Patents by Inventor Kuo Wei-Min

Kuo Wei-Min has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of LED packaging on transparent flexible film
    Publication number: 20080188020
    Abstract: A method of LED packaging on transparent on transparent flexible film by: depositing transparent ITO on a flexible transparent substrate to form a conducting layer, and then processing the conducting layer to form a circuit pattern, and then bonding LED chips to the circuit pattern, and then molding a lens over the LED chips to form 360° wide view angle LED package. The method has considered voltage and current matching and provides a suitable wire bond function zone for the LED chips, and keeps the gold wires well protected.
    Type: Application
    Filed: February 5, 2007
    Publication date: August 7, 2008
    Inventors: Kuo Wei-Min, Yang Chien Ching