Abstract: A surface mounting structure and a packaging method thereof comprises a chip, a first conducting wire and a second conducting wire. The two conducting wires instead of lead frame architecture of the prior art is that the lead frame and a bridge jumper connected with N junction and P junction instead of the two conducting wires. The two conducting wires are drawn out from a bottom of a package, and are pressed and bent to original surface of the surface mounting pins so as to increase space utilization rate. Thereby it is to improve a complicated lead frame architecture of the prior art, increase use space and simplify system design.

Abstract: A semiconductor package structure includes a substrate, a chip module, a lead frame, and a bridging element. The chip module is electrically connected to the substrate. The lead frame is disposed beside one side of the substrate, and the lead frame has a projecting block unit. The bridging element has one side electrically connected with the chip module, and a first positioning unit formed on the other side thereof for electrically retaining with the projecting block unit. Moreover, the semiconductor package structure of the present invention is applied to a design of multi-chip package, and ensures that a bridging element is connected with a chip via the bridging element being retained by a lead frame. In addition, the junction between the bridging element and the lead frame do not cause displacement between the lead frame and the bridging element during the packaging process.