Patents by Inventor Kuo Ying HUNG

Kuo Ying HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9967968
    Abstract: A 3D Electromagnetic Interference (EMI) suppression structure and an electronic device having the same, wherein a coplanar waveguide structure, an isolation layer, and a resonance layer may be installed. Furthermore, under the coplanar waveguide structure, the 3D EMI structure may be installed to connect to a conductor part of the resonance layer through a conductive connection part of the isolation layer, thereby further improving the EMI suppression effect and producing an excellent EMI suppression effect.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: May 8, 2018
    Assignee: SK Hynix Inc.
    Inventor: Kuo Ying Hung
  • Patent number: 9668390
    Abstract: An electromagnetic interference suppressing structure including a multi-layered substrate; a differential pair including first and second signal lines which are disposed on a first layer of the multi-layered substrate; and two grounding recess structures disposed symmetrically in a second layer of the multi-layered substrate which is positioned under the first layer, and on both sides, respectively, of the differential pair, wherein no electrical coupling element extends across a region lying directly under the differential pair, between the two grounding recess structures.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: May 30, 2017
    Assignee: SK Hynix Inc.
    Inventor: Kuo Ying Hung
  • Publication number: 20170064815
    Abstract: A 3D Electromagnetic Interference (EMI) suppression structure and an electronic device having the same, wherein a coplanar waveguide structure, an isolation layer, and a resonance layer may be installed. Furthermore, under the coplanar waveguide structure, the 3D EMI structure may be installed to connect to a conductor part of the resonance layer through a conductive connection part of the isolation layer, thereby further improving the EMI suppression effect and producing an excellent EMI suppression effect.
    Type: Application
    Filed: July 18, 2016
    Publication date: March 2, 2017
    Inventor: Kuo Ying HUNG
  • Publication number: 20160197389
    Abstract: An electromagnetic interference suppressing structure including a multi-layered substrate; a differential pair including first and second signal lines which are disposed on a first layer of the multi-layered substrate; and two grounding recess structures disposed symmetrically in a second layer of the multi-layered substrate which is positioned under the first layer, and on both sides, respectively, of the differential pair, wherein no electrical coupling element extends across a region lying directly under the differential pair, between the two grounding recess structures.
    Type: Application
    Filed: October 8, 2015
    Publication date: July 7, 2016
    Inventor: Kuo Ying HUNG