Abstract: A photonic semiconductor device including a light-emitting component and a photonic integrated circuit is provided. The light-emitting component at least includes a gain medium layer, a first contact layer and a first optical coupling layer stacked to each other. The photonic integrated circuit includes a second optical coupling layer. The light-emitting component and the photonic integrated circuit are stacked in a stacking direction, the first optical coupling layer has a first taper portion, the second optical coupling layer has a second taper portion, and the first taper portion and the second taper portion overlap in the stacking direction. Accordingly, the light emitted from the gain medium layer may be transmitted to the second taper portion from the first taper portion by optical coupling in a short length of an optical coupling path.

Abstract: This document describes, among other things, systems and methods for generating advertising campaigns or listings utilizing catalog information. A method comprises receiving, by an online publication system, a product catalog; accessing, by the online publication system, a merchant profile; and using the product catalog and the merchant profile to develop advertising data, wherein the advertising data includes at least one of an advertising campaign, a marketplace listing, or a store listing.

Abstract: This document describes, among other things, systems and methods for generating advertising campaigns or listings utilizing catalog information. A method comprises receiving, by an online publication system, a product catalog; accessing, by the online publication system, a merchant profile; and using the product catalog and the merchant profile to develop advertising data, wherein the advertising data includes at least one of an advertising campaign, a marketplace listing, or a store listing.

Abstract: This document describes, among other things, systems and methods for generating advertising campaigns or listings utilizing catalog information. A method comprises receiving, by an online publication system, a product catalog; accessing, by the online publication system, a merchant profile; and using the product catalog and the merchant profile to develop advertising data, wherein the advertising data includes at least one of an advertising campaign, a marketplace listing, or a store listing. The advertising campaign is published across multiple communication channels and focuses on the merchant's identity in at least one of the communication channels and specific products sold by the merchant in at least one other communication channel.

Abstract: This document describes, among other things, systems and methods for generating advertising campaigns or listings utilizing catalog information. A method comprises receiving, by an online publication system, a product catalog; accessing, by the online publication system, a merchant profile; and using the product catalog and the merchant profile to develop advertising data, wherein the advertising data includes at least one of an advertising campaign, a marketplace listing, or a store listing. The advertising campaign is published across multiple communication channels and focuses on the merchant's identity in at least one of the communication channels and specific products sold by the merchant in at least one other communication channel.

Abstract: This document describes, among other things, systems and methods for generating advertising campaigns or listings utilizing catalog information. A method comprises receiving, by an online publication system, a product catalog; accessing, by the online publication system, a merchant profile; and using the product catalog and the merchant profile to develop advertising data, wherein the advertising data includes at least one of an advertising campaign, a marketplace listing, or a store listing.

Abstract: This document describes, among other things, systems and methods for generating advertising campaigns or listings utilizing catalog information. A method comprises receiving, by an online publication system, a product catalog; accessing, by the online publication system, a merchant profile; and using the product catalog and the merchant profile to develop advertising data, wherein the advertising data includes at least one of an advertising campaign, a marketplace listing, or a store listing.

Abstract: A semiconductor package comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an active surface, a back surface opposite to the active surface, an optical component disposed on the active surface, and a plurality of pads disposed on the active surface and electrically connected to the optical component; the pad extension traces are electrically connected to the pads; the via holes are formed through the chip and electrically connected to the pad extension traces; the lid is attached on the active surface of the chip; and the plurality of metal traces are disposed on the back surface of the chip, electrically connected to the plurality of via holes, and defines a plurality of solder pads thereon.

Abstract: The present invention provides methods and apparatuses for a multi symptom test system. The multi symptom test apparatus having a plurality of zones for testing a plurality of conditions comprises the plurality of zones configured to receive a test sample wherein the zones responsive to the test sample provides a result indicative of a particular vaginitis test result.

Abstract: A semiconductor package comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an active surface, a back surface opposite to the active surface, an optical component disposed on the active surface, and a plurality of pads disposed on the active surface and electrically connected to the optical component; the pad extension traces are electrically connected to the pads; the via holes are formed through the chip and electrically connected to the pad extension traces; the lid is attached on the active surface of the chip; and the plurality of metal traces are disposed on the back surface of the chip, electrically connected to the plurality of via holes, and defines a plurality of solder pads thereon.

Abstract: A semiconductor package structure comprises a chip, a plurality of via holes, a lid, an adhesive ring and a plurality of metal traces, wherein the chip has an optical component and a plurality of pads disposed on its active surfaces; the via holes penetrate the chip and are electrically connected to the pads; the lid is adhered onto the active surface of the chip by the adhesive ring such that the adhesive ring surrounds the optical component; and the plurality of metal traces is disposed on the back surface of the chip, electrically connected to the plurality of via holes, and used to define a plurality of solder pads thereon. The present invention also provides a method for manufacturing the semiconductor package structure.

Abstract: A semiconductor package structure comprises a chip, a plurality of pad extension traces, a plurality of via holes, a lid and a plurality of metal traces, wherein the chip has an optical component and a plurality of pads disposed on its active surface; pad extension traces are electrically connected to the pads; the via holes penetrate the chip and are electrically connected to the pad extension traces and exposed out of side surfaces of the semiconductor package structure; the lid is adhered onto the active surface of the chip; and the plurality of metal traces is disposed on the back surface of the chip, electrically connected to the plurality of via holes, and used to define a plurality of solder pads thereon. The present invention also provides a method for manufacturing the semiconductor package structure.