Patents by Inventor Kuo-Lung Lee

Kuo-Lung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11580944
    Abstract: A method for adjusting accompaniment music is disclosed. The method transposes the musical key of at least one section of the accompaniment music such that a song will have different musical key transpositions for different sections of the accompaniment music, so that singers whose vocal ranges are narrow can sing songs after the adjustment.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: February 14, 2023
    Inventors: Hsuan-Yu Chen, Chun-Lung Chen, I-Ting Lee, Kuan-Li Chao, Kuo-Wei Kao, Neo Bob Chih-Yung Young, Kuo-Ping Yang
  • Patent number: 11538735
    Abstract: In an embodiment, a device includes: a package component including integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure; a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets; a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; and bolts extending through the thermal module, the mechanical brace, and the package component.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: December 27, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Shu-Rong Chun, Kuo Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu
  • Patent number: 11505663
    Abstract: A method for making a silk protein film includes providing an aqueous solution of a silk protein, and annealing a mixture including the aqueous solution of the silk protein and a water-soluble polyhydroxy compound that is present in an amount ranging from 20 wt % to 60 wt % based on a total amount of the silk protein and the water-soluble polyhydroxy compound at an annealing temperature that is higher than 50° C. and lower than 180° C. and under a relative humidity of not higher than 30%, so as to form the silk protein film.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: November 22, 2022
    Assignees: Southern Taiwan University of Science and Technology, Taiwan Pioneer Biotech Co., Ltd., Univacco Technology Inc.
    Inventors: Song-Tay Lee, Nan-Kai Lin, Kuo-Lung Tsai
  • Patent number: 11502013
    Abstract: In an embodiment, a device includes: a package component including: integrated circuit dies; an encapsulant around the integrated circuit dies; a redistribution structure over the encapsulant and the integrated circuit dies, the redistribution structure being electrically coupled to the integrated circuit dies; sockets over the redistribution structure, the sockets being electrically coupled to the redistribution structure; and a support ring over the redistribution structure and surrounding the sockets, the support ring being disposed along outermost edges of the redistribution structure, the support ring at least partially laterally overlapping the redistribution structure.
    Type: Grant
    Filed: May 10, 2021
    Date of Patent: November 15, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shu-Rong Chun, Kuo Lung Pan, Tin-Hao Kuo, Hao-Yi Tsai, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Po-Yuan Teng, Chen-Hua Yu
  • Publication number: 20220359343
    Abstract: A package structure includes a bottom plate, a semiconductor package, a top plate, a screw and an anti-loosening coating. The semiconductor package is disposed over the bottom plate. The top plate is disposed over the semiconductor package, and includes an internal thread in a screw hole of the top plate. The screw penetrates through the bottom plate, the semiconductor package and the top plate, and includes an external thread. The external thread of the screw is engaged to the internal thread of the top plate, and the anti-loosening coating is adhered between the external thread and the internal thread.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 10, 2022
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai, Chien-Ling Hwang, Kuo-Lung Pan, Pei-Hsuan Lee, Tin-Hao Kuo, Chih-Hsuan Tai
  • Publication number: 20220359344
    Abstract: In an embodiment, a device includes: a package component including integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure; a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets; a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; and bolts extending through the thermal module, the mechanical brace, and the package component.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 10, 2022
    Inventors: Shu-Rong Chun, Kuo-Lung Pan, Pei-Hsuan Lee, Chien Ling Hwang, Yu-Chia Lai, Tin-Hao Kuo, Hao-Yi Tsai, Chen-Hua Yu
  • Patent number: 11495632
    Abstract: A semiconductor image sensor includes a substrate having a first side and a second side that is opposite the first side. An interconnect structure is disposed over the first side of the substrate. A plurality of radiation-sensing regions is located in the substrate. The radiation-sensing regions are configured to sense radiation that enters the substrate from the second side. A plurality of isolation structures are each disposed between two respective radiation-sensing regions. The isolation structures protrude out of the second side of the substrate.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: November 8, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kuo-Cheng Lee, Yun-Wei Cheng, Yung-Lung Hsu, Hsin-Chi Chen
  • Patent number: 11444002
    Abstract: A package structure includes a bottom plate, a semiconductor package, a top plate, a screw and an anti-loosening coating. The semiconductor package is disposed over the bottom plate. The top plate is disposed over the semiconductor package, and includes an internal thread in a screw hole of the top plate. The screw penetrates through the bottom plate, the semiconductor package and the top plate, and includes an external thread. The external thread of the screw is engaged to the internal thread of the top plate, and the anti-loosening coating is adhered between the external thread and the internal thread.
    Type: Grant
    Filed: July 29, 2020
    Date of Patent: September 13, 2022
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yu-Chia Lai, Chen-Hua Yu, Chung-Shi Liu, Hsiao-Chung Liang, Hao-Yi Tsai, Chien-Ling Hwang, Kuo-Lung Pan, Pei-Hsuan Lee, Tin-Hao Kuo, Chih-Hsuan Tai
  • Patent number: 11404025
    Abstract: A video processing system includes an input port and a video processing circuit. The input port obtains device information of a display panel. The video processing circuit obtains an input frame and the device information, configures an image enhancement operation according to the device information, generates an output frame by performing the image enhancement operation upon the input frame, and transmits the output frame to the display panel for video playback.
    Type: Grant
    Filed: March 15, 2020
    Date of Patent: August 2, 2022
    Assignee: MEDIATEK INC.
    Inventors: Cheng-Lung Jen, Pei-Kuei Tsung, Chih-Wen Goo, Yu-Cheng Tseng, Yu-Lin Hou, Kuo-Chiang Lo, Chia-Da Lee, Tung-Chien Chen
  • Patent number: 10871909
    Abstract: A block management method, a memory control circuit unit and a memory storage apparatus for managing a plurality of physical blocks are provided. The method includes writing test data to a first physical block among the plurality of physical blocks, reading the test data from the first physical block among the plurality of physical blocks to obtain a plurality of parameters corresponding to the first physical block; grouping the first physical block into a first block group or a second block group according to the plurality of parameters corresponding to the first physical block and a rule between the plurality of parameters and grouping of the plurality of physical blocks; establishing first and second block mapping tables; and mapping logical addresses of the first and second block mapping tables to the plurality of physical blocks belonging to the first and second block groups.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: December 22, 2020
    Assignee: PHISON ELECTRONICS CORP.
    Inventors: Siu-Tung Lam, Ming-Yen Lee, Kuo-Lung Lee
  • Publication number: 20190278480
    Abstract: A block management method, a memory control circuit unit and a memory storage apparatus for managing a plurality of physical blocks are provided. The method includes reading user data from a first physical block among physical blocks to obtain a plurality of parameters; inputting the parameters corresponding to the first physical block into a machine learning based block recognizer to group the first physical block into a first block group or a second block group according to an output result of the machine learning based block recognizer; establishing a first and second block mapping tables; mapping logical addresses of the first and second block mapping tables to the physical blocks belonging to the first and second block groups. The parameters may comprise at least one of a read busy time parameter, an error bit position parameter and a storage retention parameter. A machine learning operation may be performed using first and second test physical blocks, and corresponding parameters, as training data.
    Type: Application
    Filed: April 19, 2018
    Publication date: September 12, 2019
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Siu-Tung Lam, Ming-Yen Lee, Kuo-Lung Lee
  • Patent number: 8902671
    Abstract: A method for programming data is provided for a memory storage device having a rewritable non-volatile memory module and a buffer memory. The method includes receiving a plurality of data including a first-type data and at least one second-type data, and a size of the first-type data is smaller than a data size threshold. The method includes temporarily storing the plurality of data into the buffer memory, and programming the first-type data and at least one part of the at least one second-type data stored in the buffer memory into a physical program unit set if it is determined that the plurality of data are complied with a predetermined condition. The method includes obtaining writing statuses of the first-type data and the at least one part of the at least one second-type data at the same time.
    Type: Grant
    Filed: March 6, 2013
    Date of Patent: December 2, 2014
    Assignee: Phison Electronics Corp.
    Inventors: Hong-Lipp Ko, Kuo-Lung Lee, Teng-Chun Hsu
  • Publication number: 20140140142
    Abstract: A method for programming data is provided for a memory storage device having a rewritable non-volatile memory module and a buffer memory. The method includes receiving a plurality of data including a first-type data and at least one second-type data, and a size of the first-type data is smaller than a data size threshold. The method includes temporarily storing the plurality of data into the buffer memory, and programming the first-type data and at least one part of the at least one second-type data stored in the buffer memory into a physical program unit set if it is determined that the plurality of data are complied with a predetermined condition. The method includes obtaining writing statuses of the first-type data and the at least one part of the at least one second-type data at the same time.
    Type: Application
    Filed: March 6, 2013
    Publication date: May 22, 2014
    Applicant: PHISON ELECTRONICS CORP.
    Inventors: Hong-Lipp Ko, Kuo-Lung Lee, Teng-Chun Hsu
  • Patent number: 6736760
    Abstract: A footplate for use in a treadmill is disclosed having a plurality of mounting holes in a longitudinal top channel thereof for the mounting of fastening elements to fixedly secure the footplate to one longitudinal side rail of the treadmill, keeping the planar bottom wall of the footplate closely supported on the flat top surface of the longitudinal side rail of the treadmill.
    Type: Grant
    Filed: March 26, 2003
    Date of Patent: May 18, 2004
    Inventor: Kuo-Lung Lee
  • Publication number: 20020183168
    Abstract: An improved crank structure for treadmills, each of the treadmills has two pedals for a user to step, the pedals respectively connect on one of their ends with the periphery of a rotary wheel, and are linked with cranks respectively on the front and the rear sides of the rotary wheel, the cranks are connected on their internal end portions with the center of the rotary wheel, the cranks are provided each with a first section which has an included angle with the vertical diametric line of the rotary wheel, at the tailing end of the first section, there is a bent section for connecting with the center of the rotary wheel. A user using such a treadmill needs only to exert a small force at the uppermost position of the rotary wheel for stepping; this can prevent probable damage of exercising.
    Type: Application
    Filed: May 31, 2001
    Publication date: December 5, 2002
    Inventor: Kuo Lung Lee
  • Patent number: D459421
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: June 25, 2002
    Inventor: Kuo-Lung Lee
  • Patent number: D459774
    Type: Grant
    Filed: June 19, 2001
    Date of Patent: July 2, 2002
    Inventor: Kuo-Lung Lee
  • Patent number: D459776
    Type: Grant
    Filed: May 8, 2001
    Date of Patent: July 2, 2002
    Inventor: Kuo-Lung Lee
  • Patent number: D475424
    Type: Grant
    Filed: May 15, 2002
    Date of Patent: June 3, 2003
    Inventor: Kuo-Lung Lee
  • Patent number: D480121
    Type: Grant
    Filed: June 3, 2002
    Date of Patent: September 30, 2003
    Inventor: Kuo-Lung Lee