Patents by Inventor Kuo-Lung Li

Kuo-Lung Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210134979
    Abstract: A method for fabricating gate structures includes providing a substrate, configured to have a first region and a second region. Dummy gate structures are formed on the substrate at the first and second regions, wherein each of the dummy gate structures has a first gate insulating layer on the substrate and a dummy gate on the first gate insulating layer. An inter-layer dielectric layer is formed over the dummy gate structures. The inter-layer dielectric layer is polished to expose all of the dummy gates. The dummy gates are removed. The first gate insulating layer at the second region is removed. A second gate insulating layer is formed on the substrate at the second region, wherein the first gate insulating layer is thicker than the second insulating layer. Metal gates are formed on the first and the second insulating layer.
    Type: Application
    Filed: October 31, 2019
    Publication date: May 6, 2021
    Applicant: United Microelectronics Corp.
    Inventors: Chih-Hao Pan, Chi-Cheng Huang, Kuo-Lung Li, Szu-Ping Wang, Po-Hsuan Chen, Chao-Sheng Cheng
  • Patent number: 10720440
    Abstract: A method for fabricating a semiconductor structure is shown. A first gate of a first device and a second gate of a second device are formed over a semiconductor substrate. First LDD regions are formed in the substrate beside the first gate using the first gate as a mask. A conformal layer is formed covering the first gate, the second gate and the substrate, wherein the conformal layer has sidewall portions on sidewalls of the second gate. Second LDD regions are formed in the substrate beside the second gate using the second gate and the sidewall portions of the conformal layer as a mask.
    Type: Grant
    Filed: March 21, 2018
    Date of Patent: July 21, 2020
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Chia-Wen Wang, Hsiang-Chen Lee, Wen-Peng Hsu, Kuo-Lung Li, Meng-Chun Chen, Zi-Jun Liu, Ping-Chia Shih
  • Patent number: 10580780
    Abstract: Provided is a semiconductor structure including a substrate, an isolation structure, a fuse and two gate electrodes. The isolation structure is located in the substrate and defines active regions of the substrate. The fuse is disposed on the isolation structure. The gate electrodes are disposed on the active regions and connected to ends of the fuse. In an embodiment, a portion of a bottom surface of the fuse is lower than top surfaces of the active regions of the substrate.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: March 3, 2020
    Assignee: United Microelectronics Corp.
    Inventors: Zi-Jun Liu, Ping-Chia Shih, Chi-Cheng Huang, Kuo-Lung Li, Hung-Wei Lin, An-Hsiu Cheng, Chih-Hao Pan, Cheng-Hua Chou, Chih-Hung Wang
  • Publication number: 20190378846
    Abstract: Provided is a semiconductor structure including a substrate, an isolation structure, a fuse and two gate electrodes. The isolation structure is located in the substrate and defines active regions of the substrate. The fuse is disposed on the isolation structure. The gate electrodes are disposed on the active regions and connected to ends of the fuse. In an embodiment, a portion of a bottom surface of the fuse is lower than top surfaces of the active regions of the substrate.
    Type: Application
    Filed: June 11, 2018
    Publication date: December 12, 2019
    Applicant: United Microelectronics Corp.
    Inventors: Zi-Jun Liu, Ping-Chia Shih, Chi-Cheng Huang, Kuo-Lung Li, Hung-Wei Lin, An-Hsiu Cheng, Chih-Hao Pan, Cheng-Hua Chou, Chih-Hung Wang
  • Patent number: 10409748
    Abstract: A bridge device includes a first physical layer circuit, a first buffer memory, a DMA controller, and a processor. The first physical layer circuit is configured to connect to an upstream device. The first buffer memory is configured to store a first data and transfer data to the upstream device via the first physical layer circuit. The DMA controller is coupled to the first buffer memory and configured to access the first data in the first buffer memory to read and/or write a storage device correspondingly. The processor is coupled to the first buffer memory and the DMA controller. When the bridge device receives a clear feature command from the upstream device, the processor is configured to reset the first buffer memory and the DMA controller to stop the data transferring between the upstream device and the bridge device.
    Type: Grant
    Filed: July 4, 2018
    Date of Patent: September 10, 2019
    Assignee: ASMEDIA TECHNOLOGY INC.
    Inventor: Kuo-Lung Li
  • Patent number: 10340282
    Abstract: A semiconductor memory device includes a substrate, having a plurality of cell regions, wherein the cell regions are parallel and extending along a first direction. A plurality of STI structures is disposed in the substrate, extending along the first direction to isolate the cell regions, wherein the STI structures have a uniform height lower than the substrate in the cell regions. A selection gate line is extending along a second direction and crossing over the cell regions and the STI structures. A control gate line is adjacent to the selection gate line in parallel extending along the second direction and also crosses over the cell regions and the STI structures. The selection gate line and the control gate line together form a two-transistor (2T) memory cell.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: July 2, 2019
    Assignee: United Microelectronics Corp.
    Inventors: Shu-Hung Yu, Chun-Hung Cheng, Chuan-Fu Wang, An-Hsiu Cheng, Ping-Chia Shih, Chi-Cheng Huang, Kuo-Lung Li, Chia-Hui Huang, Chih-Yao Wang, Zi-Jun Liu, Chih-Hao Pan
  • Publication number: 20190108151
    Abstract: A bridge device includes a first physical layer circuit, a first buffer memory, a DMA controller, and a processor. The first physical layer circuit is configured to connect to an upstream device. The first buffer memory is configured to store a first data and transfer data to the upstream device via the first physical layer circuit. The DMA controller is coupled to the first buffer memory and configured to access the first data in the first buffer memory to read and/or write a storage device correspondingly. The processor is coupled to the first buffer memory and the DMA controller. When the bridge device receives a clear feature command from the upstream device, the processor is configured to reset the first buffer memory and the DMA controller to stop the data transferring between the upstream device and the bridge device.
    Type: Application
    Filed: July 4, 2018
    Publication date: April 11, 2019
    Inventor: Kuo-Lung LI
  • Publication number: 20190043877
    Abstract: A non-volatile memory device includes a semiconductor substrate, a control gate electrode, a first oxide-nitride-oxide (ONO) structure, a selecting gate electrode, a second ONO structure, and a spacer structure. The control gate electrode and the selecting gate electrode are disposed on the semiconductor substrate. The first ONO structure is disposed between the control gate electrode and the semiconductor substrate. The second ONO structure is disposed between the control gate electrode and the selecting gate electrode in a first direction. The spacer structure is disposed between the control gate electrode and the second ONO structure in the first direction. A distance between the control gate electrode and the selecting gate electrode in the first direction is smaller than or equal to a sum of a width of the second ONO structure and a width of the spacer structure in the first direction.
    Type: Application
    Filed: August 1, 2017
    Publication date: February 7, 2019
    Inventors: Kuo-Lung Li, Ping-Chia Shih, Wen-Peng Hsu, Chia-Wen Wang, Meng-Chun Chen, Chih-Hao Pan
  • Patent number: 10199385
    Abstract: A non-volatile memory device includes a semiconductor substrate, a control gate electrode, a first oxide-nitride-oxide (ONO) structure, a selecting gate electrode, a second ONO structure, and a spacer structure. The control gate electrode and the selecting gate electrode are disposed on the semiconductor substrate. The first ONO structure is disposed between the control gate electrode and the semiconductor substrate. The second ONO structure is disposed between the control gate electrode and the selecting gate electrode in a first direction. The spacer structure is disposed between the control gate electrode and the second ONO structure in the first direction. A distance between the control gate electrode and the selecting gate electrode in the first direction is smaller than or equal to a sum of a width of the second ONO structure and a width of the spacer structure in the first direction.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: February 5, 2019
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Kuo-Lung Li, Ping-Chia Shih, Wen-Peng Hsu, Chia-Wen Wang, Meng-Chun Chen, Chih-Hao Pan
  • Patent number: 10170429
    Abstract: Package structures and methods for forming the same are provided. A package structure includes a package component including a first bump. The package structure also includes an intermetallic compound (IMC) on the first bump. The package structure further includes an integrated circuit die including a second bump on the IMC. The integrated circuit die and the package component are bonded together through the first bump and the second bump. The IMC extends from the first bump to the second bump to provide good physical and electrical connections between the first bump and the second bump.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: January 1, 2019
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Heng-Chi Huang, Chien-Chen Li, Kuo-Lung Li, Cheng-Liang Cho, Che-Jung Chu, Kuo-Chio Liu
  • Publication number: 20180211966
    Abstract: A method for fabricating a semiconductor structure is shown. A first gate of a first device and a second gate of a second device are formed over a semiconductor substrate. First LDD regions are formed in the substrate beside the first gate using the first gate as a mask. A conformal layer is formed covering the first gate, the second gate and the substrate, wherein the conformal layer has sidewall portions on sidewalls of the second gate. Second LDD regions are formed in the substrate beside the second gate using the second gate and the sidewall portions of the conformal layer as a mask.
    Type: Application
    Filed: March 21, 2018
    Publication date: July 26, 2018
    Applicant: United Microelectronics Corp.
    Inventors: Chia-Wen Wang, Hsiang-Chen Lee, Wen-Peng Hsu, Kuo-Lung Li, Meng-Chun Chen, Zi-Jun Liu, Ping-Chia Shih
  • Publication number: 20180151537
    Abstract: Package structures and methods for forming the same are provided. A package structure includes a package component including a first bump. The package structure also includes an intermetallic compound (IMC) on the first bump. The package structure further includes an integrated circuit die including a second bump on the IMC. The integrated circuit die and the package component are bonded together through the first bump and the second bump. The IMC extends from the first bump to the second bump to provide good physical and electrical connections between the first bump and the second bump.
    Type: Application
    Filed: February 14, 2017
    Publication date: May 31, 2018
    Inventors: Heng-Chi HUANG, Chien-Chen LI, Kuo-Lung LI, Cheng-Liang CHO, Che-Jung CHU, Kuo-Chio LIU
  • Patent number: 9966382
    Abstract: A method for fabricating a semiconductor structure is shown. A first gate of a first device and a second gate of a second device are formed over a semiconductor substrate. First LDD regions are formed in the substrate beside the first gate using the first gate as a mask. A conformal layer is formed covering the first gate, the second gate and the substrate, wherein the conformal layer has sidewall portions on sidewalls of the second gate. Second LDD regions are formed in the substrate beside the second gate using the second gate and the sidewall portions of the conformal layer as a mask.
    Type: Grant
    Filed: August 16, 2016
    Date of Patent: May 8, 2018
    Assignee: United Microelectronics Corp.
    Inventors: Chia-Wen Wang, Hsiang-Chen Lee, Wen-Peng Hsu, Kuo-Lung Li, Meng-Chun Chen, Zi-Jun Liu, Ping-Chia Shih
  • Publication number: 20180053771
    Abstract: A method for fabricating a semiconductor structure is shown. A first gate of a first device and a second gate of a second device are formed over a semiconductor substrate. First LDD regions are formed in the substrate beside the first gate using the first gate as a mask. A conformal layer is formed covering the first gate, the second gate and the substrate, wherein the conformal layer has sidewall portions on sidewalls of the second gate. Second LDD regions are formed in the substrate beside the second gate using the second gate and the sidewall portions of the conformal layer as a mask.
    Type: Application
    Filed: August 16, 2016
    Publication date: February 22, 2018
    Applicant: United Microelectronics Corp.
    Inventors: Chia-Wen Wang, Hsiang-Chen Lee, Wen-Peng Hsu, Kuo-Lung Li, Meng-Chun Chen, Zi-Jun Liu, Ping-Chia Shih
  • Patent number: 9691903
    Abstract: In a method for manufacturing a semiconductor device, a fin structure including a first semiconductor layer, an oxide layer disposed over the first semiconductor layer and a second semiconductor layer disposed over the oxide layer is formed. An isolation insulating layer is formed so that the second semiconductor layer of the fin structure protrudes from the isolation insulating layer while the oxide layer and the first semiconductor layer are embedded in the isolation insulating layer. A third semiconductor layer is formed on the exposed second semiconductor layer so as to form a channel.
    Type: Grant
    Filed: August 3, 2016
    Date of Patent: June 27, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Hsuing Chen, Hou-Yu Chen, Chie-Iuan Lin, Yuan-Shun Chao, Kuo Lung Li
  • Publication number: 20170012128
    Abstract: In a method for manufacturing a semiconductor device, a fin structure including a first semiconductor layer, an oxide layer disposed over the first semiconductor layer and a second semiconductor layer disposed over the oxide layer is formed. An isolation insulating layer is formed so that the second semiconductor layer of the fin structure protrudes from the isolation insulating layer while the oxide layer and the first semiconductor layer are embedded in the isolation insulating layer. A third semiconductor layer is formed on the exposed second semiconductor layer so as to form a channel.
    Type: Application
    Filed: August 3, 2016
    Publication date: January 12, 2017
    Inventors: Chao-Hsuing CHEN, Hou-Yu CHEN, Chie-Iuan LIN, Yuan-Shun CHAO, Kuo Lung LI
  • Patent number: 9466497
    Abstract: The invention provides a method for fabricating a silicon-oxide-nitride-oxide-silicon (SONOS) non-volatile memory cell, comprising: (S1) forming a pad oxide pattern on a silicon substrate having a recess exposing a tunnel region of the silicon substrate; (S2) forming a bottom oxide layer, a nitride layer, a top oxide layer covering the recess and the pad oxide pattern to form a first ONO structure; (S3) forming a photoresist on the first ONO structure covering the recess and a peripheral region of the pad oxide pattern; (S4) removing a part of the first ONO structure exposed by the photoresist to form an U-shaped ONO structure; (S5) trimming the photoresist to exposed a part of the U-shaped ONO structure above the recess; (S6) removing the part of the U-shaped ONO structure; (S7) removing the photoresist; (S8) removing the pad oxide pattern and the top oxide layer; and (S9) forming a gate structure.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: October 11, 2016
    Assignee: UNITED MICROELECTRONICS CORPORATION
    Inventors: Kuo-Lung Li, Ping-Chia Shih, Hsiang-Chen Lee, Yu-Chun Chang, Chia-Wen Wang, Meng-Chun Chen, Chih-Yang Hsu
  • Patent number: 9425313
    Abstract: In a method for manufacturing a semiconductor device, a fin structure including a first semiconductor layer, an oxide layer disposed over the first semiconductor layer and a second semiconductor layer disposed over the oxide layer is formed. An isolation insulating layer is formed so that the second semiconductor layer of the fin structure protrudes from the isolation insulating layer while the oxide layer and the first semiconductor layer are embedded in the isolation insulating layer. A third semiconductor layer is formed on the exposed second semiconductor layer so as to form a channel.
    Type: Grant
    Filed: July 7, 2015
    Date of Patent: August 23, 2016
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chao-Hsuing Chen, Hou-Yu Chen, Chie-Iuan Lin, Yuan-Shun Chao, Kuo Lung Li
  • Patent number: 9412851
    Abstract: A method for fabricating a semiconductor device includes forming a patterned multi-layered dielectric film on a substrate; forming a patterned stack on the patterned multi-layered dielectric film so that an edge of the patterned multi-layered dielectric film is exposed from the patterned stack; forming a cover layer to cover a part of the substrate and expose the patterned stack and the exposed edge of the patterned multi-layered dielectric film; removing at least a part of the exposed edge of the patterned multi-layered dielectric film by using the cover layer and the patterned stack as an etching mask; and performing an ion implantation process by using the cover layer as an etching mask so as to form a doped region.
    Type: Grant
    Filed: December 23, 2013
    Date of Patent: August 9, 2016
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Yu-Chun Chang, Ping-Chia Shih, Chi-Cheng Huang, Kuo-Lung Li, Kun-I Chou, Chung-Che Huang, Chia-Cheng Hsu, Mu-Jia Liu
  • Patent number: 9129852
    Abstract: A method for fabricating a non-volatile memory semiconductor device is disclosed. The method includes the steps of providing a substrate; forming a gate pattern on the substrate, wherein the gate pattern comprises a first polysilicon layer on the substrate, an oxide-nitride-oxide (ONO) stack on the first polysilicon layer, and a second polysilicon layer on the ONO stack; forming an oxide layer on the top surface and sidewall of the gate pattern; performing a first etching process to remove part of the oxide layer; and performing a second etching process to completely remove the remaining oxide layer.
    Type: Grant
    Filed: August 11, 2014
    Date of Patent: September 8, 2015
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Hsiang-Chen Lee, Shao-Nung Huang, Wei-Pin Huang, Kuo-Lung Li, Ling-Hsiu Chou, Ping-Chia Shih