Patents by Inventor Kuo-Yu Lin

Kuo-Yu Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240100147
    Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).
    Type: Application
    Filed: November 3, 2023
    Publication date: March 28, 2024
    Inventors: Chi-Huey WONG, Hsin-Yu LIAO, Shih-Chi WANG, Yi-An KO, Kuo-I LIN, Che MA, Ting-Jen CHENG
  • Patent number: 11939268
    Abstract: A method of forming low-k material is provided. The method includes providing a plurality of core-shell particles. The core of the core-shell particles has a first ceramic with a low melting point. The shell of the core-shell particles has a second ceramic with a low melting point and a low dielectric constant. The core-shell particles are sintered and molded to form a low-k material. The shell of the core-shell particles is connected to form a network structure of a microcrystal phase.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: March 26, 2024
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Kuo-Chuang Chiu, Tzu-Yu Liu, Tien-Heng Huang, Tzu-Chi Chou, Cheng-Ting Lin
  • Publication number: 20240088195
    Abstract: An image sensor device includes a semiconductor substrate, a radiation sensing member, a shallow trench isolation, and a color filter layer. The radiation sensing member is in the semiconductor substrate. An interface between the radiation sensing member and the semiconductor substrate includes a direct band gap material. The shallow trench isolation is in the semiconductor substrate and surrounds the radiation sensing member. The color filter layer covers the radiation sensing member.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chia-Yu WEI, Yen-Liang LIN, Kuo-Cheng LEE, Hsun-Ying HUANG, Hsin-Chi CHEN
  • Publication number: 20240088205
    Abstract: A capacitor unit includes a bottom electrode; a raised sub-structure provided on the bottom electrode and having a plurality of trenches exposing the bottom electrode; a first capacitance conductive layer formed on a surface of the raised sub-structure and a surface of the bottom electrode, the first capacitance conductive layer having a substantially uniform thickness; a capacitance insulation layer formed on a surface of the first capacitance conductive layer and having a substantially uniform thickness; and a top electrode covering a surface of the capacitance insulation layer. A side of the top electrode abutting the capacitance insulation layer is extended along the surface of the capacitance insulation layer.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 14, 2024
    Inventors: KUO-YU YEH, WEI-YU LIN
  • Patent number: 11929331
    Abstract: The present disclosure provides a routing structure. The routing structure includes a substrate having a boundary and a first conductive trace configured to be coupled to a first conductive pad disposed within the boundary of the substrate. The first conductive trace is inclined with respect to the boundary of the substrate.
    Type: Grant
    Filed: December 19, 2022
    Date of Patent: March 12, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chin-Shen Lin, Wan-Yu Lo, Meng-Xiang Lee, Hao-Tien Kan, Kuo-Nan Yang, Chung-Hsing Wang
  • Patent number: 11918641
    Abstract: The present disclosure relates to a chimeric influenza virus hemagglutinin (HA) polypeptide, comprising one or more stem domain sequence, each having at least 60% homology with a stem domain consensus sequence of H1 subtype HA (H1 HA) and/or H5 subtype HA (H5 HA), fused with one or more globular head domain sequence, each having at least 60% homology with a globular head domain consensus sequence of H1 subtype HA (H1 HA) or H5 subtype HA (H5 HA).
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: March 5, 2024
    Assignee: ACADEMIA SINICA
    Inventors: Chi-Huey Wong, Hsin-Yu Liao, Shih-Chi Wang, Yi-An Ko, Kuo-I Lin, Che Ma, Ting-Jen Cheng
  • Publication number: 20240072158
    Abstract: A method of forming a FinFET is disclosed. The method includes depositing a conductive material across each of a number of adjacent fins, depositing a sacrificial mask over the conductive material, patterning the conductive material with the sacrificial mask to form a plurality of conductive material segments, depositing a sacrificial layer over the sacrificial mask, and patterning the sacrificial layer, where a portion of the patterned sacrificial layer remains over the sacrificial mask, where a portion of the sacrificial mask is exposed, and where the exposed portion of the sacrificial mask extends across each of the adjacent fins. The method also includes removing the portion of the sacrificial layer over the sacrificial mask, after removing the portion of the sacrificial layer over the sacrificial mask, removing the sacrificial mask, epitaxially growing a plurality of source/drain regions from the semiconductor substrate, and electrically connecting the source/drain regions to other devices.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Inventors: Sung-Hsin Yang, Jung-Chi Jeng, Ru-Shang Hsiao, Kuo-Min Lin, Z.X. Fan, Chun-Jung Huang, Wen-Yu Kuo
  • Publication number: 20230291239
    Abstract: The present invention provides a control method of an electronic device, wherein the control method includes the steps of: enabling a wireless charging mode; generating a packet, wherein the packet comprises content that is not recognized by other electronic devices to issue an acknowledgement; and wirelessly transmitting the packet, and continuously retransmitting the packet.
    Type: Application
    Filed: March 6, 2023
    Publication date: September 14, 2023
    Applicant: MEDIATEK INC.
    Inventors: Hong-Sheng Yan, Yun-Hao Liang, Kuo-Yu Lin
  • Publication number: 20090052686
    Abstract: An electronic device includes a front cover, a circuit board, a plurality of flexible boots, a plurality of microphones, and an abutting mechanism. The front cover includes a plurality of wall portions, a plurality of storage spaces encircled by the wall portions, and a plurality of acoustic openings connecting to the storage spaces. The flexible boots are disposed in the storage spaces. The microphones are mounted on the circuit board and disposed in the boots. The abutting mechanism pushes the circuit board toward the front cover to squeeze the flexible boot.
    Type: Application
    Filed: August 23, 2007
    Publication date: February 26, 2009
    Applicant: FORTEMEDIA, INC.
    Inventors: Li-Te Wu, Yu-De Tsai, Yi-Wen Chen, Sung-Kai Yang, Kuo-Yu Lin
  • Patent number: 6463103
    Abstract: A spectral shaping PCM modem communication system uses a symbol encoder to encode a data bit stream into a PCM symbol stream. A plurality of different frames are formed from the PCM symbol stream. Performance metrics are computed for each possible frame and its inversion so a decision can be made in order to select a most desirable frame and inversion Delays are injected in the data flow to allow a look-ahead and thus provide for better frame selection and inversion decisions. A channel multiplexer combines decision bits and output frames to form encoded output frames that are fed to a digital channel connected to a telephone network wherein they are converted to analog signal. A corresponding decoder converts analog signals from the telephone network to digital signals. A timing recovery and equalization means corrects sample timing and removes inter-symbol interference effects introduced by telephone networks.
    Type: Grant
    Filed: September 8, 2000
    Date of Patent: October 8, 2002
    Assignee: ESS Technology, Inc.
    Inventors: Ping Dong, Kuo-Yu Lin
  • Patent number: 6343101
    Abstract: A spectral shaping PCM modem communication system uses a symbol encoder to encode a data bit stream into a PCM symbol stream. A plurality of different frames are formed from the PCM symbol stream. Performance metrics are computed for each possible frame and its inversion so a decision can be made in order to select a most desirable frame and inversion. Delays are injected in the data flow to allow a look-ahead and thus provide for better frame selection and inversion decisions. A channel multiplexer combines decision bits and output frames to form encoded output frames that are fed to a digital channel connected to a telephone network wherein they are converted to analog signal. A corresponding decoder converts analog signals from the telephone network to digital signals. A timing recovery and equalization means corrects sample timing and removes inter-symbol interference effects introduced by telephone networks.
    Type: Grant
    Filed: January 16, 1998
    Date of Patent: January 29, 2002
    Assignee: ESS Technology, Inc.
    Inventors: Ping Dong, Kuo-Yu Lin