Patents by Inventor Kuo-Liang You

Kuo-Liang You has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10734435
    Abstract: An image capturing module including a light emitting element, a sensing element, a first circuit substrate, a second circuit substrate, and a third circuit substrate is provided. The first circuit substrate is located between the second circuit substrate and the third circuit substrate and includes a first substrate having a first and a second through holes. The light emitting element is mounted on the third circuit substrate and disposed in the first through hole. The sensing element is disposed in the second through hole. The second circuit substrate includes a second substrate having a third and a fourth through holes. The third through hole exposes a light emitting surface of the light emitting element disposed in the first through hole. The fourth through hole exposes a sensing surface of the sensing element disposed in the second through hole. A manufacturing method of the image capturing module is also provided.
    Type: Grant
    Filed: February 5, 2018
    Date of Patent: August 4, 2020
    Assignee: Gingy Technology Inc.
    Inventor: Kuo-Liang You
  • Patent number: 10713521
    Abstract: An image capturing apparatus including a substrate, a light source, a sensor, a light shielding element, a first reflective element, and a transparent colloid curing layer is provided. The light source, the sensor, the light shielding element, the first reflective element, and the transparent colloid curing layer are disposed on the substrate. The sensor is located next to the light source. The light shielding element is located between the light source and the sensor. The first reflective element is located between the light shielding element and the sensor. The transparent colloid curing layer covers the light source, the sensor, the light shielding element, and the first reflective element. A manufacturing method of the image capturing apparatus is also provided.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: July 14, 2020
    Assignee: Gingy Technology Inc.
    Inventors: Kuo-Liang You, Kuo-Wen Yang, Cheng-Jyun Huang, Yu-Cheng Chiu, Hao-Hsiang Chang, Chih-Chiang Yu
  • Patent number: 10460188
    Abstract: A bio-sensing apparatus is used to sense a biopolymer. The bio-sensing apparatus includes a sensing element, a light-transmitting element and a surface plasma resonance layer. The bio-sensing apparatus is disposed on the sensing element. The surface plasma resonance layer is disposed on the light-transmitting element, and is used to receive the biopolymer. The light-transmitting element is disposed between the surface plasma resonance layer and the sensing element.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: October 29, 2019
    Assignee: Gingy Technology Inc.
    Inventors: Jen-Chieh Wu, Chuck Chung, Patrick Lin, Cheng-Jyun Huang, Kuo-Liang You
  • Publication number: 20180373945
    Abstract: A bio-sensing apparatus is used to sense a biopolymer. The bio-sensing apparatus includes a sensing element, a light-transmitting element and a surface plasma resonance layer. The bio-sensing apparatus is disposed on the sensing element. The surface plasma resonance layer is disposed on the light-transmitting element, and is used to receive the biopolymer. The light-transmitting element is disposed between the surface plasma resonance layer and the sensing element.
    Type: Application
    Filed: June 14, 2018
    Publication date: December 27, 2018
    Applicant: Gingy Technology Inc.
    Inventors: Jen-Chieh Wu, Chuck Chung, Patrick Lin, Cheng-Jyun Huang, Kuo-Liang You
  • Publication number: 20180301500
    Abstract: An image capturing module including a light emitting element, a sensing element, a first circuit substrate, a second circuit substrate, and a third circuit substrate is provided. The first circuit substrate is located between the second circuit substrate and the third circuit substrate and includes a first substrate having a first and a second through holes. The light emitting element is mounted on the third circuit substrate and disposed in the first through hole. The sensing element is disposed in the second through hole. The second circuit substrate includes a second substrate having a third and a fourth through holes. The third through hole exposes a light emitting surface of the light emitting element disposed in the first through hole. The fourth through hole exposes a sensing surface of the sensing element disposed in the second through hole. A manufacturing method of the image capturing module is also provided.
    Type: Application
    Filed: February 5, 2018
    Publication date: October 18, 2018
    Applicant: Gingy Technology Inc.
    Inventor: Kuo-Liang You
  • Publication number: 20180301588
    Abstract: An image capturing module including a light emitting element, a sensing element, and a circuit substrate is provided. The circuit substrate includes a substrate, a plurality of conductive plugs, a first wiring layer, and a second wiring layer. The substrate has a first through hole, a second through hole, and a plurality of third through holes. The light emitting element is disposed in the first through hole. The sensing element is disposed in the second through hole. The conductive plugs are disposed in the third through holes. The first wiring layer is disposed on a first surface of the substrate. The second wiring layer is disposed on a second surface of the substrate opposite to the first surface. The second wiring layer is electrically connected to the first wiring layer through the conductive plugs. A manufacturing method of the image capturing module is also provided.
    Type: Application
    Filed: February 8, 2018
    Publication date: October 18, 2018
    Applicant: Gingy Technology Inc.
    Inventor: Kuo-Liang You
  • Publication number: 20180300524
    Abstract: An image capturing module including a light emitting element, a sensing element, a first circuit substrate, and a second circuit substrate is provided. The first circuit substrate includes a first substrate having a first through hole and a second through hole. The light emitting element is disposed in the first through hole. The sensing element is disposed in the second through hole. The second circuit substrate is disposed on a side of the first circuit substrate and includes a second substrate having a third through hole and a fourth through hole. The third through hole exposes a light emitting surface of the light emitting element disposed in the first through hole. The fourth through hole exposes a sensing surface of the sensing element disposed in the second through hole. A manufacturing method of the image capturing module is also provided.
    Type: Application
    Filed: December 14, 2017
    Publication date: October 18, 2018
    Applicant: Gingy Technology Inc.
    Inventor: Kuo-Liang You
  • Patent number: 10043847
    Abstract: An image capturing module including a substrate, a plurality of light emitting devices, a sensor, and a transparent colloid curing layer is provided. The light emitting devices and the sensor are disposed on the substrate and are respectively electrically connected to the substrate. The transparent colloid curing layer is disposed on the substrate and covers the sensor and the light emitting devices. At least one trench is provided at a side of the transparent colloid curing layer opposite to the sensor. The at least one trench is located between the sensor and the light emitting devices, and a depth of the at least one trench is less than a thickness of the transparent colloid curing layer. An electrical apparatus is also provided.
    Type: Grant
    Filed: September 24, 2017
    Date of Patent: August 7, 2018
    Assignee: Gingy Technology Inc.
    Inventors: Kuo-Liang You, Jen-Chieh Wu
  • Publication number: 20180075283
    Abstract: An image capturing module including a substrate, a plurality of light emitting devices, a sensor, and a transparent colloid curing layer is provided. The light emitting devices and the sensor are disposed on the substrate and are respectively electrically connected to the substrate. The transparent colloid curing layer is disposed on the substrate and covers the sensor and the light emitting devices. At least one trench is provided at a side of the transparent colloid curing layer opposite to the sensor. The at least one trench is located between the sensor and the light emitting devices, and a depth of the at least one trench is less than a thickness of the transparent colloid curing layer. An electrical apparatus is also provided.
    Type: Application
    Filed: September 24, 2017
    Publication date: March 15, 2018
    Applicant: Gingy Technology Inc.
    Inventors: Kuo-Liang You, Jen-Chieh Wu
  • Publication number: 20180039849
    Abstract: An image capturing apparatus including a substrate, a light source, a sensor, a light shielding element, a first reflective element, and a transparent colloid curing layer is provided. The light source, the sensor, the light shielding element, the first reflective element, and the transparent colloid curing layer are disposed on the substrate. The sensor is located next to the light source. The light shielding element is located between the light source and the sensor. The first reflective element is located between the light shielding element and the sensor. The transparent colloid curing layer covers the light source, the sensor, the light shielding element, and the first reflective element. A manufacturing method of the image capturing apparatus is also provided.
    Type: Application
    Filed: September 29, 2017
    Publication date: February 8, 2018
    Applicant: Gingy Technology Inc.
    Inventors: Kuo-Liang You, Kuo-Wen Yang, Cheng-Jyun Huang, Yu-Cheng Chiu, Hao-Hsiang Chang, Chih-Chiang Yu
  • Publication number: 20040233319
    Abstract: An image sensing module includes a circuit board, an image sensor mounted on and coupled electrically to the circuit board, an optical lens unit mounted on the circuit board and operably associated with the image sensor such that the image sensor acquires an object image through the optical lens unit and generates an electrical output corresponding to the object image, and an electrical connector mounted on the circuit board and having an input port coupled electrically to the circuit board so as to receive the electrical output of the image sensor, and an output port adapted to be coupled electrically to a ribbon cable.
    Type: Application
    Filed: November 7, 2003
    Publication date: November 25, 2004
    Inventors: Kuo-Liang You, Yo-Chih Huang