Abstract: A detection device includes: a metal body having a plurality of main vias, a plurality of main through holes with insulators formed on the hole walls of the main vias, and a plurality of connecting elements disposed in the main through holes. Therefore, when testing a chip with I/O pins of high density with the detection device, the connecting elements contact the insulator only, without contacting the hole walls of the main vias, and the problem of short circuits can be avoided. A method of forming a detection device is also provided.

Abstract: A detection device includes: a metal body having a plurality of main vias, a plurality of main through holes with insulators formed on the hole walls of the main vias, and a plurality of connecting elements disposed in the main through holes. Therefore, when testing a chip with I/O pins of high density with the detection device, the connecting elements contact the insulator only, without contacting the hole walls of the main vias, and the problem of short circuits can be avoided. A method of forming a detection device is also provided.

Abstract: A structure for packaging a radio frequency identification (RFID) device is disclosed, which comprises a substrate, an antenna formed on the substrate, a RFID chip with a first side attached to the substrate and a second side having at least one signal pin exposed, at least one conductive contact plate placed on the substrate in contact with both the exposed signal pin and a portion of the antenna, and a protective film over the contact plate to secure the same to the substrate, wherein an electrical connection between the signal pin and the portion of the antenna is made through the contact plate.