Abstract: Methods for improving sealing between contact plugs and adjacent dielectric layers and semiconductor devices formed by the same are disclosed. In an embodiment, a semiconductor device includes a first dielectric layer over a conductive feature, a first portion of the first dielectric layer including a first dopant; a metal feature electrically coupled to the conductive feature, the metal feature including a first contact material in contact with the conductive feature; a second contact material over the first contact material, the second contact material including a material different from the first contact material, a first portion of the second contact material further including the first dopant; and a dielectric liner between the first dielectric layer and the metal feature, a first portion of the dielectric liner including the first dopant.

Abstract: An infrared filter film layer and an infrared filter structure are provided. The infrared filter film layer includes at least one silicon-based layer, at least one isolation layer, and at least one oxide layer that are stacked with each other. The at least one isolation layer is disposed between the at least one silicon-based layer and the at least one oxide layer. Through this configuration, the infrared filter film layer has good quality, such that an amount of wavelength drift is small in application. The infrared filter structure includes a light-transmitting substrate and the infrared filter film layer.

Abstract: A smart projection vehicle lamp includes laser light sources, two-dimensional MEMS mirrors, focusing lenses, a reflective phosphor plate, a narrow-band blue light reflector, and a lens group. The two-dimensional MEMS mirrors are correspondingly arranged on paths of laser light beams of the laser light sources. The laser light beams are dynamically reflected by the two-dimensional MEMS mirrors. The reflective phosphor plate has a phosphor layer and a reflective layer located on one side of the phosphor layer. The narrow-band blue light reflector is disposed between the focusing lenses and the reflective phosphor plate, and has a reflective band and a transmissive band. The converged laser light beams are reflected by the reflective band and illuminate the reflective phosphor plate. The laser light beams excite the phosphor layer and are mixed into visible light reflected by the reflective layer and passes through the transmissive band to be emitted outward.

Abstract: A liquid cooling module includes a housing having first and second chambers filled with a working fluid and intercommunicating with each other via an intercommunicating port and a backflow port. A pump is received in the housing and is aligned with the intercommunicating port. The pump includes a stator driving an impeller to rotate, driving the working fluid to flow from the first chamber through the intercommunicating port, the stator, and the impeller. The working fluid flows through the second chamber back into the first chamber via the backflow port. An electronic device includes a casing, an electric module received in the casing and including a heat generating area, and the liquid cooling module. The liquid cooling module is disposed in the casing and is in thermal connection with the heat generating area via a heat absorbing zone of the housing aligned with the first chamber or the second chamber.

Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.

Abstract: An immersion cooling system includes a sealed tank having a chamber. A circulating layer and a working layer are respectively formed by first and second working liquids filled in the chamber and are contiguous to each other. The boiling point of the second working liquid is higher than that of the first working liquid. The density of the second working liquid is lower than that of the first working liquid. The first and second working liquids do not dissolve in each other. A circulating cooling module includes a circulating pipeline having first and second ports located in the chamber. The circulating pipeline also has a heat absorbing section and a condensation section located between the first and second ports. The heat absorbing section is located in the working layer. The first working liquid flows into the circulating pipeline from the first port and circulates in the circulating pipeline.

Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.

Abstract: An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.

Abstract: A slim pump according to the present invention includes a frame, a shaft-coupling portion, a stator, and an impeller. The frame includes an interior separated by a partitioning board into a first chamber and a second chamber. A flow inlet intercommunicates with the first chamber and a flow outlet intercommunicates with the second chamber. The first chamber is intercommunicated with the second chamber via a communication hole of the partitioning board. The shaft-coupling portion is located in the frame. The stator is disposed around the shaft-coupling portion and is located within an axial extent of the first chamber. The stator is axially aligned with the communication hole. The impeller includes a plurality of blades and an inlet opening located in the second chamber. The inlet opening faces and axially aligns with the communication hole.

Abstract: A cooling module includes a first casing, a second casing, and a cooling unit. The first casing includes a lower chamber filled with at least one working fluid. The first casing includes a heat source connecting face. The second casing includes an upper chamber. The cooling unit is located between the first and second casings. The cooling unit includes a plurality of tubes. Each of the plurality of tubes includes an end intercommunicating with the lower chamber and another end intercommunicating with the upper chamber, thereby the lower and upper chambers intercommunicate with each other. A plurality of cooling fin units is coupled to outer peripheries of the plurality of tubes. An angle between each of the plurality of tubes and the heat source connecting face is larger than 0° and smaller than 90°, or each of the plurality of tubes is parallel to the heat source connecting face.

Abstract: An immersion cooling system includes a sealed tank having a chamber. A circulating layer and a working layer are respectively formed by first and second working liquids filled in the chamber and are contiguous to each other. The boiling point of the second working liquid is higher than that of the first working liquid. The density of the second working liquid is lower than that of the first working liquid. The first and second working liquids do not dissolve in each other. A circulating cooling module includes a circulating pipeline having first and second ports located in the chamber. The circulating pipeline also has a heat absorbing section and a condensation section located between the first and second ports. The heat absorbing section is located in the working layer. The first working liquid flows into the circulating pipeline from the first port and circulates in the circulating pipeline.

Abstract: A liquid cooling module includes a housing having first and second chambers filled with a working fluid and intercommunicating with each other via an intercommunicating port and a backflow port. A pump is received in the housing and is aligned with the intercommunicating port. The pump includes a stator driving an impeller to rotate, driving the working fluid to flow from the first chamber through the intercommunicating port, the stator, and the impeller. The working fluid flows through the second chamber back into the first chamber via the backflow port. An electronic device includes a casing, an electric module received in the casing and including a heat generating area, and the liquid cooling module. The liquid cooling module is disposed in the casing and is in thermal connection with the heat generating area via a heat absorbing zone of the housing aligned with the first chamber or the second chamber.

Abstract: A slurry solution for a Chemical Mechanical Polishing (CMP) process includes a wetting agent, a stripper additive that comprises at least one of: N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, and dimethylformamide (DMF), and an oxidizer additive comprising at least one of: hydrogen peroxide (H2O2), ammonium persulfate ((NH4)2S2O8), peroxymonosulfuric acid (H2SO5), ozone (O3) in de-ionized water, and sulfuric acid (H2SO4).

Abstract: A slim pump according to the present invention includes a frame, a shaft-coupling portion, a stator, and an impeller. The frame includes an interior separated by a partitioning board into a first chamber and a second chamber. A flow inlet intercommunicates with the first chamber and a flow outlet intercommunicates with the second chamber. The first chamber is intercommunicated with the second chamber via a communication hole of the partitioning board. The shaft-coupling portion is located in the frame. The stator is disposed around the shaft-coupling portion and is located within an axial extent of the first chamber. The stator is axially aligned with the communication hole. The impeller includes a plurality of blades and an inlet opening located in the second chamber. The inlet opening faces and axially aligns with the communication hole.

Abstract: A ceiling fan includes a support unit, a stator, a rotor and a lamp. The support unit includes an axle and a magnetic disc fit around the axle. The stator is fit around the axle. The rotor has a plurality of blades rotatably mounted to the axle. The lamp includes a housing and a light emitting portion below a magnetic top face of the housing. The magnetic top face of the housing is attracted to the magnetic disc.

Abstract: An inner-rotor motor including a housing, a stator and a rotor avoids damage to the coil unit which often occurs during assembly of the conventional inner-rotor motor. The housing has an inner periphery provided with a plurality of protrusions. The iron core has an outer periphery provided with a plurality of notches. The insulating sleeve includes a plurality of positioning members. In radial directions perpendicular to the shaft, each of the plurality of notches is spaced from a center of a shaft at a minimal distance, and each of the plurality of positioning members is spaced from the center of the shaft at a maximal distance. The maximal distance is smaller than the minimal distance.

Abstract: A method includes following steps. A semiconductor substrate is etched to form semiconductor fins. A dielectric material is deposited into a trench between the semiconductor fins. The semiconductor fins are etched such that top ends of the semiconductor fins are lower than a top surface of the dielectric material. After etching the semiconductor fins, epitaxially growing epitaxial fins on the semiconductor fins, respectively. A chemical mechanical polish (CMP) process is performed on the epitaxial fins, followed by cleaning the epitaxial fins using a non-contact-type cleaning device. The dielectric material is then such that the top surface of the dielectric material is lower than top ends of the epitaxial fins. A gate structure is formed across the epitaxial fins.

Abstract: A method of manufacturing an integrated circuit device is provided. A first feature, which has a first susceptibility to damage by chemical mechanical processing (CMP), is formed at a first height as measured from an upper surface of the substrate. A second feature, which has a second susceptibility to damage by the CMP, is formed at a second height as measured from the upper surface of the substrate and is laterally spaced from the first feature by a recess. The second height is greater than the first height, and the second susceptibility is less than the first susceptibility. A sacrificial coating is formed in the recess over an uppermost surface of the first feature. CMP is performed to remove a first portion of the sacrificial coating and expose an upper surface of the second feature while leaving a second portion of the sacrificial coating in place over the first feature.

Abstract: The present disclosure provides a fluid transportation device. The fluid transportation device includes a casing and a fluid driving member. The casing has a first shell and a second shell divided along an axial direction. The first shell and the second shell are assembled to be opposite to each other. The casing has an accommodating space, a first transporting portion, and a second transporting portion. The first transporting portion and the second transporting portion are in communication with the accommodating space. The fluid driving member has a first fan wheel, a second fan wheel, and a motor. The first fan wheel, the second fan wheel, and the motor are disposed in the accommodating space. The motor is configured to drive the first fan wheel and the second fan wheel to rotate.

Abstract: A slurry solution for a Chemical Mechanical Polishing (CMP) process includes a wetting agent, a stripper additive that comprises at least one of: N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), sulfolane, and dimethylformamide (DMF), and an oxidizer additive comprising at least one of: hydrogen peroxide (H2O2), ammonium persulfate ((NH4)2S2O8), peroxymonosulfuric acid (H2SO5), ozone (O3) in de-ionized water, and sulfuric acid (H2SO4).