Patents by Inventor Kuo-Ta Wu

Kuo-Ta Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate module with high thermal conductivity and its fabrication method of same
    Publication number: 20080017402
    Abstract: A high thermal conductivity substrate includes multiple substrate material layers each having a first plane and a second plane opposite to the first plane, thermal conducting columns arranged in the substrate material layers and respectively extending through the first planes and second planes of each substrate material layer along its thickness direction, and multiple thermal conducting layers arranged on the first plane of each substrate material layer and the second plane of one substrate material layer that is to be disposed at the bottom side of the substrate and connected to the thermal conducting columns in the respective substrate material layers to form a horizontally and vertically distributed thermal conducting network.
    Type: Application
    Filed: July 10, 2007
    Publication date: January 24, 2008
    Applicant: INTEGRATED MODULE TECHNOLOGY INC.
    Inventors: Rong-Fon Huang, Hsu-Yuan Chang, Kuo-Ta Wu, Yulin Chiang