Abstract: The present disclosure describes a method for memory cell placement. The method can include placing a memory cell region in a layout area and placing a well pick-up region and a first power supply routing region along a first side of the memory cell region. The method also includes placing a second power supply routing region and a bitline jumper routing region along a second side of the memory cell region, where the second side is on an opposite side to that of the first side. The method further includes placing a device region along the second side of the memory cell region, where the bitline jumper routing region is between the second power supply routing region and the device region.

Abstract: An edge connector includes a shell having two symmetrical rows of vertical slots. Each of the vertical slots is formed of an upper space and a lower space linked together to hold a metal contact spring plate and a conductor clamp. The metal contact spring plate includes a bent portion in the middle and disposed between the upper and lower spaces, a projecting strip stopped above the lower space, a curved clamping portion at one end received in the upper space for making an electric contact with an external connector, a wedge portion at an opposite end vertically received in the lower space and terminating in a sloping tail. The conductor clamp has a first bent portion and a second bent portion stopped within the lower space at two opposite locations, a rear end disposed over a front end thereof and stopped against the wedge portion of the metal contact spring plate for clamping a conductor against the metal contact spring plate.