Abstract: An information handling system includes a display panel having an active area that generates visual images and an inactive area disposed outside the active area. The inactive area having an alignment mark that is invisible to a naked eye.

Abstract: Disclosed is a memory cell including a first transistor having a first terminal coupled to a bit line; a second transistor having a first terminal coupled to a bit line bar; a weight storage circuit coupled between a gate terminal of the first transistor and a gate terminal of the second transistor, storing a weight value, and determining to turn on the first transistor or the second transistor according to the weight value; and a driving circuit coupled to a second terminal of the first transistor, a second terminal of the second transistor, and at least one word line, receiving at least one threshold voltage and at least one input data from the word line, and determining whether to generate an operation current on a path of the turned-on first transistor or the turned-on second transistor according to the threshold voltage and the input data.

Abstract: A display includes an imaging device with a light source providing a first light emission and a second light emission, and an organic light-emitting diode panel proximate to the light source, wherein the first light emission leaks at an active area of the display device. A light emission barrier blocks the first light emission from leaking at the active area of the display while permitting the second light emission through the imaging device.

Abstract: An information handling system stylus transmits a wireless signal at a writing tip to enhance touch detection of the writing tip by a touchscreen display and receives wireless signals from the touchscreen display at a receiving antenna. To enhance control of wireless energy distributed at the writing tip, the receiving antenna is selectively coupled to the writing tip, such as by transitioning from a float of the receiving antenna to an interface with the stylus power source at transmit by the writing tip. Charge at the receiving antenna helps to shape the energy distribution from the writing tip, such as to match the energy distribution of other styluses in use at the touchscreen display.

Abstract: An information handling system stylus transmits a wireless signal at a writing tip to enhance touch detection of the writing tip by a touchscreen display and receives wireless signals from the touchscreen display at a receiving antenna. To enhance control of wireless energy distributed at the writing tip, the receiving antenna is selectively coupled to the writing tip, such as by transitioning from a float of the receiving antenna to an interface with the stylus power source at transmit by the writing tip. Charge at the receiving antenna helps to shape the energy distribution from the writing tip, such as to match the energy distribution of other styluses in use at the touchscreen display.

Abstract: The present disclosure provides an interspinous process device. The interspinous process device may include a main body having a cavity formed therein, the main body being configured to be disposed between the two adjacent spinous processes; and a spacer configured to be arranged in the cavity of the main body. When the main body is disposed between the two adjacent spinous processes and the spacer is arranged in the cavity of the main body, a volume of the cavity may be greater than a volume of the spacer, a height of the cavity may be equal to a height of the spacer, and a width of the cavity may be greater than a width of the spacer.

Abstract: The present invention provides a test pad structure of chip, which comprises a plurality of first internal test pads, a plurality of second internal test pads, a plurality of first extended test pads, and a plurality of second extended test pads. The first internal test pads and the second internal test pads are disposed in a chip. The second internal test pads and the first internal test pads are spaced by a distance. The first extended test pads are connected with the first internal test pads. The second extended test pads are connected with the second internal test pads. The first extended test pads and the second extended test pads may increase the contact area to be contacted by probes. Signals or power are transmitted to the first internal test pads and the second internal test pads via the first extended test pads and the second extended test pads for the probes to test the chip.

Abstract: An information handling system presents visual images at a display that includes a display panel having a capacitive touch detection surface supported by an indium tin oxide layer disposed between a front layer, such as polarizer, and a display cell. To prevent excessive charge build up associated with the capacitive touch detection surface, a conductive ink is applied at the display panel perimeter and interfaced with a ground at the rear side of the display panel. In one example embodiment, a non-conductive ink insulates the conductive ink from the display panel except as desired to transfer excess charge from the indium tin oxide layer. The conductive ink may interface directly with the indium tin oxide layer or indirectly through a second non-conductive ink having greater conductivity than the insulative non-conductive ink.

Abstract: An information handling display presents visual images in a privacy mode that manages visual image brightness with a local processing resource when a predetermined condition is detected, such as multiple individuals in the display field of view. For example, an information handling system provides visual information to a display timing controller that includes a pulse width modulation signal to command display backlight brightness. When in a privacy mode, the timing controller or another processing resource modifies the pulse width modulation signal to command a predetermined reduced brightness, such as in a range of 30 to 50 nits of reduced brightness.

Abstract: This disclosure provides a method of protecting a subject for exercise that prevents an exercise-related harmful effect and reducing exercise fatigue in the subject to thereby enhance physical performance and promote anti-fatigue and anti-inflammatory effects in the subject.

Abstract: The present invention provides a bump structure of chip disposed on a surface of a chip and comprises a plurality of connecting-bump sets. Each connecting-bump set includes a first connecting hum and a second connecting hump. The first connecting bump and the second connecting bump include corresponding blocking structures. While disposing the chip on a board member, the blocking structure of the first connecting bump and the blocking structure of the second connecting bump block the conductive medium and retard the flow of the conductive medium. The conductive medium is forced to flow between the first connecting bump and the second connecting bump and thus preventing the conductive particles in the conductive medium from leaving the surfaces of the connecting bumps. In addition, there is a flow channel between the first and second connecting bumps. One or more width of the flow channel is between 0.1 ?m and 8 ?m.

Abstract: An information handling system stylus transmits a wireless signal at a writing tip to enhance touch detection of the writing tip by a touchscreen display and receives wireless signals from the touchscreen display at a receiving antenna. To enhance control of wireless energy distributed at the writing tip, the receiving antenna is selectively coupled to the writing tip, such as by transitioning from a float of the receiving antenna to an interface with the stylus power source at transmit by the writing tip. Charge at the receiving antenna helps to shape the energy distribution from the writing tip, such as to match the energy distribution of other styluses in use at the touchscreen display.

Abstract: The present invention provides a flow guiding structure of chip, which comprises at least one flow guiding member disposed on a surface of a chip and adjacent to a plurality of connecting bumps disposed on the surface of the chip. When the chip is disposed on a board member, the at least one flow guiding member may guide the conductive medium on the surface of the chip to flow toward the connecting bumps and drive a plurality of conductive particles of the conductive medium to move toward the connecting bumps and thus increasing the number of the conductive particles on the surfaces of the connecting bumps. Alternatively, the flow guiding member may retard the flow of the conductive medium for avoiding the conductive particles from leaving the surfaces of the connecting bumps and thus preventing reduction of the number of the conductive particles on the surfaces of the connecting bumps.

Abstract: The present invention provides a test pad structure of chip, which comprises a plurality of first internal test pads, a plurality of second internal test pads, a plurality of first extended test pads, and a plurality of second extended test pads. The first internal test pads and the second internal test pads are disposed in a chip. The second internal test pads and the first internal test pads are spaced by a distance. The first extended test pads are connected with the first internal test pads. The second extended test pads are connected with the second internal test pads. The first extended test pads and the second extended test pads may increase the contact area to be contacted by probes. Signals or power are transmitted to the first internal test pads and the second internal test pads via the first extended test pads and the second extended test pads for the probes to test the chip.

Abstract: The present invention discloses a lead structure of the circuit, which comprises a first lead and a second lead. The first lead includes a first bump connecting part and a first lead segment. The first lead segment is connected to the first bump connecting part. The width of the first lead segment is smaller than the width of the first bump connecting part. The second lead is adjacent to the first lead and there is a lead gap therebetween. The second lead also includes a second bump connecting part and a first lead segment. The first lead segment of the second lead is connected to the second bump connecting part. The second bump connecting part and the first bump connecting part are arranged staggeredly. The second bump connecting part is adjacent to the first lead segment of the first lead.

Abstract: This disclosure provides a method of protecting a subject for exercise that prevents an exercise-related harmful effect and reducing exercise fatigue in the subject to thereby enhance physical performance and promote anti-fatigue and anti-inflammatory effects in the subject.

Abstract: A chip packaging structure includes a chip and a film substrate. The chip is formed with a gold bump, and the film substrate is formed with an inner lead, wherein the gold bump includes a first bonding surface and a plurality of side walls. The gold bump is electrically connected to the inner lead through a eutectic material coverage layer, and the first bonding surface and at least one of the plurality of side walls are covered by the eutectic material coverage layer.

Abstract: Disclosed herein is a spinal interbody cage, comprising an upper plate, a lower plate, a screw arbor and two slide blocks. The screw arbor includes a first section with an outer thread and a second section with an outer thread. The outer threads of the first and second sections have opposite directions. The upper plate respectively has a pair of upper plate slanted surfaces proximate to the first and second sections of the screw rod. The lower plate respectively has a pair of lower plate slanted surfaces proximate to the first and second sections. The screw rod is disposed in and cooperates with the inner threads of the slide blocks. The screw rod and slide blocks are arranged between the upper and lower plates.

Abstract: The present invention discloses a lead structure of the circuit, which comprises a first lead and a second lead. The first lead includes a first bump connecting part and a first lead segment. The first lead segment is connected to the first bump connecting part. The width of the first lead segment is smaller than the width of the first bump connecting part. The second lead is adjacent to the first lead and there is a lead gap therebetween. The second lead also includes a second bump connecting part and a first lead segment. The first lead segment of the second lead is connected to the second bump connecting part. The second bump connecting part and the first bump connecting part are arranged staggeredly. The second bump connecting part is adjacent to the first lead segment of the first lead.

Abstract: The present invention provides a manufacturing method for an electronic element of an electronic apparatus. The electronic element includes a substrate, a bump and at least one under bump metal (UBM) layer. The manufacturing method includes sequentially disposing the UBM layer and the bump onto the substrate; and processing an etching operation at the UBM layer to form a breach structure.