Abstract: A method of forming a semiconductor structure is provided, and includes trimming a first substrate to form a recess on a sidewall of the first substrate. A conductive structure is formed in the first substrate. The method includes bonding the first substrate to a carrier. The method includes thinning down the first substrate. The method also includes forming a dielectric material in the recess and over a top surface of the thinned first substrate. The method further includes performing a planarization process to remove the dielectric material and expose the conductive structure over the top surface. In addition, the method includes removing the carrier from the first substrate.

Abstract: A method of forming an integrated circuit, including forming a n-type doped well (N-well) and a p-type doped well (P-well) disposed side by side on a semiconductor substrate, forming a first fin active region extruded from the N-well and a second fin active region extruded from the P-well, forming a first isolation feature inserted between and vertically extending through the N-well and the P-well, and forming a second isolation feature over the N-well and the P-well and laterally contacting the first and the second fin active regions.

Abstract: The present disclosure describes a method for memory cell placement. The method can include placing a memory cell region in a layout area and placing a well pick-up region and a first power supply routing region along a first side of the memory cell region. The method also includes placing a second power supply routing region and a bitline jumper routing region along a second side of the memory cell region, where the second side is on an opposite side to that of the first side. The method further includes placing a device region along the second side of the memory cell region, where the bitline jumper routing region is between the second power supply routing region and the device region.

Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.

Abstract: An optoelectronic package and a method for producing the optoelectronic package are provided. The optoelectronic package includes a carrier, a photonic device, a first encapsulant and a second encapsulant. The photonic device is disposed on the carrier. The first encapsulant covers the carrier and is disposed around the photonic device. The second encapsulant covers the first encapsulant and the photonic device. The first encapsulant has a topmost position and a bottommost position, and the topmost position is not higher than a surface of the photonic device.

Abstract: The present disclosure provides compositions of anti-ceramide antibodies and antigen-binding fragments thereof. The disclosure further provides methods of preventing or inhibiting cell death in a subject in need thereof comprising administering the anti-ceramide antibodies or antigen-binding fragments to a subject. The subject in need thereof may suffer from an autoimmune disease, GI syndrome, or GvHD.

Abstract: An analog-to-digital converter (ADC) includes a plurality of comparators connected to the ADC. The ADC further includes a plurality of switches, wherein switches connected to a corresponding comparator of the plurality of comparators are configured to alternate the corresponding comparator between normal operation and a calibration configuration. The ADC further includes at least one comparator of the plurality of comparators other than the corresponding comparator is configured for normal operation if the corresponding comparator is configured for calibration.

Abstract: An analog-to-digital converter (ADC) includes a plurality of comparators connected to the ADC. The ADC further includes a plurality of switches, wherein switches connected to a corresponding comparator of the plurality of comparators are configured to alternate the corresponding comparator between normal operation and a calibration configuration. The ADC further includes at least one comparator of the plurality of comparators other than the corresponding comparator is configured for normal operation if the corresponding comparator is configured for calibration.

Abstract: An analog-to-digital converter (ADC) including a plurality of comparators connected to the ADC. The ADC further includes a first pair of terminals and a second pair of terminals connected to each of the plurality of comparators. The ADC further includes a first pair of switches coupled to each of the first pair of terminals and a second pair of switches coupled to each of the second pair of terminals, where the first and second pair of switches are configured to alternate a corresponding comparator between normal operation and a calibration configuration. Comparators other than the corresponding comparator are configured for normal operation if the corresponding comparator is configured to be calibrated.

Abstract: Mechanisms to calibrate a digital to analog converter (DAC) of an SDM (sigma delta modulator) are disclosed. An extra DAC element in addition to the DAC is used to function in place of a DAC element under calibration. A signal (e.g., a random sequence of ?1 and +1) is injected to the DAC element under calibration, and the estimated error and compensation are acquired.

Abstract: A paper feeding module and multi-function printer using the same are provided. The multi-function printer includes a body, a paper transferring passage and a paper feeding module. The paper transferring passage includes an entrance. The paper feeding module includes a photoreceptor axle, a transferring axle and a skew correction axle. The photoreceptor axle is disposed on the paper transferring passage. The transferring axle is disposed next to the photoreceptor axle and contacts the photoreceptor axle. The skew correction axle is disposed between the entrance of the paper transferring passage and the photoreceptor axle. The skew correction axle contacts the transferring axle. The axes of the photoreceptor axle, the transferring axle and the skew correction axle are parallel to one another.

Abstract: A paper feeding module and multi-function printer using the same are provided. The multi-function printer includes a body, a paper transferring passage and a paper feeding module. The paper transferring passage includes an entrance. The paper feeding module includes a photoreceptor axle, a transferring axle and a skew correction axle. The photoreceptor axle is disposed on the paper transferring passage. The transferring axle is disposed next to the photoreceptor axle and contacts the photoreceptor axle. The skew correction axle is disposed between the entrance of the paper transferring passage and the photoreceptor axle. The skew correction axle contacts the transferring axle. The axes of the photoreceptor axle, the transferring axle and the skew correction axle are parallel to one another.

Abstract: An analog-to-digital converter (ADC) including a plurality of comparators connected to the ADC. The ADC further includes a first pair of terminals and a second pair of terminals connected to each of the plurality of comparators. The ADC further includes a first pair of switches coupled to each of the first pair of terminals and a second pair of switches coupled to each of the second pair of terminals, where the first and second pair of switches are configured to alternate a corresponding comparator between normal operation and a calibration configuration. Comparators other than the corresponding comparator are configured for normal operation if the corresponding comparator is configured to be calibrated.

Abstract: A method of operating an analog-to-digital converter (ADC) includes providing the ADC including a plurality of stages, each including an operational amplifier, and a first capacitor and a second capacitor including a first input end and a second input end, respectively. Each of the first capacitor and the second capacitor includes an additional end connected to a same input of the operational amplifier. The method further includes performing a plurality of signal conversions. Each of the signal conversions includes, in an amplifying phase of one of the plurality of stages, applying a first voltage to the first input end of the one of the plurality of stages, randomly selecting a second voltage from two different voltages; and applying the second voltage to the second input end of the one of the plurality of stages.

Abstract: An analog to digital convertor (ADC) includes a plurality of comparators one of which is referred to as an auxiliary comparator (e.g., comparator “Aux”). This comparator Aux is calibrated in the background while other comparators function as usual. Once having been calibrated, the comparator Aux replaces a first comparator, which becomes a new comparator Aux, is calibrated, and replaces the second comparator. This second comparator becomes the new comparator Aux, is calibrated, and replaces the third comparator, etc., until all comparators are calibrated. In effect, at any one point in time, a comparator may be calibrated as desire while other comparators and thus the ADC are operating as usual.

Abstract: An error corrector with a high use efficiency of a memory includes a memory, a bus device, an input buffer and an error correction module. The memory stores data. The bus device controls a memory access. The input buffer receives and temporarily stores a coded blockcode data, and writes the coded blockcode data in the memory through the bus device. The error correction module reads the coded blockcode data in the memory through the bus device and decodes it in rows and columns to thereby obtain decoded data and check bytes. The error correction module writes the decoded data in the memory through the bus device and discards the check bytes.

Abstract: Mechanisms to calibrate a digital to analog converter (DAC) of an SDM (sigma delta modulator) are disclosed. An extra DAC element in addition to the DAC is used to function in place of a DAC element under calibration. A signal (e.g., a random sequence of ?1 and +1) is injected to the DAC element under calibration, and the estimated error and compensation are acquired.

Abstract: Mechanisms to calibrate a digital to analog converter (DAC) of an SDM (sigma delta modulator) are disclosed. An extra DAC element in addition to the DAC is used to function in place of a DAC element under calibration. A signal (e.g., a random sequence of ?1 and +1) is injected to the DAC element under calibration, and the estimated error and compensation are acquired.

Abstract: A method of calibrating a digital-to-analog converter (DAC) is provided. The DAC includes a least-significant bit (LSB) block, and dummy LSB block adjacent to the LSB block. The DAC has a most-significant bit (MSB) block, which includes MSB thermometer macros. The method includes measuring the dummy LSB block to obtain a dummy LSB sum; and calibrating the MSB block so that each of the MSB thermometer macros provides a substantially same current as the dummy LSB sum.

Abstract: Mechanisms to calibrate a digital to analog converter (DAC) of an SDM (sigma delta modulator) are disclosed. An extra DAC element in addition to the DAC is used to function in place of a DAC element under calibration. A signal (e.g., a random sequence of ?1 and +1) is injected to the DAC element under calibration, and the estimated error and compensation are acquired.