Patents by Inventor Kuok Wai Chan

Kuok Wai Chan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrier
    Patent number: 10978378
    Abstract: A leadless package includes an at least partially electrically conductive carrier having a mounting section and a lead section, an electronic chip mounted on the mounting section, and an encapsulant at least partially encapsulating the electronic chip and partially encapsulating the carrier so that at least part of an interior sidewall of the lead section not forming part of an exterior sidewall of the package is exposed.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: April 13, 2021
    Assignee: Infineon Technologies AG
    Inventors: Thomas Bemmerl, Kuok Wai Chan, Christoph Liebl, Bun Kian Tay, Wee Boon Tay, Wae Chet Yong
  • Encapsulated Leadless Package Having an at Least Partially Exposed Interior Sidewall of a Chip Carrier
    Publication number: 20190189542
    Abstract: A leadless package includes an at least partially electrically conductive carrier having a mounting section and a lead section, an electronic chip mounted on the mounting section, and an encapsulant at least partially encapsulating the electronic chip and partially encapsulating the carrier so that at least part of an interior sidewall of the lead section not forming part of an exterior sidewall of the package is exposed.
    Type: Application
    Filed: December 13, 2018
    Publication date: June 20, 2019
    Inventors: Thomas Bemmerl, Kuok Wai Chan, Christoph Liebl, Bun Kian Tay, Wee Boon Tay, Wae Chet Yong