Abstract: An inorganic shell is ball-shaped and hollow, and includes silica and crystalline inorganic powder sintered together. A resin composition has the inorganic shells and the resin composition has certain dieletric characteristics. A method for making the inorganic shell is also provided.

Abstract: A resin composition comprises a styrene-butadiene-styrene block copolymer. The resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer. The hydrated inorganic substances dehydration to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius. Each microcapsule particle comprises a housing and an embedded object encapsulated in the housing. The embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius. A removable adhesive layer, an IC substrate, and an IC packaging process are also provided.

Abstract: A resin composition comprises a styrene-butadiene-styrene block copolymer. The resin composition further comprises a plurality of hydrated inorganic substances and/or a plurality of microcapsule particles dispersed in the styrene-butadiene-styrene block copolymer. The hydrated inorganic substances dehydration to form anhydrous inorganic substances at a dehydration temperature greater than 250 degrees Celsius. Each microcapsule particle comprises a housing and an embedded object encapsulated in the housing. The embedded object will largely volatilize from the housing at an escaping temperature greater than 250 degrees Celsius. A removable adhesive layer, an IC substrate, and an IC packaging process are also provided.

Abstract: An inorganic shell is ball-shaped and hollow, and includes silica and crystalline inorganic powder sintered together. A resin composition has the inorganic shells and the resin composition has certain dieletric characteristics. A method for making the inorganic shell is also provided.

Abstract: A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts by weight. The styrene-butadiene-styrene block copolymer and the liquid polybutadiene both include vinyl groups on the molecular side chains. The modified porous spheres of silicon oxide also include vinyl groups. An adhesive film and a circuit board using the resin composition are also provided.

Abstract: A circuit board includes at least two substrates and an adhesive film sandwiched between the two substrates. Each substrate includes a base board. The base board includes conductive wires. Each base board is connected to the other base board by the adhesive film. The adhesive film includes two first adhesive layers and a second adhesive layer. The second adhesive layer is sandwiched between the two first adhesive layers. An adhesion force of the first adhesive layer is greater than an adhesion force of the second adhesive layer. A major composition of the second adhesive layer is rubber. The rubber is selected from a group consisting of isoprene rubber, styrene butadiene rubber, ethylene propylene rubber, butyl rubber, acrylic rubber, and polybutadiene rubber, and mixtures thereof.