Patents by Inventor Kuo Kai HUANG

Kuo Kai HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20220181182
    Abstract: The present disclosure relates to an electronic component. The electronic component includes a first surface, a first functional region, and a non-functional region. The first functional region is disposed on the first surface of the electronic component. The non-functional region is recessed from the first surface of the electronic component.
    Type: Application
    Filed: December 3, 2020
    Publication date: June 9, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jenchun CHEN, Kuo Kai HUANG