Abstract: An ESD protection device includes a PN diode formed in a semiconductor body. The PN diode has a first contact coupled to a metal structure on a front side of the semiconductor body and a second contact coupled to a metal structure on a back side of the semiconductor body. The metal coupled to the first contact is spaced apart from the metal coupled to the second contact by a thickness of the semiconductor body. This spacing greatly reduces the capacitance associated with the metal structures, which can substantially reduce the overall capacitance added to an I/O channel by the ESD protection device and thereby improve the performance of a high-speed circuit that uses the I/O channel.

Abstract: A method includes forming a first sealing layer at a first edge region of a first wafer; and bonding the first wafer to a second wafer to form a wafer stack. At a time after the bonding, the first sealing layer is between the first edge region of the first wafer and a second edge region of the second wafer, with the first edge region and the second edge region comprising bevels. An edge trimming process is then performed on the wafer stack. After the edge trimming process, the second edge region of the second wafer is at least partially removed, and a portion of the first sealing layer is left as a part of the wafer stack. An interconnect structure is formed as a part of the second wafer. The interconnect structure includes redistribution lines electrically connected to integrated circuit devices in the second wafer.

Abstract: This disclosure relates to a surgical tool configured for holding an implant includes an inner rod and a sleeve. The inner rod includes a rod portion and a holding portion. The holding portion is located at one end of the rod portion and has a first accommodation space configured for accommodating at least part of the implant. The sleeve includes a sleeving portion and a retaining portion. The sleeving portion is slidably sleeved on the rod portion of the inner rod. The retaining portion is located at one end of the sleeving portion and selectively presses against the holding portion. The inner rod further includes at least one fin portion protruded from the holding portion and located in the first accommodation space for being inserted into at least one slot of the implant.

Abstract: A method for detecting topology, a compute node, and a storage node are proposed. In this disclosure, the compute node and the storage node exchange identity information with each other. Next, each of the compute node and the storage node combines the identity information thereof and the identification information of the other based on the same rule to generate the same connection identification for characterizing the connection relationship between the compute node and the storage node. Accordingly, the maintenance and management of a data center may be more convenient and less expensive.

Abstract: A method for detecting topology, a compute node, and a storage node are proposed. In this disclosure, the compute node and the storage node exchange identity information with each other. Next, each of the compute node and the storage node combines the identity information thereof and the identification information of the other based on the same rule to generate the same connection identification for characterizing the connection relationship between the compute node and the storage node. Accordingly, the maintenance and management of a data center may be more convenient and less expensive.