Abstract: The present disclosure provides a thin film including a first thermoplastic polyolefin (TPO) elastomer which is anhydride-grafted. The present disclosure further provides a method for manufacturing the thin film, a laminated material and a method for adhesion.

Abstract: A chip bonding process is provided, including following steps of: providing a plurality of microchips, providing a substrate, applying a flux which is pasty, a first placement step, a first hot pressing step, a second placement step, a second hot pressing step and a third hot pressing step. The first and second placement steps are arranging the microchips on the substrate. The first and second hot pressing step is heating the flux to turn into liquid state and cooling the flux to make all of the microchips and the substrate positioned with each other. The third hot pressing step is melting all of the first electrode sets and all of the second electrode sets to connect with each other and cooling the flux to a room temperature.

Abstract: A method for manufacturing packaged LED is provided in the present invention. A vacuum closed space is enclosed by a base plate and a cover plate, and LED chip on the base plate is disposed in the closed space. The cover plate includes a fluorescent layer, and space between the fluorescent layer and the LED chip is vacuum. Thus, heat generated by the LED chip may not affect fluorescent material inside the fluorescent layer so that the package of LED becomes more durable.

Abstract: A method for manufacturing a cover plate and a method for manufacturing an encapsulated LED using the cover plate are disclosed. The cover plate is manufactured by the following steps: mixing uncured acryl and fluorescent powder, defoaming, inject-molding and curing. The cover plate can be used for manufacturing an encapsulated LED, which can avoid or minimize the fluorescent powder being heated or being eroded by moisture, and can keep stability of the fluorescent powder, thereby increasing service life of the encapsulated LED.

Abstract: A method for manufacturing packaged LED is provided in the present invention. A vacuum closed space is enclosed by a base plate and a cover plate, and LED chip on the base plate is disposed in the closed space. The cover plate includes a fluorescent layer, and space between the fluorescent layer and the LED chip is vacuum. Thus, heat generated by the LED chip may not affect fluorescent material inside the fluorescent layer so that the package of LED becomes more durable.