Abstract: Some implementations described herein include systems and techniques for fabricating a stacked die product. The systems and techniques include using a supporting fill mixture that includes a combination of types of composite particulates in a lateral gap region of a stack of semiconductor substrates and along a perimeter region of the stack of semiconductor substrates. One type of composite particulate included in the combination may be a relatively smaller size and include a smooth surface, allowing the composite particulate to ingress deep into the lateral gap region. Properties of the supporting fill mixture including the combination of types of composite particulates may control thermally induced stresses during downstream manufacturing to reduce a likelihood of defects in the supporting fill mixture and/or the stack of semiconductor substrates.

Abstract: A field effect transistor includes a substrate having a transistor forming region thereon; an insulating layer on the substrate; a first graphene layer on the insulating layer within the transistor forming region; an etch stop layer on the first graphene layer within the transistor forming region; a first inter-layer dielectric layer on the etch stop layer; a gate trench recessed into the first inter-layer dielectric layer and the etch stop layer within the transistor forming region; a second graphene layer on interior surface of the gate trench; a gate dielectric layer on the second graphene layer and on the first inter-layer dielectric layer; and a gate electrode on the gate dielectric layer within the gate trench.

Abstract: A bond head is provided. The bond head includes a bond base, a chuck member, and an elastic material. The chuck member protrudes from a surface of the bond base, and has a chuck surface formed with vacuum holes for holding a die using differential air pressure. In the direction parallel to the chuck surface, the width of the chuck surface is less than the width of the bond base and is equal to or greater than the width of the die. The elastic material is disposed over the chuck surface. The elastic material is arranged around the periphery of the chuck surface to cover edges and/or corners of the chuck surface.

Abstract: A light-emitting-diode (LED) protection circuit, comprising: a light-emitting-diode module; two fuse elements, connected respectively to said LED module; and a discharge protection element, connected to said LED module and said two fuse elements. When current flowing through said fuse element exceeds a current protection value, said fuse element will turn into an open circuit state, to cut off an over current and prevent it from flowing to said LED module to avoid damages. In addition, when instantaneous high voltage occurs, such as incurred by a spike or a lightning, said discharge protection element can be used as an over current discharge route, to provide said LED module with a current bypass route.

Abstract: A light adjusting circuit, it provide power required for an overall operation of light adjusting circuit, and it utilizes a light adjusting controller to perform light adjusting of load. During light adjusting, in case operating voltage of a driving controller is equal to or greater than a threshold value, then a rectifier or a power controller provides a first power supply to driving controller through an AC voltage adjusted by light adjusting controller, so that it can regulate a driving voltage through power controller based on DC voltage variation, to drive a load. Otherwise, in case operating voltage of driving controller is less than threshold value, it is switched to a battery to provide a second power supply to driving controller, to make it have stable operating voltage, control power controller to output driving voltage to load, to eliminate blinking of load when conduction angle is small.

Abstract: A light-emitting-diode (LED) protection circuit, comprising: a light-emitting-diode module; two fuse elements, connected respectively to said LED module; and a discharge protection element, connected to said LED module and said two fuse elements. When current flowing through said fuse element exceeds a current protection value, said fuse element will turn into an open circuit state, to cut off an over current and prevent it from flowing to said LED module to avoid damages. In addition, when instantaneous high voltage occurs, such as incurred by a spike or a lightning, said discharge protection element can be used as an over current discharge route, to provide said LED module with a current bypass route.