Abstract: An ESD protection device includes a PN diode formed in a semiconductor body. The PN diode has a first contact coupled to a metal structure on a front side of the semiconductor body and a second contact coupled to a metal structure on a back side of the semiconductor body. The metal coupled to the first contact is spaced apart from the metal coupled to the second contact by a thickness of the semiconductor body. This spacing greatly reduces the capacitance associated with the metal structures, which can substantially reduce the overall capacitance added to an I/O channel by the ESD protection device and thereby improve the performance of a high-speed circuit that uses the I/O channel.

Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.

Abstract: In some embodiments, the present disclosure relates to a wafer edge trimming apparatus that includes a processing chamber defined by chamber housing. Within the processing chamber is a wafer chuck configured to hold onto a wafer structure. Further, a blade is arranged near an edge of the wafer chuck and configured to remove an edge potion of the wafer structure and to define a new sidewall of the wafer structure. A laser sensor apparatus is configured to direct a laser beam directed toward a top surface of the wafer chuck. The laser sensor apparatus is configured to measure a parameter of an analysis area of the wafer structure. Control circuitry is to the laser sensor apparatus and the blade. The control circuitry is configured to start a damage prevention process when the parameter deviates from a predetermined threshold value by at least a predetermined shift value.

Abstract: Some implementations described herein provide a semiconductor structure. The semiconductor structure includes a first conductive structure disposed within a first layer of the semiconductor structure. The semiconductor structure includes a dielectric structure disposed within a second layer of the semiconductor structure, with the second layer being disposed on the first layer. The semiconductor structure includes a second conductive structure disposed within a recessed portion of the dielectric structure that extends to the first conductive structure, with the second conductive structure having a concave recessed portion on a top surface of the second conductive structure. The semiconductor structure includes multiple layers of conductive material disposed within the concave recessed portion of the second conductive structure.

Abstract: Some implementations described herein include systems and techniques for fabricating a wafer-on-wafer product using a filled lateral gap between beveled regions of wafers included in a stacked-wafer assembly and along a perimeter region of the stacked-wafer assembly. The systems and techniques include a deposition tool having an electrode with a protrusion that enhances an electromagnetic field along the perimeter region of the stacked-wafer assembly during a deposition operation performed by the deposition tool. Relative to an electromagnetic field generated by a deposition tool not including the electrode with the protrusion, the enhanced electromagnetic field improves the deposition operation so that a supporting fill material may be sufficiently deposited.

Abstract: An electrostatic discharge (ESD) protection apparatus and method for fabricating the same are disclosed herein. In some embodiments, the ESD protection apparatus, comprises: an internal circuit patterned in a device wafer and electrically coupled between a first node and a second node, an array of electrostatic discharge (ESD) circuits patterned in a carrier wafer, where the ESD circuits are electrically coupled between a first node and a second node and configured to protect the internal circuit from transient ESD events, and where the device wafer is bonded to the carrier wafer.

Abstract: An electronic package is provided, in which a first electronic element and at least one support member are disposed on a carrier structure, a spacer is disposed on the first electronic element, and a second electronic element is disposed on the at least one support member and the spacer, so as to prevent the second electronic element from tilting during a wire bonding process.

Abstract: A manufacturing system of an electronic-grade ammonia solution comprises: a mixing tank to mix an unsaturated ammonia aqueous solution and alkali to obtain a mixing solution; a stripping unit, disposes downstream the mixing tank and comprises a heat exchanger to heat the mixing solution, and a stripping column to mix a nitrogen gas and the heated mixing solution to obtain a mixing gas; a first absorption unit, disposes downstream the stripping unit and comprises a first condensation unit to cool down the mixing gas, and a first absorption column to mix a saturated ammonia aqueous solution and the cooled mixing gas to obtain a purge gas; and a second absorption unit, disposes downstream the first absorption unit and comprises a second condensation unit to cool down a DI water, and a second absorption column to mix the cooled DI water and the purge gas to obtain electronic-grade ammonia solution.

Abstract: A lamp, including a PCB, a plurality of light sources, a lampshade, and a lamp holder connector; the plurality of light sources are arranged on the bottom surface of the PCB, the lampshade is connected with the PCB from below, the lamp holder connector is connected with a power circuit through the PCB, and the power circuit is connected with the plurality of light sources by the PCB. The present invention employs LED as the light source, thus the light will not emit upwards and emits the object directly, the reflected light loss is reduced, and the luminous efficiency is increased.

Abstract: A manufacturing system of an electronic-grade ammonia solution comprises: a mixing tank to mix an unsaturated ammonia aqueous solution and alkali to obtain a mixing solution; a stripping unit, disposes downstream the mixing tank and comprises a heat exchanger to heat the mixing solution, and a stripping column to mix a nitrogen gas and the heated mixing solution to obtain a mixing gas; a first absorption unit, disposes downstream the stripping unit and comprises a first condensation unit to cool down the mixing gas, and a first absorption column to mix a saturated ammonia aqueous solution and the cooled mixing gas to obtain a purge gas; and a second absorption unit, disposes downstream the first absorption unit and comprises a second condensation unit to cool down a DI water, and a second absorption column to mix the cooled DI water and the purge gas to obtain electronic-grade ammonia solution.

Abstract: A communication system, a mobile communication apparatus and a switching method of subscriber identification information are disclosed. The switching method includes following steps. First subscriber identification information of a first subscriber identification card is stored into a home location register (HLR) of a mobile telecom network by a first mobile communication device. A request instruction is sent by a second mobile communication device. The request instruction is verified by the mobile telecom network. If the request instruction passes the verification, the first subscriber identification information is duplicated and transmitted to the second mobile communication device.

Abstract: A communication system, a mobile communication apparatus and a switching method of subscriber identification information are disclosed. The switching method includes following steps. First subscriber identification information of a first subscriber identification card is stored into a home location register (HLR) of a mobile telecom network by a first mobile communication device. A request instruction is sent by a second mobile communication device. The request instruction is verified by the mobile telecom network. If the request instruction passes the verification, the first subscriber identification information is duplicated and transmitted to the second mobile communication device.

Abstract: A method of establishing map data for a navigation device is disclosed. The navigation device includes a position device for receiving satellite signals to obtain coordinates of the navigation device, a user interface for receiving a command, a map database for storing map data, and a navigation processor coupled to the user interface, the position device and the map database for outputting a comparison result according to the command, the coordinates and the map data. The method includes recording the plurality of coordinates of the position device, comparing the plurality of coordinates with the map data to generate the comparison result, and determining whether to update or establish new map data according to the command.

Abstract: A method for legitimately unlocking a SIM card lock, using an unlocking server connected to a USSD gateway, is for unlocking a SIM card lock set by a telecommunications service provider to a mobile terminal of a subscriber. Upon receiving an unlocking request that is transmitted from the mobile terminal and through the USSD gateway and that includes subscriber data and a USSD code representing activation of the unlocking request, the unlocking server requests the telecommunications service provider to verify, with reference to the subscriber data, whether the subscriber has a right to unlock the SIM card lock. Upon receiving verification from the telecommunications service provider that the subscriber has the right to unlock, the unlocking server transmits an unlocking program and an unlocking password to the mobile terminal such that the mobile terminal may execute the unlocking program and load the unlocking password for unlocking the SIM card lock.

Abstract: A wireless communication user system for a wireless communication system includes an identity device and a communication device. The communication device is capable of establishing a near field connection with the identity device, so as to output a control command to the identity device via the near field connection, to obtain contents of a Subscriber Identity Module (SIM) card embedded in the identity device, and execute a wireless communication function of the wireless communication system with the contents of the SIM card.

Abstract: A method for legitimately unlocking a SIM card lock, using an unlocking server connected to a USSD gateway, is for unlocking a SIM card lock set by a telecommunications service provider to a mobile terminal of a subscriber. Upon receiving an unlocking request that is transmitted from the mobile terminal and through the USSD gateway and that includes subscriber data and a USSD code representing activation of the unlocking request, the unlocking server requests the telecommunications service provider to verify, with reference to the subscriber data, whether the subscriber has a right to unlock the SIM card lock. Upon receiving verification from the telecommunications service provider that the subscriber has the right to unlock, the unlocking server transmits an unlocking program and an unlocking password to the mobile terminal such that the mobile terminal may execute the unlocking program and load the unlocking password for unlocking the SIM card lock.

Abstract: The invention is relative to a ceramic socket, which is established on the baseboard of lamps and lanterns through bearing leg. The said socket consists of a body and a cap. The lateral side of body where the cap fastens on it and towards the baseboard has wire entrances for polar wires. Polar wires go into the baseboard through their independent entrance connect to corresponding slug and tongue in order to settle wires between the socket and the baseboard. This structure avoids the shadow projected on the lamp body to affect the appearance. On the other hand, wires being concealed between the socket and the baseboard are isolated from lamps. Even it multiple lamps sit on a single socket, this structure will still remove hidden peril of short circuit even when the electrical insulating material of the wire sheet is heated or damaged.