Patents by Inventor Kuolung (Dino) LEI

Kuolung (Dino) LEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reduction of chipping damage to MEMS structure
    Patent number: 9738511
    Abstract: A MEMS (microelectromechanical systems) structure comprises a MEMS wafer. A MEMS wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer. Unique configurations of MEMS devices and methods of providing such are set forth which provide for, in part, creating rounded, scalloped or chamfered MEMS profiles by shaping the etch mask photoresist reflow, by using a multi-step deep reactive ion etch (DRIE) with different etch characteristics, or by etching after DRIE.
    Type: Grant
    Filed: March 25, 2014
    Date of Patent: August 22, 2017
    Assignee: INVENSENSE, INC.
    Inventors: Jongwoo Shin, Kirt Reed Williams, Cerina Zhang, Kuolung (Dino) Lei
  • REDUCTION OF CHIPPING DAMAGE TO MEMS STRUCTURE
    Publication number: 20150076631
    Abstract: A MEMS (microelectromechanical systems) structure comprises a MEMS wafer. A MEMS wafer includes a cap with cavities bonded to a structural layer through a dielectric layer disposed between the cap and the structural layer. Unique configurations of MEMS devices and methods of providing such are set forth which provide for, in part, creating rounded, scalloped or chamfered MEMS profiles by shaping the etch mask photoresist reflow, by using a multi-step deep reactive ion etch (DRIE) with different etch characteristics, or by etching after DRIE.
    Type: Application
    Filed: March 25, 2014
    Publication date: March 19, 2015
    Applicant: InvenSense, Inc.
    Inventors: Jongwoo SHIN, Kirt Reed WILLIAMS, Cerina ZHANG, Kuolung (Dino) LEI