Patents by Inventor Kuo-Kuang Yeh
Kuo-Kuang Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8057064Abstract: A lighting fixture for improving the luminance of a lamp tube includes a curved reflecting plate and a lampshade. The lampshade has partition plates with arc surfaces, side plates with inclined planes and end plates with curved surfaces. The lamp tube is disposed at a longitudinal axis of the curved reflecting plate. The reflecting plate reflects the light emitted from the lamp tube and the light reflected from the partition plates to the environment. The side plates are inclined with a certain angle for guiding light, and the end plates with curved surfaces are used to enhance the reflecting light. Thus, light output efficiency is improved and glare is reduced.Type: GrantFiled: October 11, 2009Date of Patent: November 15, 2011Assignee: Fuyu Electric Co., Ltd.Inventors: Kuo-Kuang Yeh, Tsung-Ming Chen
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Patent number: 7951624Abstract: A method of manufacturing light emitting diode has steps of providing a package base, providing a light emitting structure and bonding the light emitting structure on the package base. The package base has a first metal layer and a second metal layer respectively formed on a top and a bottom thereon. The light emitting structure has a substrate, a light emitting lamination and a reflective metal layer. The light emitting lamination is formed on the substrate and has an n-type semiconductor layer, a light emitting layer, a p-type semiconductor layer and a transparent electrode layer deposited on the substrate in sequence. The reflective metal layer is formed on a bottom of the substrate. The first metal layer is connected to the reflective metal layer by an ultrasonic thermal press technique. Therefore, the thermal resistance of the finished LED reduces.Type: GrantFiled: January 15, 2009Date of Patent: May 31, 2011Assignee: He Shan Lide Electronic Enterprise Company Ltd.Inventors: Ben Fan, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Publication number: 20110097832Abstract: An LED device has a substrate, an N-type semiconductor layer formed on the substrate, a light-emitting layer on the N-type semiconductor layer, a P-type semiconductor layer on the light-emitting layer and a transparent electrode layer formed on the P-type semiconductor layer. A top surface of the transparent electrode layer is formed to have multiple micro concave-convex structures to mitigate the light-emitting loss resulted from total reflection, and increase the light-emitting efficiency of the LED device.Type: ApplicationFiled: January 5, 2011Publication date: April 28, 2011Applicant: He Shan Lide Electronic Enterprise Company Ltd.Inventors: Ben FAN, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Patent number: 7875473Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.Type: GrantFiled: May 7, 2010Date of Patent: January 25, 2011Assignee: He Shan Lide Electronic Enterprise Company Ltd.Inventors: Ben Fan, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Patent number: 7875471Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.Type: GrantFiled: November 3, 2009Date of Patent: January 25, 2011Assignee: He Shan Lide Electronic Enterprise Company Ltd.Inventors: Ben Fan, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Patent number: 7875472Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.Type: GrantFiled: November 9, 2009Date of Patent: January 25, 2011Assignee: He Shan Lide Electronic Enterprise Company Ltd.Inventors: Ben Fan, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Publication number: 20100216265Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.Type: ApplicationFiled: May 7, 2010Publication date: August 26, 2010Applicant: HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD.Inventors: Ben FAN, Hsin-Chuan WENG, Kuo-Kuang YEH
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Publication number: 20100142197Abstract: A lighting fixture for improving luminance of a lamp tube includes a curved reflecting plate and a lampshade. The lampshade has partition plates with arc surfaces, side plates with inclined planes and end plates with curved surfaces. The lamp tube is disposed at a longitudinal axis of the curved reflecting plate. The reflecting plate reflects the light emitted from the lamp tube and the light reflected from the partition plates to the environment. The side plates are inclined with a certain angle for guiding light, and the end plates with curved surfaces are used to enhance the reflecting light. Thus, light output efficiency is improved and glare is reduced.Type: ApplicationFiled: October 11, 2009Publication date: June 10, 2010Inventors: Kuo-Kuang Yeh, Tsung-Ming Chen
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Publication number: 20100055814Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.Type: ApplicationFiled: November 9, 2009Publication date: March 4, 2010Applicant: HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD.Inventors: Ben Fan, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Publication number: 20100047940Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.Type: ApplicationFiled: November 3, 2009Publication date: February 25, 2010Applicant: HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD.Inventors: Ben FAN, Hsin-Chuan WENG, Kuo-Kuang YEH
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Publication number: 20090246899Abstract: A method of manufacturing light emitting diode has steps of providing a package base, providing a light emitting structure and bonding the light emitting structure on the package base. The package base has a first metal layer and a second metal layer respectively formed on a top and a bottom thereon. The light emitting structure has a substrate, a light emitting lamination and a reflective metal layer. The light emitting lamination is formed on the substrate and has an n-type semiconductor layer, a light emitting layer, a p-type semiconductor layer and a transparent electrode layer deposited on the substrate in sequence. The reflective metal layer is formed on a bottom of the substrate. The first metal layer is connected to the reflective metal layer by an ultrasonic thermal press technique. Therefore, the thermal resistance of the finished LED reduces.Type: ApplicationFiled: January 15, 2009Publication date: October 1, 2009Applicant: He Shan Lide ELectronic Enterprise Company Ltd.Inventors: Ben Fan, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Publication number: 20090230407Abstract: An LED device has a substrate, an N-type semiconductor layer formed on the substrate, a light-emitting layer on the N-type semiconductor layer, a P-type semiconductor layer on the light-emitting layer and a transparent electrode layer formed on the P-type semiconductor layer. A top surface of the transparent electrode layer is formed to have multiple micro concave-convex structures to mitigate the light-emitting loss resulted from total reflection, and increase the light-emitting efficiency of the LED device.Type: ApplicationFiled: January 15, 2009Publication date: September 17, 2009Applicant: He Shan Lide Electronic Enterprise Company Ltd.Inventors: Ben FAN, Hsin-Chuan Weng, Kuo-Kuang Yeh
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Publication number: 20090215210Abstract: A method of manufacturing light-emitting diode device has steps of isolating a light-emitting side of an LED chip from a wire-bonding region by disposing partition panels on the wire-bonding region and coating phosphors on the light-emitting side of the LED chip in a phosphor-coating process. The method can be applied to manufacturing LED device having a flip chip structure or a vertical chip structure. According to the method, a white LED device can be directly manufactured without adopting a phosphor package technique, and thereby a whole package process of the white LED device is simplified.Type: ApplicationFiled: January 9, 2009Publication date: August 27, 2009Applicant: HE SHAN LIDE ELECTRONIC ENTERPRISE COMPANY LTD.Inventors: Ben FAN, Hsin-Chuan WENG, Kuo-Kuang YEH
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Publication number: 20090184337Abstract: A light-emitting diode includes a sapphire substrate, an n-type semiconductor, a light-emitting layer, a p-type semiconductor layer, an anode and a conductive material. The n-type semiconductor layer is formed on the sapphire substrate and has a side surface, a center section and an edge around the center portion. The light-emitting layer is formed on the n-type semiconductor layer. The p-type semiconductor layer is formed on the light-emitting layer. The anode is formed on the p-type semiconductor layer. The conductive material is formed on the bottom surface of the sapphire substrate and is in contact with the n-type semiconductor layer.Type: ApplicationFiled: January 9, 2009Publication date: July 23, 2009Inventors: Ben Fan, Hsin-Chuan Weng, Kuo-Kuang Yeh