips. This decreases the length and the number of copper foil wirings in the burn-in boards for power transmission, so as to lower the cost of the burn-in boards.

Abstract: An electronic device includes a cover layer, a light control panel, an optical fingerprint sensor and a first light source disposed at the same side of the cover layer. The first light source is for fingerprint sensing and capable of providing a light of which half-value angle is between ?15° and 15°.

Abstract: A backlight module and a display device using the same are disclosed. The backlight module includes at least one first light emitting unit, at least one second light emitting unit, a first optical layer and a second optical layer. The first light emitting unit emits a first light, and the second light emitting unit emits a second light. The first optical layer is disposed on a light exiting side of the first light emitting unit and the second light emitting unit, and the first optical layer collimates the first light and the second light. The second optical layer is disposed on a light exiting side of the first optical layer, and the second optical layer scatters the first light but does not scatter the second light.

Abstract: An electronic device includes a first body, a second body, two hinges, and at least one electronic assembly. The two hinges are connected between the first body and the second body, and the first body and the second body are adapted to rotate relatively through the two hinges. The electronic assembly is connected to the second body and is located between the two hinges.

Abstract: A display device is provided. The display device includes a display panel. The display panel includes a substrate, a light-shielding layer, and a plurality of optical sensors. The light-shielding layer has a plurality of first aperture regions, a plurality of second aperture regions, and a plurality of third aperture regions. The second aperture regions are located between the first aperture regions and the third aperture regions. At least a portion of at least one of the optical sensors overlaps with at least one of the first aperture regions in a normal direction of the substrate. An area of at least one of the second aperture regions is greater than an area of at least one of the first aperture regions, and the area of the at least one of the second aperture regions is smaller than an area of at least one of the third aperture regions.

Abstract: The present invention discloses a power converter controller having a short-circuit protection threshold voltage no higher than an over-current protection threshold voltage so that any abnormal voltage or current stress on semiconductor components can be timely sensed via a current sense pin in the event of a short-circuit fault, effectively preventing semiconductor components from being damaged.

Abstract: A fingerprint identification method includes partitioning a plurality of readout lines of the electronic device into at least two groups, receiving a signal, determining a finger touch region according to the signal, and simultaneously enabling a portion of readout lines of each group corresponding to the finger touch region of the at least two groups.

Abstract: A semiconductor component burn-in test module includes a burn-in board and an external power transmission component. The burn-in board includes a plurality of burn-in seats, wherein a plurality of chips are disposed on the burn-in seats. The external power transmission component is arranged at opposite two sides of the burn-in board, where the external power transmission component includes a plurality of conductive members and a plurality of terminal seats. The burn-in board is provided with a plurality of wirings corresponding to the external power transmission component. As such, electric power can be conveyed to the plural burn-in seats of the burn-in board, through the plural terminal seats and the plural conductive strips. This decreases the length and the number of copper foil wirings in the burn-in boards for power transmission, so as to lower the cost of the burn-in boards.