Patents by Inventor Kuo-Sheng Kao

Kuo-Sheng Kao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240139142
    Abstract: Provided is a method for preventing or treating a liver disease, including administering a therapeutically effective amount of pharmaceutical composition to a subject in need, and the pharmaceutical composition includes the isothiocyanate structural modified compound and a pharmaceutically acceptable carrier thereof.
    Type: Application
    Filed: September 14, 2023
    Publication date: May 2, 2024
    Applicants: TAIPEI VETERANS GENERAL HOSPITAL, NATIONAL YANG MING CHIAO TUNG UNIVERSITY, PHARMAESSENTIA CORPORATION
    Inventors: Jaw-Ching WU, Yung-Sheng CHANG, Kuo-Hsi KAO, Chan-Kou HWANG, Ko-Chung LIN
  • Patent number: 11923194
    Abstract: A semiconductor device includes a semiconductor substrate having a first lattice constant, a dopant blocking layer disposed over the semiconductor substrate, the dopant blocking layer having a second lattice constant different from the first lattice constant, and a buffer layer disposed over the dopant blocking layer, the buffer layer having a third lattice constant different from the second lattice constant. The semiconductor device also includes a plurality of channel members suspended over the buffer layer, an epitaxial feature abutting the channel members, and a gate structure wrapping each of the channel members.
    Type: Grant
    Filed: April 25, 2022
    Date of Patent: March 5, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Hsin-Che Chiang, Wei-Chih Kao, Chun-Sheng Liang, Kuo-Hua Pan
  • Patent number: 9140671
    Abstract: A quantitative sensor and manufacture method thereof are disclosed. This quantitative sensor has a dual-mode film bulk acoustic resonator structure to achieve desirable performances in sensitivity, accuracy and efficiency. Furthermore, this quantitative sensor serves as a fluid sensor when a fluid detection metal layer is formed in a sample-receiving chamber; and this quantitative sensor may also serve as a bio sensor when biocompatible metal layer and a bio-sensing layer are formed in the sample-receiving chamber instead of the fluid detection metal layer.
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: September 22, 2015
    Inventors: Ying-Chung Chen, Chien-Chuan Cheng, Wei-Tsai Chang, Kuo-Sheng Kao, Re-Ching Lin, Jia-Ming Jiang, Chun-Hung Yang
  • Publication number: 20130004370
    Abstract: A quantitative sensor and manufacture method thereof are disclosed. This quantitative sensor has a dual-mode film bulk acoustic resonator structure to achieve desirable performances in sensitivity, accuracy and efficiency. Furthermore, this quantitative sensor serves as a fluid sensor when a fluid detection metal layer is formed in a sample-receiving chamber; and this quantitative sensor may also serve as a bio sensor when biocompatible metal layer and a bio-sensing layer are formed in the sample-receiving chamber instead of the fluid detection metal layer.
    Type: Application
    Filed: June 28, 2012
    Publication date: January 3, 2013
    Inventors: Ying-Chung CHEN, Chien-Chuan Cheng, Wei-Tsai Chang, Kuo-Sheng Kao, Re-Ching Lin, Jia-Ming Jiang, Chun-Hung Yang
  • Publication number: 20060125577
    Abstract: An acoustic resonator device includes a semiconductor substrate, a FBAR (thin film bulk acoustic resonator) and a support plate. The FBAR is fabricated on the upper surface of the semiconductor substrate. The semiconductor substrate has a resonant cavity through the upper and the lower surfaces thereof. The support plate is attached to the lower surface of the semiconductor substrate to shelter the opening of the resonant cavity. Moreover, the support plate can provide a larger die-attaching area for the acoustic resonator device, for the protection of the resonant cavity from chipping during wafer sawing.
    Type: Application
    Filed: December 13, 2004
    Publication date: June 15, 2006
    Inventors: Chin-Tang Hsieh, Ying-Chung Chen, Sean Wu, Chen-Kuei Chung, Kuo-Sheng Kao, Chin-Chi Chen