Abstract: A bonded assembly includes an interposer; a semiconductor die that is attached to the interposer and including a planar horizontal bottom surface and a contoured sidewall; a high bandwidth memory (HBM) die that is attached to the interposer; and a dielectric material portion contacting the semiconductor die and the interposer. The contoured sidewall includes a vertical sidewall segment and a non-horizontal, non-vertical surface segment that is adjoined to a bottom edge of the vertical sidewall segment and is adjoined to an edge of the planar horizontal bottom surface of the semiconductor die. The vertical sidewall segment and the non-horizontal, non-vertical surface segment are in contact with the dielectric material portion. The contoured sidewall may provide a variable lateral spacing from the HBM die to reduce local stress in a portion of the HBM die that is proximal to the interposer.

Abstract: A manufacturing method of filling a resin into a housing includes the steps of: providing a housing that has at least one recess, with the recess having first and second spaces, and the first space being disposed above the second space; inverting the housing; injecting a fluid into the recess to fill the first space, with the fluid having a viscosity coefficient and a surface tension less than those of water; and injecting a first resin into the recess, with the first resin having a specific gravity greater than that of the fluid, such that the first resin fills the first space and the fluid fills the second space.

Abstract: A manufacturing method of filling a resin into a housing includes the steps of: providing a housing that has at least one recess, with the recess having first and second spaces, and the first space being disposed above the second space; inverting the housing; injecting a fluid into the recess to fill the first space, with the fluid having a viscosity coefficient and a surface tension less than those of water; and injecting a first resin into the recess, with the first resin having a specific gravity greater than that of the fluid, such that the first resin fills the first space and the fluid fills the second space.