Patents by Inventor Kuo-Wei Lee
Kuo-Wei Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240133639Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.Type: ApplicationFiled: October 20, 2022Publication date: April 25, 2024Inventors: CHUN-LI HSIUNG, KUO-WEI LEE, CHIEN-CHENG WU, CHUN-LUNG WU
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Publication number: 20240131819Abstract: A thermally conductive board includes a first metal layer, a second metal layer, and a thermally conductive layer. The material of the first metal layer includes copper, and the first metal layer has a first top surface and a first bottom surface opposite to the first top surface. A first metal coating layer covers the first bottom surface. The material of the second metal layer includes copper, and the second metal layer has a second top surface and a second bottom surface opposite to the second top surface. A second metal coating layer covers the second top surface and faces the first metal coating layer. The thermally conductive layer is an electrically insulator laminated between the first metal coating layer and the second metal coating layer.Type: ApplicationFiled: May 3, 2023Publication date: April 25, 2024Inventors: KAI-WEI LO, WEN-FENG LEE, HSIANG-YUN YANG, KUO-HSUN CHEN
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Patent number: 11965702Abstract: A low pressure drop automotive liquid-cooling heat dissipation plate and an enclosed automotive liquid-cooling cooler having the same are provided. The low pressure drop automotive liquid-cooling heat dissipation plate includes a heat dissipation plate body and three fin sets. The heat dissipation plate body has a first heat dissipation surface and a second heat dissipation surface that are opposite to each other. The first heat dissipation surface is in contact with three traction inverter power component sets, and the second heat dissipation surface is in contact with a cooling fluid. Three heat dissipation regions that are spaced equidistantly apart from each other and that have a same size are defined on the second heat dissipation surface along a flow direction of the cooling fluid, and respectively correspond to three projection areas formed by projecting three traction inverter power component sets on the second heat dissipation surface.Type: GrantFiled: October 21, 2022Date of Patent: April 23, 2024Assignee: AMULAIRE THERMAL TECHNOLOGY, INC.Inventors: Chun-Li Hsiung, Kuo-Wei Lee, Chien-Cheng Wu, Chun-Lung Wu
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Publication number: 20240118135Abstract: An information handling system includes a display panel having an active area that generates visual images and an inactive area disposed outside the active area. The inactive area having an alignment mark that is invisible to a naked eye.Type: ApplicationFiled: October 7, 2022Publication date: April 11, 2024Inventors: Hong-Ji Huang, Yu-Chen Liu, Kuo-Wei Tseng, Chun-Wei Huang, Chi-Fong Lee
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Publication number: 20240121913Abstract: A vehicle water-cooling heat sink plate having fin sets with different surface areas is provided. The vehicle water-cooling heat sink plate includes a heat-dissipating plate body and three fin sets. The heat-dissipating plate body has a first heat-dissipating surface and a second heat-dissipating surface that are opposite to each other, the first heat-dissipating surface is used for contacting three traction inverter power component sets, and the second heat-dissipating surface is used for contacting a cooling fluid. The second heat-dissipating surface of the heat-dissipating plate body along a flow direction of the cooling fluid is divided into three heat-dissipating areas which are spaced apart from each other and have the same size, and the three heat-dissipating areas respectively correspond to three projection areas that are respectively generated by the three traction inverter power component sets.Type: ApplicationFiled: October 11, 2022Publication date: April 11, 2024Inventors: CHUN-LI HSIUNG, KUO-WEI LEE, CHUN-LUNG WU, CHIEN-CHENG WU
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Publication number: 20240116356Abstract: A vehicle water-cooling heat sink plate having fin sets with different fin pitch distances is provided. The vehicle water-cooling heat sink plate includes a heat-dissipating plate body and three fin sets. The heat-dissipating plate body has a first heat-dissipating surface and a second heat-dissipating surface that are opposite to each other, the first heat-dissipating surface is used for contacting three traction inverter power component sets, and the second heat-dissipating surface is used for contacting a cooling fluid. The second heat-dissipating surface of the heat-dissipating plate body along a flow direction of the cooling fluid is divided into three heat-dissipating areas which are spaced apart from each other and have the same size, and the three heat-dissipating areas respectively correspond to three projection areas that are respectively generated by the three traction inverter power component sets.Type: ApplicationFiled: October 11, 2022Publication date: April 11, 2024Inventors: KUO-WEI LEE, CHUN-LI HSIUNG, CHIEN-CHENG WU, CHUN-LUNG WU
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Publication number: 20240121927Abstract: A display device includes the following features. A display panel is disposed in a shell and has a display surface and a back surface. The display surface faces a light-passing portion of the shell, and a first heat dissipation space is formed between the display surface and the light-passing portion. An airflow-blocking plate is disposed in the shell, and a second heat dissipation space is formed among the airflow-blocking plate, the shell and the back surface. A third heat dissipation space is formed between the airflow-blocking plate and the shell. The first heat dissipation space, the second heat dissipation space, the third heat dissipation space, an air inlet and an air outlet of the shell are communicated with each other. A heat-generating assembly is disposed in the second heat dissipation space. A first fan is disposed at the air outlet.Type: ApplicationFiled: December 19, 2023Publication date: April 11, 2024Inventors: KUO HSUAN FAN, NAN-CHING LEE, Fa wei Lan
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Patent number: 11956553Abstract: An image sensor device has a first number of first pixels disposed in a substrate and a second number of second pixels disposed in the substrate. The first number is substantially equal to the second number. A light-blocking structure disposed over the first pixels and the second pixels. The light-blocking structure defines a plurality of first openings and second openings through which light can pass. The first openings are disposed over the first pixels. The second openings are disposed over the second pixels. The second openings are smaller than the first openings. A microcontroller is configured to turn on different ones of the second pixels at different points in time.Type: GrantFiled: November 8, 2021Date of Patent: April 9, 2024Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Yun-Wei Cheng, Chun-Hao Chou, Kuo-Cheng Lee, Hsin-Chi Chen
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Publication number: 20240113237Abstract: The present disclosure provides a semiconductor structure and a method of manufacturing the same. The semiconductor structure includes a sensing device, a solar cell, and an interconnecting structure. The solar cell is disposed above the sensing device and is electrically connected to the sensing device. The interconnecting structure is disposed between the sensing device and the solar cell and has a first surface facing the solar cell and a second surface facing the sensing devices. The interconnecting structure comprises a first energy storage component and a second energy storage component. The first energy storage component is disposed closer to the first surface of the interconnecting structure than the second energy storage component.Type: ApplicationFiled: January 10, 2023Publication date: April 4, 2024Inventors: FENG-CHIEN HSIEH, YUN-WEI CHENG, KUO-CHENG LEE, CHENG-MING WU, PING KUAN CHANG
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Publication number: 20240096818Abstract: Devices and method for forming a shielding assembly including a first chip package structure sensitive to magnetic interference (MI), a second chip package structure sensitive to electromagnetic interference (EMI), and a shield surrounding sidewalls and top surfaces of the first chip package structure and the second chip package structure, in which the shield is a magnetic shielding material. In some embodiments, the shield may include silicon steel, in some embodiments, the shield may include Mu-metal. The silicon-steel-based or Mu-metal-based shield may provide both EMI and MI protection to multiple chip package structures with various susceptibilities to EMI and MI.Type: ApplicationFiled: April 20, 2023Publication date: March 21, 2024Inventors: Harry-Hak-Lay Chuang, Yuan-Jen Lee, Kuo-An Liu, Ching-Huang Wang, C.T. Kuo, Tien-Wei Chiang
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Publication number: 20240096923Abstract: The image sensing structure includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes at least one first unit. The at least one first unit includes a plurality of first interconnects adjacent to the top side of the first semiconductor device, a row selector, and an analog-to-digital converter (ADC) connected to the row selectors. The second semiconductor device includes at least one second unit. The at least one second unit includes a photodiode facing the top side of the second semiconductor device. The photodiode is configured to receive the light incident on the top side of the second semiconductor device. The top side of the first semiconductor device is bonded to the bottom side of the second semiconductor device.Type: ApplicationFiled: January 6, 2023Publication date: March 21, 2024Inventors: FENG-CHIEN HSIEH, YUN-WEI CHENG, WEI-LI HU, KUO-CHENG LEE, CHENG-MING WU
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Publication number: 20240090234Abstract: A magnetoresistive random access memory (MRAM) includes a first transistor and a second transistor on a substrate, a source line coupled to a first source/drain region of the first transistor, and a first metal interconnection coupled to a second source/drain region of the first transistor. Preferably, the first metal interconnection is extended to overlap the first transistor and the second transistor and the first metal interconnection further includes a first end coupled to the second source/drain region of the first transistor and a second end coupled to a magnetic tunneling junction (MTJ).Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Applicant: UNITED MICROELECTRONICS CORP.Inventors: Kuo-Hsing Lee, Sheng-Yuan Hsueh, Te-Wei Yeh, Chien-Liang Wu
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Publication number: 20240079422Abstract: A pixel array includes octagon-shaped pixel sensors and a combination of visible light pixel sensors (e.g., red, green, and blue pixel sensors) and near infrared (NIR) pixel sensors. The color information obtained by the visible light pixel sensors and the luminance obtained by the NIR pixel sensors may be combined to increase the low-light performance of the pixel array, and to allow for low-light color images in low-light applications. The octagon-shaped pixel sensors may be interspersed in the pixel array with square-shaped pixel sensors to increase the utilization of space in the pixel array, and to allow for pixel sensors in the pixel array to be sized differently. The capability to accommodate different sizes of visible light pixel sensors and NIR pixel sensors permits the pixel array to be formed and/or configured to satisfy various performance parameters.Type: ApplicationFiled: April 27, 2023Publication date: March 7, 2024Inventors: Feng-Chien HSIEH, Yun-Wei CHENG, Kuo-Cheng LEE, Cheng-Ming WU
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Publication number: 20230363111Abstract: An immersion-type liquid cooling heat dissipation structure is provided. The immersion-type liquid cooling heat dissipation structure includes a metal heat dissipation substrate layer and a metal film layer. The metal film layer is formed on a surface of the metal heat dissipation substrate layer, and is configured to be immersed in an immersion-type coolant. An effective thickness of the metal film layer is less than 500 µm. A surface of the metal film layer has a plurality of micropores that facilitate generation of vapor bubbles. An effective width of each of the plurality of micropores is between 1 µm and 200 µm, and a depth of each of the plurality of micropores is between 100 nm and 50 µm.Type: ApplicationFiled: May 8, 2022Publication date: November 9, 2023Inventors: KUO-WEI LEE, CHING-MING YANG, CHI-AN CHEN, TZE-YANG YEH
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Publication number: 20230332848Abstract: A radiator structure is provided. The radiator structure includes a substrate, a first metal coating layer and a second metal coating layer. The first metal coating layer and the second metal coating layer are made of materials different from one another, and are formed on the substrate by different processes. The first metal coating layer is a non-first masking area formed on the substrate by wet processing. The second metal coating layer is a non-second masking area correspondingly formed on the first metal coating layer and the substrate by sputtering. A first masking area and a second masking area are not necessarily the same.Type: ApplicationFiled: June 17, 2023Publication date: October 19, 2023Inventors: KUO-WEI LEE, TSUNG-RUEI SUEI, MIN-HORNG LIU, TZE-YANG YEH
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Patent number: 11729944Abstract: A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.Type: GrantFiled: August 18, 2021Date of Patent: August 15, 2023Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Yu-Nien Huang, Kuo-Wei Lee
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Patent number: 11625079Abstract: A cooling device for a computing system is disclosed. The device includes a heat sink, a base, and a cover. The heat sink includes a plurality of fins extending from a first section of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves is configured to mate with at least a portion of the plurality of fins of the heat sink. The cover is configured to be coupled to the base and encapsulate the heat sink. The cover further includes two apertures, each aperture configured to be connected to a tube. A width of the plurality of fins of the heat sink is less than a width of the plurality of grooves of the base. A height of the heat sink is less than a height of an interior portion of the cover.Type: GrantFiled: April 21, 2021Date of Patent: April 11, 2023Assignee: QUANTA COMPUTER INC.Inventors: Chao-Jung Chen, Yu-Nien Huang, Kuo-Wei Lee
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Publication number: 20230080659Abstract: A radiator structure is provided. The radiator structure includes a substrate, a first metal coating layer and a second metal coating layer. The first metal coating layer and the second metal coating layer are made of materials different from one another, and are formed on the substrate by different processes. The first metal coating layer is a non-first masking area formed on the substrate by wet processing. The second metal coating layer is a non-second masking area correspondingly formed on the first metal coating layer and the substrate by sputtering. A first masking area and a second masking area are not necessarily the same.Type: ApplicationFiled: September 15, 2021Publication date: March 16, 2023Inventors: KUO-WEI LEE, TSUNG-RUEI SUEI, MIN-HORNG LIU, TZE-YANG YEH
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Publication number: 20220377937Abstract: A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.Type: ApplicationFiled: August 18, 2021Publication date: November 24, 2022Inventors: Chao-Jung CHEN, Yu-Nien HUANG, Kuo-Wei LEE
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Publication number: 20220307779Abstract: A heat dissipation substrate for increasing solderability is provided. The heat dissipation substrate for increasing solderability includes a heat dissipation layer serving as a base layer, a plating layer formed on the heat dissipation layer, and a protective layer formed on the plating layer. The protective layer is made of one of tin and tin alloy, and the protective layer is capable of being melted in a subsequent process, such that the protective layer is a meltable protective layer.Type: ApplicationFiled: March 28, 2021Publication date: September 29, 2022Inventors: Min-Horng LIU, Tze-Yang YEH, Kuo-Wei LEE