Abstract: An image capturing module including a light emitting element, a sensing element, a first circuit substrate, a second circuit substrate, and a third circuit substrate is provided. The first circuit substrate is located between the second circuit substrate and the third circuit substrate and includes a first substrate having a first and a second through holes. The light emitting element is mounted on the third circuit substrate and disposed in the first through hole. The sensing element is disposed in the second through hole. The second circuit substrate includes a second substrate having a third and a fourth through holes. The third through hole exposes a light emitting surface of the light emitting element disposed in the first through hole. The fourth through hole exposes a sensing surface of the sensing element disposed in the second through hole. A manufacturing method of the image capturing module is also provided.

Abstract: An image capturing apparatus including a substrate, a light source, a sensor, a light shielding element, a first reflective element, and a transparent colloid curing layer is provided. The light source, the sensor, the light shielding element, the first reflective element, and the transparent colloid curing layer are disposed on the substrate. The sensor is located next to the light source. The light shielding element is located between the light source and the sensor. The first reflective element is located between the light shielding element and the sensor. The transparent colloid curing layer covers the light source, the sensor, the light shielding element, and the first reflective element. A manufacturing method of the image capturing apparatus is also provided.

Abstract: A bio-sensing apparatus is used to sense a biopolymer. The bio-sensing apparatus includes a sensing element, a light-transmitting element and a surface plasma resonance layer. The bio-sensing apparatus is disposed on the sensing element. The surface plasma resonance layer is disposed on the light-transmitting element, and is used to receive the biopolymer. The light-transmitting element is disposed between the surface plasma resonance layer and the sensing element.

Abstract: A bio-sensing apparatus is used to sense a biopolymer. The bio-sensing apparatus includes a sensing element, a light-transmitting element and a surface plasma resonance layer. The bio-sensing apparatus is disposed on the sensing element. The surface plasma resonance layer is disposed on the light-transmitting element, and is used to receive the biopolymer. The light-transmitting element is disposed between the surface plasma resonance layer and the sensing element.

Abstract: An image capturing module including a light emitting element, a sensing element, a first circuit substrate, a second circuit substrate, and a third circuit substrate is provided. The first circuit substrate is located between the second circuit substrate and the third circuit substrate and includes a first substrate having a first and a second through holes. The light emitting element is mounted on the third circuit substrate and disposed in the first through hole. The sensing element is disposed in the second through hole. The second circuit substrate includes a second substrate having a third and a fourth through holes. The third through hole exposes a light emitting surface of the light emitting element disposed in the first through hole. The fourth through hole exposes a sensing surface of the sensing element disposed in the second through hole. A manufacturing method of the image capturing module is also provided.

Abstract: An image capturing module including a light emitting element, a sensing element, and a circuit substrate is provided. The circuit substrate includes a substrate, a plurality of conductive plugs, a first wiring layer, and a second wiring layer. The substrate has a first through hole, a second through hole, and a plurality of third through holes. The light emitting element is disposed in the first through hole. The sensing element is disposed in the second through hole. The conductive plugs are disposed in the third through holes. The first wiring layer is disposed on a first surface of the substrate. The second wiring layer is disposed on a second surface of the substrate opposite to the first surface. The second wiring layer is electrically connected to the first wiring layer through the conductive plugs. A manufacturing method of the image capturing module is also provided.

Abstract: An image capturing module including a light emitting element, a sensing element, a first circuit substrate, and a second circuit substrate is provided. The first circuit substrate includes a first substrate having a first through hole and a second through hole. The light emitting element is disposed in the first through hole. The sensing element is disposed in the second through hole. The second circuit substrate is disposed on a side of the first circuit substrate and includes a second substrate having a third through hole and a fourth through hole. The third through hole exposes a light emitting surface of the light emitting element disposed in the first through hole. The fourth through hole exposes a sensing surface of the sensing element disposed in the second through hole. A manufacturing method of the image capturing module is also provided.

Abstract: An image capturing module including a substrate, a plurality of light emitting devices, a sensor, and a transparent colloid curing layer is provided. The light emitting devices and the sensor are disposed on the substrate and are respectively electrically connected to the substrate. The transparent colloid curing layer is disposed on the substrate and covers the sensor and the light emitting devices. At least one trench is provided at a side of the transparent colloid curing layer opposite to the sensor. The at least one trench is located between the sensor and the light emitting devices, and a depth of the at least one trench is less than a thickness of the transparent colloid curing layer. An electrical apparatus is also provided.

Abstract: An image capturing module including a substrate, a plurality of light emitting devices, a sensor, and a transparent colloid curing layer is provided. The light emitting devices and the sensor are disposed on the substrate and are respectively electrically connected to the substrate. The transparent colloid curing layer is disposed on the substrate and covers the sensor and the light emitting devices. At least one trench is provided at a side of the transparent colloid curing layer opposite to the sensor. The at least one trench is located between the sensor and the light emitting devices, and a depth of the at least one trench is less than a thickness of the transparent colloid curing layer. An electrical apparatus is also provided.

Abstract: An image capturing apparatus including a substrate, a light source, a sensor, a light shielding element, a first reflective element, and a transparent colloid curing layer is provided. The light source, the sensor, the light shielding element, the first reflective element, and the transparent colloid curing layer are disposed on the substrate. The sensor is located next to the light source. The light shielding element is located between the light source and the sensor. The first reflective element is located between the light shielding element and the sensor. The transparent colloid curing layer covers the light source, the sensor, the light shielding element, and the first reflective element. A manufacturing method of the image capturing apparatus is also provided.

Abstract: An image sensing module includes a circuit board, an image sensor mounted on and coupled electrically to the circuit board, an optical lens unit mounted on the circuit board and operably associated with the image sensor such that the image sensor acquires an object image through the optical lens unit and generates an electrical output corresponding to the object image, and an electrical connector mounted on the circuit board and having an input port coupled electrically to the circuit board so as to receive the electrical output of the image sensor, and an output port adapted to be coupled electrically to a ribbon cable.