Abstract: A pipe unit includes a pipe body, first and second flanges, and an adjusting structure. The first flange and the second flange are respectively disposed on opposite first and second ends of the pipe body. The adjusted structure is disposed between the first and second flanges and serves to adjust the length of the pipe unit.

Abstract: A pipe unit includes a pipe body, first and second flanges, and an adjusting structure. The first flange and the second flange are respectively disposed on opposite first and second ends of the pipe body. The adjusted structure is disposed between the first and second flanges and serves to adjust the length of the pipe unit.

Abstract: An adjusting mechanism adjusts a boat to be parallel to a furnace having an opening and a receiving space, which has a first symmetrical line. When the boat having a second symmetrical line is inserted into the space, a first gap area is formed between sidewalls of the space and the boat. The mechanism includes an adjusting element and an adjusting tool, which is removably disposed in the opening and has a wide part, a narrow part and a through hole. The narrow part blocks the opening. When the boat is inserted into the space, a second gap area smaller than the first gap area is formed between the sidewalls of the boat and the through hole at the narrow part. The adjusting element adjusts the first and second symmetrical lines to be parallel to each other according to the second gap area.

Abstract: An adjusting mechanism adjusts a boat to be parallel to a furnace having an opening and a receiving space, which has a first symmetrical line. When the boat having a second symmetrical line is inserted into the space, a first gap area is formed between sidewalls of the space and the boat. The mechanism includes an adjusting element and an adjusting tool, which is removably disposed in the opening and has a wide part, a narrow part and a through hole. The narrow part blocks the opening. When the boat is inserted into the space, a second gap area smaller than the first gap area is formed between the sidewalls of the boat and the through hole at the narrow part. The adjusting element adjusts the first and second symmetrical lines to be parallel to each other according to the second gap area.

Abstract: A pipe unit includes a pipe body, first and second flanges, and an adjusting structure. The first flange and the second flange are respectively disposed on opposite first and second ends of the pipe body. The adjusted structure is disposed between the first and second flanges and serves to adjust the length of the pipe unit.

Abstract: An adjusting mechanism adjusts a boat to be parallel to a furnace having an opening and a receiving space, which has a first symmetrical line. When the boat having a second symmetrical line is inserted into the space, a first gap area is formed between sidewalls of the space and the boat. The mechanism includes an adjusting element and an adjusting tool, which is removably disposed in the opening and has a wide part, a narrow part and a through hole. The narrow part blocks the opening. When the boat is inserted into the space, a second gap area smaller than the first gap area is formed between the sidewalls of the boat and the through hole at the narrow part. The adjusting element adjusts the first and second symmetrical lines to be parallel to each other according to the second gap area.

Abstract: A pipe unit and a method for assembling a pipe conduit using the same are provided. The pipe unit comprises a pipe body, a first flange, a second flange, and an adjusting structure. The pipe body has a first end and a second end opposite to the first end. The first flange and the second flange are respectively disposed on the first end and the second end. The adjusted structure is disposed between the first flange and the second flange and is for adjusting the length of the pipe unit.

Abstract: A filtering device and a filtering method and a semiconductor fabricating method thereof. The filtering device is used for filtering a gas had a first temperature. The filtering device includes a casing, a cooling mechanism and at least one adsorbing element. The casing has an input opening, an output opening and a cooling space. The gas enters the cooling space through the input opening and leaves the cooling space through the output opening. The cooling mechanism coupled to the casing is used for maintaining the cooling space at a second temperature that is lower than the first temperature. At least one adsorbing element is disposed inside the cooling space and has a plurality of surface-increasing elements arranged in a direction parallel. The plurality of surface-increasing elements arranged in the direction parallel to that the gas flows inside the cooling space for contacting the gas and adsorbing particles in the gas.

Abstract: A pipe unit and a method for assembling a pipe conduit using the same are provided. The pipe unit comprises a pipe body, a first flange, a second flange, and an adjusting structure. The pipe body has a first end and a second end opposite to the first end. The first flange and the second flange are respectively disposed on the first end and the second end. The adjusted structure is disposed between the first flange and the second flange and is for adjusting the length of the pipe unit.

Abstract: A method for cleaning a reactor and a method for manufacturing a chip thereof are provided. The reactor at least includes a reaction cavity and an inner tube. The inner tube is disposed inside the reaction cavity. The wall of the inner tube has a foreign particle. In the cleaning method, firstly, a continuous fluid is induced into and out of the reaction cavity. Next, the pressure of the continuous fluid is adjusted to be within a range from 100 torr to 300 torr for removing and taking the foreign particle out of the reaction cavity.

Abstract: A filtering device and a filtering method and a semiconductor fabricating method thereof. The filtering device is used for filtering a gas had a first temperature. The filtering device includes a casing, a cooling mechanism and at least one adsorbing element. The casing has an input opening, an output opening and a cooling space. The gas enters the cooling space through the input opening and leaves the cooling space through the output opening. The cooling mechanism coupled to the casing is used for maintaining the cooling space at a second temperature that is lower than the first temperature. At least one adsorbing element is disposed inside the cooling space and has a plurality of surface-increasing elements arranged in a direction parallel. The plurality of surface-increasing elements arranged in the direction parallel to that the gas flows inside the cooling space for contacting the gas and adsorbing particles in the gas.

Abstract: A temporal protection layer is employed to a wafer backside for use of micro-electro-mechanical systems (MEMS). The formation of the temporal protection layer prevents the wafer backside from scratch in process of transferring system for IC manufacturers. With regard to low cost and easy forming and removing, an oxide layer is used as the temporal protection layer. The throughput and yield rate of the wafer production are improved by the use of the temporal protection layer.

Abstract: An adjusting mechanism adjusts a boat to be parallel to a furnace having an opening and a receiving space, which has a first symmetrical line. When the boat having a second symmetrical line is inserted into the space, a first gap area is formed between sidewalls of the space and the boat. The mechanism includes an adjusting element and an adjusting tool, which is removably disposed in the opening and has a wide part, a narrow part and a through hole. The narrow part blocks the opening. When the boat is inserted into the space, a second gap area smaller than the first gap area is formed between the sidewalls of the boat and the through hole at the narrow part. The adjusting element adjusts the first and second symmetrical lines to be parallel to each other according to the second gap area.

Abstract: A temporal protecting layer is employed to a wafer backside for use of micro-electro-mechanical systems (MEMS). The formation of the temporal protecting layer prevents the wafer backside from scratch in process of transferring system for IC manufacturers. In concerning with low cost and easily forming and removing, an oxide layer is used as the temporal protecting layer. The throughput and yield rate for the wafer are improved by the temporal protecting layer.