Patents by Inventor Kuo Wei LIEN

Kuo Wei LIEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12457001
    Abstract: A protective case applied to assemble to a handheld electronic device is provided. The protective case includes an inner surface, an outer surface, a connector, a plurality of first detachable connecting structures, and a plurality of first electrical connecting structures. The connector is located at the inner surface to electrically connect to the handheld electronic device. The connector includes a plurality of signal transmitting pins. The first detachable connecting structures are arranged in a first array on the outer surface. The first electrical connecting structures are arranged in a second array on the outer surface. The first electrical connecting structures are electrically connected to the signal transmitting pins respectively.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: October 28, 2025
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Wei-En Chen, Kuo Wei Lien, Yuan-Kai Yeh, Yu-Sheng Lin, Pei-Chiang Lin, Wei-Hsiang Chiu, Guan-Wei Chen
  • Publication number: 20230223977
    Abstract: A protective case applied to assemble to a handheld electronic device is provided. The protective case includes an inner surface, an outer surface, a connector, a plurality of first detachable connecting structures, and a plurality of first electrical connecting structures. The connector is located at the inner surface to electrically connect to the handheld electronic device. The connector includes a plurality of signal transmitting pins. The first detachable connecting structures are arranged in a first array on the outer surface. The first electrical connecting structures are arranged in a second array on the outer surface. The first electrical connecting structures are electrically connected to the signal transmitting pins respectively.
    Type: Application
    Filed: August 24, 2022
    Publication date: July 13, 2023
    Inventors: Wei-En CHEN, Kuo Wei LIEN, Yuan-Kai YEH, Yu-Sheng LIN, Pei-Chiang LIN, Wei-Hsiang CHIU, Guan-Wei CHEN