Patents by Inventor Kuok Sang Leong

Kuok Sang Leong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7717749
    Abstract: A multiport connector which includes a housing having at least two aligned compartments, each compartment being structured and arranged to receive respective plugs. A multilayer printed wiring board separates the two compartments, the printed wiring board having circuit patterns on opposite sides of opposed non-conductive layers and a metal shielding layer intermediate the non-conductive layers. A first plurality of conductive contact fingers is disposed in one of the compartments, the first plurality of fingers having first portions for making electrical contact with one of the plugs and second portions for making contact with the circuit pattern on one of the non-conductive layers of the multilayer printed wiring board.
    Type: Grant
    Filed: September 8, 2003
    Date of Patent: May 18, 2010
    Assignee: Bel Fuse, Inc.
    Inventors: John Chen, Kwok Fai Lai, Kuok Sang Leong, Man Tat Yip, Wai Shun Leung, Chun Wing Ng, Quincy Lee
  • Patent number: 7311562
    Abstract: An RJ-45 jack having a groove to accommodate the width of an RJ-11 plug to allow the plug to rise upward and away from the outer contacts of the RJ-45 contacts upon inadvertent insertion of an RJ-11 plug into the RJ-45 jack.
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: December 25, 2007
    Assignee: Bel-Fuse, Inc.
    Inventors: Kuok Sang Leong, Wai Shun Leung
  • Publication number: 20030022553
    Abstract: A multiport connector which includes a housing having at least two aligned compartments, each compartment being structured and arranged to receive respective plugs. A multilayer printed wiring board separates the two compartments, the printed wiring board having circuit patterns on opposite sides of opposed non-conductive layers and a metal shielding layer intermediate the non-conductive layers. A first plurality of conductive contact fingers is disposed in one of the compartments, the first plurality of fingers having first portions for making electrical contact with one of the plugs and second portions for making contact with the circuit pattern on one of the non-conductive layers of the multilayer printed wiring board.
    Type: Application
    Filed: August 2, 2001
    Publication date: January 30, 2003
    Applicant: Bel-Fuse, Inc.
    Inventors: John Chen, Kwok Fai Lai, Kuok Sang Leong, Man Tat Yip, Wai Shun Leung, Chun Wing Ng, Quincy Lee