Patents by Inventor Kuo-Wei Huang

Kuo-Wei Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11970402
    Abstract: Disclosed herein are modified zeolites and methods for making modified zeolites. In one or more embodiments disclosed herein, a modified zeolite includes a microporous framework including a plurality of micropores having diameters of less than or equal to 2 nm and organometallic moieties each bonded to bridging oxygen atoms. The microporous framework includes at least silicon atoms and oxygen atoms. The organometallic moieties include a metal atom and a ring structure including the metal atom, a nitrogen atom, and one or more carbon atoms. The metal atom may be bonded to a bridging oxygen atom, and wherein the bridging oxygen atom bridges the metal atom of the organometallic moiety and a silicon atom of the microporous framework.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: April 30, 2024
    Assignees: King Abdullah University of Science and Technology, Saudi Arabian Oil Company
    Inventors: Robert Peter Hodgkins, Omer Refa Koseoglu, Jean-Marie Maurice Basset, Kuo-Wei Huang, Anissa Bendjeriou Sedjerari, Manoj K. Gangwar, Sathiyamoorthy Murugesan
  • Publication number: 20240130257
    Abstract: Devices and method for forming a switch including a heater layer including a first heater pad, a second heater pad, and a heater line connecting the first heater pad and the second heater pad, a phase change material (PCM) layer positioned in a same vertical plane as the heater line, and a floating spreader layer including a first portion positioned in the same vertical plane as the heater line and the PCM layer, in which the first portion has a first width that is less than or equal to a distance between proximate sidewalls of the first heater pad and the second heater pad.
    Type: Application
    Filed: April 21, 2023
    Publication date: April 18, 2024
    Inventors: Fu-Hai LI, Yi Ching ONG, Hsin Heng WANG, Tsung-Hao YEH, Yu-Wei TING, Kuo-Pin CHANG, Hung-Ju LI, Kuo-Ching HUANG
  • Patent number: 11963464
    Abstract: A memristor may include an exchange-coupled composite (ECC) portion to provide three or more nonvolatile magneto-resistive states. The ECC portion may include a continuous layer and a granular layer magnetically exchange coupled to the continuous layer. A plurality of memristors may be used in a system to, for example, define a neural network.
    Type: Grant
    Filed: February 22, 2021
    Date of Patent: April 16, 2024
    Assignee: Seagate Technology LLC
    Inventors: Cheng Wang, Pin-Wei Huang, Ganping Ju, Kuo-Hsing Hwang
  • Patent number: 11961840
    Abstract: A semiconductor device structure is provided. The device includes one or more first semiconductor layers, each first semiconductor layer of the one or more first semiconductor layers is surrounded by a first intermixed layer, wherein the first intermixed layer comprises a first material and a second material.
    Type: Grant
    Filed: August 9, 2022
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Mao-Lin Huang, Lung-Kun Chu, Chung-Wei Hsu, Jia-Ni Yu, Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang
  • Publication number: 20240118135
    Abstract: An information handling system includes a display panel having an active area that generates visual images and an inactive area disposed outside the active area. The inactive area having an alignment mark that is invisible to a naked eye.
    Type: Application
    Filed: October 7, 2022
    Publication date: April 11, 2024
    Inventors: Hong-Ji Huang, Yu-Chen Liu, Kuo-Wei Tseng, Chun-Wei Huang, Chi-Fong Lee
  • Publication number: 20240120313
    Abstract: A chip package structure is provided. The chip package structure includes a chip. The chip package structure includes a conductive ring-like structure over and electrically insulated from the chip. The conductive ring-like structure surrounds a central region of the chip. The chip package structure includes a first solder structure over the conductive ring-like structure. The first solder structure and the conductive ring-like structure are made of different materials.
    Type: Application
    Filed: December 18, 2023
    Publication date: April 11, 2024
    Inventors: Sheng-Yao YANG, Ling-Wei LI, Yu-Jui WU, Cheng-Lin HUANG, Chien-Chen LI, Lieh-Chuan CHEN, Che-Jung CHU, Kuo-Chio LIU
  • Publication number: 20240120402
    Abstract: A semiconductor device structure, along with methods of forming such, are described. The semiconductor device structure includes a first dielectric feature extending along a first direction, the first dielectric feature comprising a first dielectric layer having a first sidewall and a second sidewall opposing the first sidewall, a first semiconductor layer disposed adjacent the first sidewall, the first semiconductor layer extending along a second direction perpendicular to the first direction, a second dielectric feature extending along the first direction, the second dielectric feature disposed adjacent the first semiconductor layer, and a first gate electrode layer surrounding at least three surfaces of the first semiconductor layer, and a portion of the first gate electrode layer is exposed to a first air gap.
    Type: Application
    Filed: November 19, 2023
    Publication date: April 11, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Jia-Ni YU, Kuo-Cheng CHIANG, Mao-Lin HUANG, Lung-Kun CHU, Chung-Wei HSU, Chun-Fu LU, Chih-Hao WANG, Kuan-Lun CHENG
  • Publication number: 20240113195
    Abstract: Semiconductor structures and methods for forming the same are provided. The semiconductor structure includes a plurality of first nanostructures formed over a substrate, and a dielectric wall adjacent to the first nanostructures. The semiconductor structure also includes a first liner layer between the first nanostructures and the dielectric wall, and the first liner layer is in direct contact with the dielectric wall. The semiconductor structure also includes a gate structure surrounding the first nanostructures, and the first liner layer is in direct contact with a portion of the gate structure.
    Type: Application
    Filed: February 22, 2023
    Publication date: April 4, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jia-Ni YU, Lung-Kun CHU, Chun-Fu LU, Chung-Wei HSU, Mao-Lin HUANG, Kuo-Cheng CHIANG, Chih-Hao WANG
  • Patent number: 11948987
    Abstract: A semiconductor device according to the present disclosure includes a source feature and a drain feature, a plurality of semiconductor nanostructures extending between the source feature and the drain feature, a gate structure wrapping around each of the plurality of semiconductor nanostructures, a bottom dielectric layer over the gate structure and the drain feature, a backside power rail disposed over the bottom dielectric layer, and a backside source contact disposed between the source feature and the backside power rail. The backside source contact extends through the bottom dielectric layer.
    Type: Grant
    Filed: September 9, 2020
    Date of Patent: April 2, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Lung-Kun Chu, Mao-Lin Huang, Chung-Wei Hsu, Jia-Ni Yu, Kuo-Cheng Chiang, Kuan-Lun Cheng, Chih-Hao Wang
  • Publication number: 20240101434
    Abstract: Disclosed herein are modified zeolites and methods for making modified zeolites. In one or more embodiments disclosed herein, a modified zeolite may include a microporous framework including a plurality of micropores having diameters of less than or equal to 2 nm. The microporous framework may include at least silicon atoms and oxygen atoms. The modified zeolite may further include organometallic moieties each bonded to a nitrogen atom of a secondary amine functional group comprising a nitrogen atom and a hydrogen atom. The organometallic moieties may comprise a hafnium atom that is bonded to the nitrogen atom of the secondary amine functional group. The nitrogen atom of the secondary amine function group may bridge the hafnium atom of the organometallic moiety and a silicon atom of the microporous framework.
    Type: Application
    Filed: July 27, 2023
    Publication date: March 28, 2024
    Applicants: Saudi Arabian Oil Company, King Abdullah University of Science and Technology
    Inventors: Robert Peter Hodgkins, Omer Refa Koseoglu, Jean-Marie Maurice Basset, Kuo-Wei Huang, Anissa Bendjeriou Sedjerari, Sathiyamoorthy Murugesan, Manoj K. Gangwar
  • Publication number: 20240096880
    Abstract: In some embodiments, the present disclosure relates to an integrated chip. The integrated chip includes a first channel structure configured to transport charge carriers within a first transistor device and a first gate electrode layer wrapping around the first channel structure. A second channel structure is configured to transport charge carriers within a second transistor device. A second gate electrode layer wraps around the second channel structure. The second gate electrode layer continuously extends from around the second channel structure to cover the first gate electrode layer. A third channel structure is configured to transport charge carriers within a third transistor device. A third gate electrode layer wraps around the third channel structure. The third gate electrode layer continuously extends from around the third channel structure to cover the second gate electrode layer.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 21, 2024
    Inventors: Mao-Lin Huang, Chih-Hao Wang, Kuo-Cheng Chiang, Jia-Ni Yu, Lung-Kun Chu, Chung-Wei Hsu
  • Patent number: 11932546
    Abstract: Disclosed herein are modified zeolites and methods for making modified zeolites. In one or more embodiments disclosed herein, a modified zeolite may include a microporous framework including a plurality of micropores having diameters of less than or equal to 2 nm. The microporous framework includes at least silicon atoms and oxygen atoms. The modified zeolite may further include organometallic moieties each bonded to bridging oxygen atoms. The organometallic moieties include a hafnium atom. The hafnium atom is bonded to a bridging oxygen atom, and bridging oxygen atom bridges the hafnium atom of the organometallic moiety and a silicon atom of the microporous framework.
    Type: Grant
    Filed: January 26, 2023
    Date of Patent: March 19, 2024
    Assignees: King Abdullah University of Science and Technology, Saudi Arabian Oil Company
    Inventors: Robert Peter Hodgkins, Omer Refa Koseoglu, Jean-Marie Maurice Basset, Kuo-Wei Huang, Anissa Bendjeriou Sedjerari, Manoj K. Gangwar, Sathiyamoorthy Murugesan
  • Publication number: 20240083758
    Abstract: Embodiments of the present disclosure relate to zeolites and method for making such zeolites. According to embodiments disclosed herein, a zeolite may have a microporous framework including a plurality of micropores having diameters of less than or equal to 2 nm and a plurality of mesopores having diameters of greater than 2 nm and less than or equal to 50 nm. The microporous framework may include an MFI framework type. The microporous framework may include silicon atoms, aluminum atoms, oxygen atoms, and transition metal atoms. The transition metal atoms may be dispersed throughout the entire microporous framework.
    Type: Application
    Filed: October 25, 2023
    Publication date: March 14, 2024
    Applicants: Saudi Arabian Oil Company, King Abdullah University of Science and Technology
    Inventors: Robert Peter Hodgkins, Omer Refa Koseoglu, Kuo-Wei Huang, Jean-Marie Maurice Basset, Yu Han, Rajesh Parsapur, Anissa Bendjeriou Sedjerari, Sathiyamoorthy Murugesan
  • Publication number: 20240079850
    Abstract: A semiconductor device includes a first contact layer, a second contact layer, an active layer, a photonic crystal layer, a passivation layer, a first electrode and a second electrode. The first contact layer has a first surface and a second surface opposite to each other. Microstructures are located on the second surface. The second contact layer is located below the first surface. The active layer is located between the first contact layer and the second contact layer. The photonic crystal layer is located between the active layer and the second contact layer. The passivation layer is located on the second contact layer. The first electrode is located on the passivation layer and is electrically connected the first surface of the first contact layer. The second electrode is located on the passivation layer and is electrically connected to the second contact layer.
    Type: Application
    Filed: December 28, 2022
    Publication date: March 7, 2024
    Inventors: Wen-Cheng HSU, Yu-Heng HONG, Yao-Wei HUANG, Kuo-Bin HONG, Hao-Chung KUO
  • Publication number: 20240060196
    Abstract: A cell for enhancing a lithium (Li) concentration in a stream includes a housing; a dense lithium selective membrane located in the housing and dividing the housing into a first compartment and a second compartment; a cathode electrode located in the first compartment; an anode electrode located in the second compartment; a first piping circuit fluidly connected to the second compartment and configured to supply a feed stream to the second compartment; a second piping circuit fluidly connected to the first compartment and configured to circulate an enrichment stream through the first compartment; and a power source configured to apply a voltage between the cathode electrode and the anode electrode to initiate an oxidative electrochemical reaction on the anode electrode and a reductive electrochemical reaction on the cathode electrode. The dense lithium selective membrane has a thickness less than 400 ?m.
    Type: Application
    Filed: January 18, 2022
    Publication date: February 22, 2024
    Inventors: Zhiping LAI, Zhen LI, Kuo-Wei HUANG
  • Patent number: 11901596
    Abstract: The present disclosure relates generally to portable energy generation devices and methods. The devices are designed to covert formic acid into released hydrogen, alleviating the need for a hydrogen tank as a hydrogen source for fuel cell power. In particular, an electricity generation device for powering a battery comprising a formic acid reservoir containing a liquid consisting of formic acid; a reaction chamber capable of using a catalyst and heat to convert the formic acid to hydrogen and carbon dioxide; a fuel cell that generates electricity; a delivery system for moving converted hydrogen into the fuel cell; and a battery powered by electricity generated by the fuel cell is provided.
    Type: Grant
    Filed: January 27, 2022
    Date of Patent: February 13, 2024
    Assignee: King Abdullah University of Science and Technology
    Inventors: Kuo-Wei Huang, Junrong Zheng
  • Patent number: 11894503
    Abstract: A light emitting diode device includes a substrate, a frame, an LED die and a transparent layer. The frame is located on the substrate. The frame and the substrate collectively define a concave portion. The frame has a light reflectivity ranging from 20% to 40%. The LED die is located on the substrate and within the concave portion. The transparent layer is filled into the concave portion and covering the LED die, wherein the LED die has a side-emitting surface and a top-emitting surface, the side-emitting surface has a luminous intensity greater than that of the top-emitting surface.
    Type: Grant
    Filed: November 24, 2022
    Date of Patent: February 6, 2024
    Assignee: Lextar Electronics Corporation
    Inventors: Shu-Wei Chen, Ching-Huai Ni, Kuo-Wei Huang, Jia-Jhang Kuo
  • Publication number: 20240009657
    Abstract: A composition of matter is provided comprising hierarchically ordered crystalline microporous material having well-defined long-range mesoporous ordering of hexagonal symmetry. The composition possesses mesopores having walls of crystalline microporous material and a mass of mesostructure between mesopores of crystalline microporous material. Long-range ordering is defined by presence of secondary peaks in an X-ray diffraction (XRD) pattern and/or hexagonal symmetry observable by microscopy.
    Type: Application
    Filed: July 5, 2022
    Publication date: January 11, 2024
    Inventors: Rajesh Kumar PARSAPUR, Robert P. HODGKINS, Omer Refa KOSEOGLU, Kuo-Wei HUANG, Anissa Bendjeriou SEDJERARI
  • Publication number: 20240010662
    Abstract: Methods for synthesis of hierarchically ordered zeolites and zeolite-type materials are provided. Synthesized hierarchically ordered zeolites and zeolite-type materials formed according to the methods herein possess a high-degree of well-defined long-range mesoporous ordering. The methods include base-mediated reassembly, by dissolution of the parent material to the level of oligomeric structural building units of the parent material, and minimizing or avoiding amorphization/structural collapse. The dissolution and self-assembly is comprehensively controlled to produce hierarchically ordered zeolites and zeolite-type materials according to the methods herein.
    Type: Application
    Filed: July 5, 2022
    Publication date: January 11, 2024
    Inventors: Rajesh Kumar PARSAPUR, Robert P. HODGKINS, Omer Refa KOSEOGLU, Kuo-Wei HUANG, Anissa Bendjeriou SEDJERARI
  • Publication number: 20240009660
    Abstract: Methods for synthesis of hierarchically ordered zeolites and zeolite-type materials are provided. Synthesized hierarchically ordered zeolites and zeolite-type materials formed according to the methods herein possess a high-degree of well-defined long-range mesoporous ordering. The methods include base-mediated reassembly, by dissolution of the parent material to the level of oligomeric structural building units of the parent material, and minimizing or avoiding amorphization/structural collapse. The dissolution and self-assembly is comprehensively controlled to produce hierarchically ordered zeolites and zeolite-type materials according to the methods herein.
    Type: Application
    Filed: January 9, 2023
    Publication date: January 11, 2024
    Inventors: Rajesh Kumar PARSAPUR, Robert Peter HODGKINS, Omer Refa KOSEOGLU, Kuo-Wei HUANG, Anissa Bendjeriou SEDJERARI