Abstract: A fluorine resin film to be provided includes a fluorine resin, wherein the fluorine resin film has an average value of 1200% or more of a tensile elongation at break in a first direction and a tensile elongation at break in a second direction under a 180° C. atmosphere, the first direction and the second direction being in-plane directions and orthogonal to each other. This fluorine resin film can be used as a coating film for coating the surface of a rubber-containing substrate included in a molded rubber body and is suitable for manufacturing a molded rubber body having a surface coated with the film.

Abstract: A fluorine resin film to be provided includes a fluorine resin, and has a surface subjected to a modification treatment. In a C1s narrow spectrum at the surface evaluated by electron spectroscopy for chemical analysis, an intensity of a peak at a 284 eV chemical shift is 0.80 or less when an intensity of a maximum peak is set to 1. This fluorine resin film is a fluorine resin film having a surface subjected to a modification treatment, and is suitable for manufacturing a molded rubber body having a surface coated with the film.

Abstract: A fluorine resin film to be provided includes a fluorine resin, and has a surface subjected to a modification treatment. The fluorine resin film has, at the surface, the following proportion of each of carbon, oxygen, and fluorine elements based on 100 atom % of a sum of the elements: 30 atom % or more and 70 atom % or less of carbon; 0.6 atom % or more and less than 13 atom % of oxygen; and 60 atom % or less of fluorine. This fluorine resin film is a fluorine resin film having a surface subjected to a modification treatment, and is suitable for manufacturing a molded rubber body having a surface coated with the film.

Abstract: A provided heat-resistant cushioning sheet is a sheet configured to be disposed between a thermocompression face of a thermocompression apparatus and a target in a thermocompression treatment of the target, and includes: a substrate including a fluorine resin; and a coating layer including a heat-resistant resin and disposed on a one principal surface side of the substrate. One exposed surface of the heat-resistant cushioning sheet is formed by the coating layer. The heat-resistant resin is a resin other than a fluorine resin and has a melting point of 280° C. or higher and/or a glass transition temperature of 210° C. or higher. The provided heat-resistant cushioning sheet is well adapted to expected further increases in treatment temperature and pressure.

Abstract: A heat-resistant release sheet is configured to be disposed, when a resin or a target including a resin is used in a step involving heating and melting of the resin, between the resin or the target and a member to be brought into contact with the resin or the target to prevent direct contact between the resin or the target and the member. The sheet includes a skived sheet including polytetrafluoroethylene (PTFE) or a modified PTFE. A content of a tetrafluoroethylene (TFE) unit in the modified PTFE is 99 mass % or more. In each of two directions being in-plane directions of the heat-resistant release sheet and being perpendicular to each other, a rate of dimensional shrinkage induced by heating at 175° C. for 30 minutes is more than 0%. The sheet includes the skived sheet including the heat-resistant resin but prevents occurrence of problems attributable to inclusion of the skived sheet.

Abstract: A provided heat-resistant cushioning sheet is a heat-resistant cushioning sheet configured to be disposed between a thermocompression face of a thermocompression apparatus and a target in thermocompression treatment of the target to prevent direct contact between the target and the thermocompression face, wherein a compression strain change amount ?S250 being a difference S250?S25 between a compression strain S25 at 25° C. and a compression strain S250 at 250° C. is ?5% or more. S25 and S250 are each a compression strain ST of the heat-resistant cushioning sheet evaluated by thermomechanical analysis (TMA), S25 is evaluated at an evaluation temperature of 25° C., and S250 is evaluated at an evaluation temperature of 250° C. The compression strain ST is determined by an equation ST=(t1?t0)/t0×100(%), where to is a thickness of the heat-resistant cushioning sheet at 25° C. and t1 is a thickness of the heat-resistant cushioning sheet.

Abstract: A fluororesin sheet of the present invention is a sheet mainly including a fluororesin, having a blackness of 30 or less as expressed in terms of L* value in an L*a*b* color system, and having a surface resistivity of 1×1010 ?/sq or more. The fluororesin sheet of the present invention may be a sheet mainly including a fluororesin and including a composite oxide black filler. An adhesive tape of the present invention includes a substrate sheet and an adhesive layer provided on one of surfaces of the substrate sheet, and the substrate sheet is one of the above fluororesin sheets. The fluororesin sheet and the adhesive tape of the present invention unprecedentedly have a high degree of freedom in application development.

Abstract: A heat-resistant release sheet of the present disclosure is a sheet formed of a single-layer heat-resistant resin film having a thickness of 35 pm or less, wherein the sheet is disposed between a compression bonding target and a thermocompression head at the time of thermocompression-bonding the compression bonding target by the thermocompression head to prevent fixation between the compression bonding target and the thermocompression head, and a heat-resistant resin forming the heat-resistant resin film has a melting point of 310° C. or higher and/or a glass transition temperature of 210° C. or higher. A use temperature of this heat-resistant release sheet can be, for example, 250° C. or higher. The heat-resistant release sheet of the present disclosure can more reliably meet a demand for an increase in thermocompression bonding temperature.

Abstract: A heat-resistant release sheet includes a heat-resistant release sheet to be disposed between a compression bonding target and a thermocompression head at the time of thermocompression-bonding the compression bonding target by the thermocompression head to prevent fixation between the compression bonding target and the thermocompression head, wherein surface hardness, as expressed in an indentation degree A300 given by an equation A300 (%)=(d300/t0)×100, of the heat-resistant release sheet at 300° C. is 15% or less, where to is a thickness of the heat-resistant release sheet at ordinary temperature (20° C.) and d300 is an indentation depth evaluated for the heat-resistant release sheet at 300° C.

Abstract: The heat-resistant release sheet of the present disclosure is a sheet including a sheet made of polytetrafluoroethylene (PTFE) or a modified PTFE, wherein the sheet is disposed between a compression bonding target and a thermocompression head at the time of thermocompression-bonding the compression bonding target by the thermocompression head to prevent fixation between the compression bonding target and the thermocompression head, and the content of a tetrafluoroethylene (TFE) unit in the modified PTFE is 99 mass % or more. The heat-resistant release sheet of the present disclosure can more reliably meet a demand for a shorter time (work time) required for thermocompression bonding.

Abstract: A heat resistant release sheet of the present disclosure includes a polyimide substrate, and a first polytetrafluoroethylene (PTFE) layer and a second PTFE layer that sandwich the polyimide substrate therebetween. PTFE composing the first PTFE layer and PTFE composing the second PTFE layer each have a number-average molecular weight of 6 million or more, and a peel force required to peel the first PTFE layer from the polyimide substrate is 0.5 N/20 mm or more, and a peel force required to peel the second PTFE layer from the polyimide substrate is less than 0.5 N/20 mm. The heat resistant release sheet of the present disclosure has a new structure and can also be used for thermocompression bonding at a higher temperature.

Abstract: A heat resistant release sheet of the present disclosure includes a polyimide substrate, and a first polytetrafluoroethylene (PTFE) layer and a second PTFE layer that sandwich the polyimide substrate therebetween. PTFE composing the first PTFE layer and PTFE composing the second PTFE layer each have a number-average molecular weight of 6 million or more, and a peel force required to peel the first PTFE layer from the polyimide substrate is 0.5 N/20 mm or more, and a peel force required to peel the second PTFE layer from the polyimide substrate is less than 0.5 N/20 mm. The heat resistant release sheet of the present disclosure has a new structure and can also be used for thermocompression bonding at a higher temperature.

Abstract: There is provided a production method for a resin film according to which an application liquid raw material (polyaniline solution) does not gelate over a long period of time and a resin film can be stably produced. A production method for a resin film according to an embodiment of the present invention includes the step of heating and kneading a polyaniline in an emeraldine base state and a protonic acid to prepare a conductive resin composition.