Abstract: A method for inspecting a semiconductor element includes steps of: a) providing an inspection apparatus including a supporting unit that includes a central seat and a plurality of positioning plates, and a camera unit that includes a first image capture device; b) positioning the semiconductor element onto the positioning plates; c) capturing a first bottom image of the semiconductor element; d) generating relative movement between the semiconductor element and the positioning plates; e) capturing a second bottom image of the semiconductor element; and f) synthesizing the first bottom image and the second bottom image to obtain a complete bottom image of the semiconductor element.

Abstract: A method for inspecting a semiconductor element includes steps of: a) providing an inspection apparatus including a supporting unit that includes a central seat and a plurality of positioning plates, and a camera unit that includes a first image capture device; b) positioning the semiconductor element onto the positioning plates; c) capturing a first bottom image of the semiconductor element; d) generating relative movement between the semiconductor element and the positioning plates; e) capturing a second bottom image of the semiconductor element; and f) synthesizing the first bottom image and the second bottom image to obtain a complete bottom image of the semiconductor element.

Abstract: A data writing method, a memory control circuit unit and a memory storage device are provided. The method includes: executing a first programming operation to data according to a first RAID ECC rate, programming the data into at least a portion of a plurality of first physical programming units, and generating a first RAID ECC; and executing a second programming operation to the data programmed into at least the portion of the first physical programming units according to a second RAID ECC rate, programming the data into at least a portion of a plurality of second physical programming units, and generating a second RAID ECC, wherein the first RAID ECC rate is different from the second RAID ECC rate.

Abstract: A data writing method, a memory control circuit unit and a memory storage device are provided. The method includes: executing a first programming operation to data according to a first RAID ECC rate, programming the data into at least a portion of a plurality of first physical programming units, and generating a first RAID ECC; and executing a second programming operation to the data programmed into at least the portion of the first physical programming units according to a second RAID ECC rate, programming the data into at least a portion of a plurality of second physical programming units, and generating a second RAID ECC, wherein the first RAID ECC rate is different from the second RAID ECC rate.

Abstract: A shifting apparatus including a base, first and second shifting elements, a pushing element, a fixed portion, and two screws is provided. The fixed portion fixed on the base has two trenches extending along first and second directions perpendicular to each other. The first shifting element is slidably disposed on the base along the first direction. The second shifting element is slidably disposed on the first shifting element along the second direction. The pushing element is slidably disposed in the two trenches. One screw screwed on the fixed portion along the second direction is capable of pushing the pushing element to move along the two trenches, such that the first shifting element is pushed by the pushing element to shift along the first direction. Another screw screwed on the first shifting element along the second direction is capable of pushing the second shifting element to shift along the second direction.

Abstract: A rotating apparatus including a base and a rotating element is provided. The base has first and second concave spherical surfaces. The rotating element includes first and second universally-jointing portions. The first universally-jointing portion has a first convex spherical surface. The first convex spherical surface is universally jointed to the first concave spherical surface. The second universally-jointing portion is fixed on the bottom of the first universally-jointing portion and has a second convex spherical surface. A curvature radius of the second convex spherical surface is smaller than a curvature radius of the first convex spherical surface. The first and second convex spherical surfaces have the same curvature center. The second convex spherical surface is universally jointed to the second concave spherical surface and the rotating element is supported on the second concave spherical surface of the base by the second universally-jointing portion.