Abstract: The present disclosure illustrates to a serially-connected transistor device including a lead line frame including a carrier board and an electrode pin set, and the carrier board including a first board and a second board, and the electrode pin set including a first pin electrically connected to the first board, and a second pin, a third pin and a fourth pin; and a die unit including a first die and a second die electrically connected to the first board and the second board, respectively, so that two transistors can be electrically connected in series in the serially-connected transistor device to increase reverse voltage. As a result, the serially-connected transistor device of the present disclosure can be produced by automation die bonding and wire bonding manner, so as to achieve the effect of automated production, high yield, low cost, and better product consistency and reliability.

Abstract: The present disclosure illustrates to a serially-connected transistor device including a lead line frame including a carrier board and an electrode pin set, and the carrier board including a first board and a second board, and the electrode pin set including a first pin electrically connected to the first board, and a second pin, a third pin and a fourth pin; and a die unit including a first die and a second die electrically connected to the first board and the second board, respectively, so that two transistors can be electrically connected in series in the serially-connected transistor device to increase reverse voltage. As a result, the serially-connected transistor device of the present disclosure can be produced by automation die bonding and wire bonding manner, so as to achieve the effect of automated production, high yield, low cost, and better product consistency and reliability.

Abstract: The present disclosure illustrates an electronic component applicable single-phase or three-phase bridge rectifier circuit. The electronic component includes a lead frame, a first die, and a second die. The first and second pins of the lead frame are connected to the first and second boards respectively, and a surface of the first die opposite to the first board is connected to the second board, a surface of the second die opposite to the second board is connected a third pin of the lead frame. The bridge rectifier circuit may include two or three electronic components, and the first pins of the electronic components are connected to each other as a first DC output terminal, the third pins are electrically connected to each other as a second DC output terminal, and the second pins are served as AC input terminals, respectively.

Abstract: An integrated series Schottky diode rectifier having the characteristics of high reverse voltage resistance, ease of fabrication, small size, high yield rate, automated fabrication applicability and low manufacturing cost is disclosed to include multiple lead frames, multiple Schottky diode chips mounted on the lead frames and connected in series, first conductor connected to the positive electrode of first Schottky diode chip, second conductor connected to the positive electrode of each of other Schottky diode chip and bridged onto the lead frame that carries the previous Schottky diode chip, electrode pin set including positive pin connected to first conductor at first Schottky diode chip, negative pin connected to negative electrode of last Schottky diode chip and external pin connected in series between second conductors of each two adjacent Schottky diode chips, and resin package body molded on lead frames and wrapped about Schottky diode chips and electrode pin set.