Abstract: An anti-static structure applied to a computer includes a chassis made of conductive material, a main board secured to the chassis having a CPU electrically connected thereto, a heat sink arranged on the CPU having a top surface, and a static transmission wire electrically connecting the top surface of the heat sink to the main board.

Abstract: A heat dissipation method is provided for an electronic apparatus including a housing, a circuit board mounted in the housing, and a heatsink device mounted between and rested on the housing and the circuit board. The heatsink device includes a heatsink plate having a bottom face rested on a surface of the housing, and a heat conductive plate having a bottom face rested on a top face of the heatsink plate and a top face rested on a bottom face of the circuit board. Thus, the heatsink device dissipates the heat produced by the heat sources of the circuit board largely and rapidly, thereby enhancing the heat dissipation effect of the electronic apparatus.