Patents by Inventor Kurodearimasu Takeshi Hirose

Kurodearimasu Takeshi Hirose has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6564946
    Abstract: A containment device for retaining semiconductor wafers having a first housing member having a frame with inner and outer walls normal to the frame having a gapped relation. The inner wall receives the semiconductor wafers. A second housing member securably attachable to the first housing member by plural latches has a frame forming the top of the device. Each latch has a hook secured to the first housing member passing through a hole in the second housing member and releasably secured within the hole by the hook. In a second embodiment, the latches and holes are replaced with a plurality of rotatable latch members each having a hook at the distal end for engagement with a hole in the second housing member, secured to the first housing member and rotatable about a hinge. One wall of the first embodiment is replaced with a soft liner which absorbs shock.
    Type: Grant
    Filed: October 23, 2001
    Date of Patent: May 20, 2003
    Assignee: Texas Instruments Incorporated
    Inventors: Lee Lewis, Kurodearimasu Takeshi Hirose, Jeffrey Wilson, James Dove, Michael Hayden
  • Publication number: 20020063080
    Abstract: A containment device for retaining semiconductor wafers (54) is disclosed. The containment device comprises a first housing member (10) having a frame (12), an inner wall (14) and an outer wall (16). The inner wall (14) and outer wall (16) each extend generally perpendicularly from the frame (12). The inner wall (14) and outer wall (16) have a spaced apart relationship forming a gap (18) therebetween. The inner wall (14) closely receives the semiconductor wafers (54). The containment device also comprises a second housing member (36) that is securably attachable to the first housing member (10). The second housing member (36) has a frame (38) that forms the top of the containment device when the first and second housing members (10, 36) are securably attached together.
    Type: Application
    Filed: October 23, 2001
    Publication date: May 30, 2002
    Inventors: Lee Lewis, Kurodearimasu Takeshi Hirose, Jeffrey Wilson, James Dove, Michael Hayden
  • Patent number: 6341695
    Abstract: A containment device for retaining semiconductor wafers (54) which includes a first housing member (10) having a frame (12), an inner wall (14) and an outer wall (16), the inner wall (14) and outer wall (16) having a spaced apart relationship forming a gap (18) therebetween. The inner wall (14) closely receives the semiconductor wafers (54). The containment device also includes a second housing member (36) that is securably attachable to the first housing member (10) and which has a frame (38) that forms the top of the containment device when the first and second housing members (10, 36) are securably attached together. The first and second housing members are secured by a plurality of latches (20), each with a hook (22) secured to the first housing member which passes through a hole (40) in the second housing member and is releasably secured within the hole by the hook.
    Type: Grant
    Filed: May 15, 2000
    Date of Patent: January 29, 2002
    Assignee: Texas Instruments Incorporated
    Inventors: Lee Lewis, Kurodearimasu Takeshi Hirose, Jeffrey Wilson, James Dove, Michael Hayden
  • Patent number: 6193068
    Abstract: A containment device for retaining semiconductor wafers (54) is disclosed. The containment device comprises a first housing member (10) having a frame (12), an inner wall (14) and an outer wall (16). The inner wall (14) and outer wall (16) each extend generally perpendicularly from the frame (12). The inner wall (14) and outer wall (16) have a spaced apart relationship forming a gap (18) therebetween. The inner wall (14) closely receives the semiconductor wafers (54). The containment device also comprises a second housing member (36) that is securably attachable to the first housing member (10). The second housing member (36) has a frame (38) that forms the top of the containment device when the first and second housing members (10, 36) are securably attached together.
    Type: Grant
    Filed: April 22, 1999
    Date of Patent: February 27, 2001
    Assignee: Texas Instruments Incorporated
    Inventors: Lee Lewis, Kurodearimasu Takeshi Hirose, Jeffrey Wilson, James Dove, Michael Hayden