Patents by Inventor Kuo-Shu Chen
Kuo-Shu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9336978Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.Type: GrantFiled: August 8, 2013Date of Patent: May 10, 2016Assignee: CYNTEC CO., LTD.Inventors: Chung-Hsiung Wang, Hung-Ming Lin, Wen-Shiang Luo, Chun-Tiao Liu, Kuo-Shu Chen
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Patent number: 9129769Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.Type: GrantFiled: September 3, 2010Date of Patent: September 8, 2015Assignee: CYNTEC CO., LTD.Inventors: Chung-Hsiung Wang, Hung-Ming Lin, Wen-Shiang Luo, Chun-Tiao Liu, Kuo-Shu Chen
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Patent number: 9025295Abstract: A protective device includes a substrate, an electrode layer, a metal structure, an outer cover and an arc extinguishing structure. The electrode layer is disposed on the substrate. The electrode layer includes at least one gap. The metal structure is disposed on the electrode layer and located above the gap, and the metal structure has a melting temperature lower than a melting temperature of the electrode layer. The outer cover is disposed on the substrate and covers the metal structure and a portion of the electrode layer. The arc extinguishing structure is disposed between the outer cover and the substrate. A protective module is further provided.Type: GrantFiled: January 23, 2014Date of Patent: May 5, 2015Assignee: Cyntec Co., Ltd.Inventors: Chung-Hsiung Wang, Hung-Ming Lin, Lang-Yi Chiang, Wen-Shiang Luo, Kuo-Shu Chen, Han-Yang Chung, Hui-Wen Hsu, Po-Wei Su, Hong-Ming Chen
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Patent number: 8976001Abstract: A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.Type: GrantFiled: November 8, 2011Date of Patent: March 10, 2015Assignee: Cyntec Co., Ltd.Inventors: Kuo-Shu Chen, Chung-Hsiung Wang
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Publication number: 20140133059Abstract: A protective device includes a substrate, an electrode layer, a metal structure, an outer cover and an arc extinguishing structure. The electrode layer is disposed on the substrate. The electrode layer includes at least one gap. The metal structure is disposed on the electrode layer and located above the gap, and the metal structure has a melting temperature lower than a melting temperature of the electrode layer. The outer cover is disposed on the substrate and covers the metal structure and a portion of the electrode layer. The arc extinguishing structure is disposed between the outer cover and the substrate. A protective module is further provided.Type: ApplicationFiled: January 23, 2014Publication date: May 15, 2014Applicant: CYNTEC CO., LTD.Inventors: Chung-Hsiung WANG, Hung-Ming LIN, Lang-Yi CHIANG, Wen-Shiang LUO, Kuo-Shu CHEN, Han-Yang CHUNG, Hui-Wen HSU, Po-Wei SU, Hong-Ming CHEN
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Patent number: 8675333Abstract: A protective device including a substrate, a conductive section and a first auxiliary medium is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The first auxiliary medium is disposed between the metal element and the substrate, wherein the first auxiliary medium has a melting point lower than that of the metal element. The first auxiliary medium facilitates breaking of the metal element upon melting.Type: GrantFiled: May 14, 2013Date of Patent: March 18, 2014Assignee: Cyntec Co., Ltd.Inventors: Chung-Hsiung Wang, Hung-Ming Lin, Lang-Yi Chiang, Wen-Shiang Luo, Kuo-Shu Chen
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Publication number: 20130321119Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.Type: ApplicationFiled: August 8, 2013Publication date: December 5, 2013Applicant: CYNTEC CO., LTD.Inventors: Chung-Hsiung WANG, Hung-Ming LIN, Wen-Shiang LUO, Chun-Tiao LIU, Kuo-Shu CHEN
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Publication number: 20130250470Abstract: A protective device including a substrate, a conductive section and a first auxiliary medium is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The first auxiliary medium is disposed between the metal element and the substrate, wherein the first auxiliary medium has a melting point lower than that of the metal element. The first auxiliary medium facilitates breaking of the metal element upon melting.Type: ApplicationFiled: May 14, 2013Publication date: September 26, 2013Applicant: CYNTEC CO., LTD.Inventors: Chung-Hsiung WANG, Hung-Ming LIN, Lang-Yi CHIANG, Wen-Shiang LUO, Kuo-Shu CHEN
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Patent number: 8472158Abstract: A protective device including a substrate, a conductive section and a first auxiliary medium is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The first auxiliary medium is disposed between the metal element and the substrate, wherein the first auxiliary medium has a melting point lower than that of the metal element. The first auxiliary medium facilitates breaking of the metal element upon melting.Type: GrantFiled: September 3, 2010Date of Patent: June 25, 2013Assignee: Cyntec Co., Ltd.Inventors: Chung-Hsiung Wang, Hung-Ming Lin, Lang-Yi Chiang, Wen-Shiang Luo, Kuo-Shu Chen
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Publication number: 20120112871Abstract: A protective device includes a substrate, two first electrodes, a low-melting point metal layer and an assisting layer. The first electrodes are respectively arranged at two opposite sides of the substrate. The low melting point metal layer is arranged over the two first electrodes. The assisting layer is formed on the low melting point metal layer. The liquidus temperature of the assisting layer is below the liquidus temperature of the low melting point metal layer, and the liquidus temperature of the assisting layer is not below a predetermined temperature which is below the maximum working temperature of reflow soldering process by 25 degrees.Type: ApplicationFiled: November 8, 2011Publication date: May 10, 2012Inventors: Kuo-Shu CHEN, Chung-Hsiung WANG
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Patent number: 8089741Abstract: An over-voltage protection device and a method for manufacturing the over-voltage protection device are provided. The over-voltage protection device includes a substrate, a pair of electrode layers, a mask layer, and a sealing layer. The electrode layers are disposed on the substrate, and a gap is formed between the electrode layers. The mask layer is disposed over the gap and a portion of the electrode layers. The sealing layer covers the mask layer and the gap.Type: GrantFiled: July 26, 2009Date of Patent: January 3, 2012Assignee: Cyntec Co., Ltd.Inventors: Chung-Hsiung Wang, Hung-Ming Lin, Kuo-Shu Chen, Wen-Shiang Luo
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Publication number: 20110057761Abstract: A protective device including a substrate, a conductive section and a bridge element is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The bridge element spans across the metal element in a direction across direction of current flow in the metal element, wherein the bridge element facilitates breaking of the metal element upon melting.Type: ApplicationFiled: September 3, 2010Publication date: March 10, 2011Applicant: CYNTEC CO., LTD.Inventors: Chung-Hsiung Wang, Hung-Ming Lin, Wen-Shiang Luo, Chun-Tiao Liu, Kuo-Shu Chen
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Publication number: 20110058295Abstract: A protective device including a substrate, a conductive section and a first auxiliary medium is provided. The conductive section is supported by the substrate, wherein the conductive section comprises a metal element electrically connected between first and second electrodes. The metal element serves as a sacrificial structure having a melting point lower than that of the first and second electrodes. The first auxiliary medium is disposed between the metal element and the substrate, wherein the first auxiliary medium has a melting point lower than that of the metal element. The first auxiliary medium facilitates breaking of the metal element upon melting.Type: ApplicationFiled: September 3, 2010Publication date: March 10, 2011Applicant: CYNTEC CO., LTD.Inventors: Chung-Hsiung Wang, Hung-Ming Lin, Lang-Yi Chiang, Wen-Shiang Luo, Kuo-Shu Chen
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Publication number: 20100134937Abstract: An over-voltage protection device and a method for manufacturing the over-voltage protection device are provided. The over-voltage protection device includes a substrate, a pair of electrode layers, a mask layer, and a sealing layer. The electrode layers are disposed on the substrate, and a gap is formed between the electrode layers. The mask layer is disposed over the gap and a portion of the electrode layers. The sealing layer covers the mask layer and the gap.Type: ApplicationFiled: July 26, 2009Publication date: June 3, 2010Applicant: CYNTEC CO., LTD.Inventors: CHUNG-HSIUNG WANG, Hung-Ming LIN, Kuo-Shu CHEN, Wen-Shiang LUO