Abstract: A converged infrastructure manager comprises a circuit board, a processor connected to a first side of the circuit board, a solid state drive connected to the circuit board, a first connector extending from the first side of the circuit board, a second connector extending from a second side of the circuit board, a first dual in-line memory module connected to the first connector and a second dual in-line memory module connected to the second connector.

Abstract: Example implementations relate to virtualizing fan speed. For example, a system for virtualizing fan speed may include a server enclosure manager connected to a controller area network (CAN) bus, the server enclosure manager to regulate a speed of a fan in a server blade enclosure; and a CAN bus microcontroller connected to the CAN bus. The CAN bus microcontroller may receive a direct current (DC) voltage from an analog low-pass filter, determine a fan speed of the fan corresponding to the received DC voltage, and report the determined fan speed to the enclosure manager.

Abstract: A converged infrastructure manager comprises a circuit board, a processor connected to a first side of the circuit board, a solid state drive connected to the circuit board, a first connector extending from the first side of the circuit board, a second connector extending from a second side of the circuit board, a first dual in-line memory module connected to the first connector and a second dual in-line memory module connected to the second connector.

Abstract: Example implementations relate to virtualizing fan speed. For example, a system for virtualizing fan speed may include a server enclosure manager connected to a controller area network (CAN) bus, the server enclosure manager to regulate a speed of a fan in a server blade enclosure; and a CAN bus microcontroller connected to the CAN bus. The CAN bus microcontroller may receive a direct current (DC) voltage from an analog low-pass filter, determine a fan speed of the fan corresponding to the received DC voltage, and report the determined fan speed to the enclosure manager.

Abstract: A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.

Abstract: Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.

Abstract: A system comprises a primary backplane and a secondary backplane. The primary backplane has a surface region substantially devoid of components and a plurality of connectors to which electronic devices can be mated. The secondary backplane is removably mated to the primary backplane within the region. The secondary backplane has at least two connectors adapted to mate to at least two of the electronic devices. At least two electronic devices communicatively interconnect through the primary and secondary backplanes.

Abstract: Included are embodiments for installation and removal of computing components. More specifically, at least one embodiment of an apparatus includes at least one removable support platform configured to define a computing device bay and at least one removable switch divider configured to further define the computing device bay, the computing device bay configured to receive a double-high component.

Abstract: A blade device enclosure has a chassis configured to selectively house a plurality of configurations of full-high and half-high blade devices, an administrator module, and at least one input/output device. The blade device enclosure also has a printed circuit board including a passive high-speed midplane configured to electronically couple the blade devices to the administrator module and the at least one input/output device.

Abstract: Embodiments of the present technique are directed to a backplane infrastructure. The backplane infrastructure may include a passive power backplane configured to distribute power and comprising a first set of alignment holes, a signal backplane configured to route interface signals and comprising a second set of alignment holes and a set of common alignment pins, each alignment pin having an axis, wherein the set of common alignment pins are inserted into the first set of alignment holes and the second set of alignment holes to align the passive power backplane and the signal backplane about the axis.

Abstract: A system comprises a primary backplane and a secondary backplane. The primary backplane has a surface region substantially devoid of components and a plurality of connectors to which electronic devices can be mated. The secondary backplane is removably mated to the primary backplane within the region. The secondary backplane has at least two connectors adapted to mate to at least two of the electronic devices. At least two electronic devices communicatively interconnect through the primary and secondary backplanes.

Abstract: A memory package comprising a first circuit board having a plurality of memory element sockets and a second circuit board coupled to the first circuit board and comprising a controller chip. The first and second circuit boards are disposed within a tray having a base and two sides. A handle is connected to the tray such that the handle is pivotal with respect to the tray. The handle has a lever system and latch that is slidably engaged with the lever system.

Abstract: A computer chassis comprising a chassis base and first and second drawers removably engaged with the chassis base. An interface board is mounted to the first drawer so as to couple to a first electrical component when the first electrical component is located in the first drawer. The second drawer has a connector mounted so as to couple to a second electrical component when the second electrical component is located in the second drawer. The connector engages the interface board so as to couple the first electrical component to the second electrical component when the first and second electrical components are located in the respective first and second drawers.

Abstract: A memory package comprising a first cover portion connected to a second cover portion. The first cover portion supports a first electronics sub-assembly that comprise a circuit board with at least one memory module socket and at least one controller chip mounted thereto. The second cover portion supports a second electronics sub-assembly that comprises a circuit board with at least one memory module socket and at least one controller chip mounted thereto. The first and second cover portions are moveable between a closed position wherein the electronics sub-assemblies are nested and an open position wherein the electronics sub-assemblies are not nested.

Abstract: A memory package comprising a first circuit board having a plurality of memory element sockets and a second circuit board coupled to the first circuit board and comprising a controller chip. The first and second circuit boards are disposed within a tray having a base and two sides. A handle is connected to the tray such that the handle is pivotal with respect to the tray. The handle has a lever system and latch that is slidably engaged with the lever system.

Abstract: A computer chassis comprising a chassis base and first and second drawers removably engaged with the chassis base. An interface board is mounted to the first drawer so as to couple to a first electrical component when the first electrical component is located in the first drawer. The second drawer has a connector mounted so as to couple to a second electrical component when the second electrical component is located in the second drawer. The connector engages the interface board so as to couple the first electrical component to the second electrical component when the first and second electrical components are located in the respective first and second drawers.

Abstract: A modularized computer chassis for housing multiple computer modules, such as a processor module, media storage module, an I/O module, and power supplies includes a housing divided generally into four regions, with each region configured for receiving one of the modules or power supplies. A single center pluggable midplane board is positioned in the middle of the housing such that each of the modules and power supplies can be interconnected through the single midplane board. The single center pluggable midplane board includes direct pluggable connectors which correspond to connectors on each of the modules and power supplies, such that each of the modules and power supplies are directly connected to the single pluggable midplane board, and no ribbon signal and power cables are needed for the connection. The direct connection between the single center pluggable midplane board and the modules and power supplies helps to minimize the height of the chassis, thereby saving valuable rack space.

Abstract: A modularized computer chassis for housing multiple computer modules, such as a processor module, media storage module, an I/O module, and power supplies includes a housing divided generally into four regions, with each region configured for receiving one of the modules or power supplies. A single center pluggable midplane board is positioned in the middle of the housing such that each of the modules and power supplies can be interconnected through the single midplane board. The single center pluggable midplane board includes direct pluggable connectors which correspond to connectors on each of the modules and power supplies, such that each of the modules and power supplies are directly connected to the single pluggable midplane board, and no ribbon signal and power cables are needed for the connection. The direct connection between the single center pluggable midplane board and the modules and power supplies helps to minimize the height of the chassis, thereby saving valuable rack space.

Abstract: A modularized computer chassis for housing multiple computer modules, such as a processor module, media storage module, an I/O module, and power supplies includes a housing divided generally into four regions, with each region configured for receiving one of the modules or power supplies. A single center pluggable midplane board is positioned in the middle of the housing such that each of the modules and power supplies can be interconnected through the single midplane board. The single center pluggable midplane board includes direct pluggable connectors which correspond to connectors on each of the modules and power supplies, such that each of the modules and power supplies are directly connected to the single pluggable midplane board, and no ribbon signal and power cables are needed for the connection. The direct connection between the single center pluggable midplane board and the modules and power supplies helps to minimize the height of the chassis, thereby saving valuable rack space.

Abstract: A computer system that includes a chassis and a removable module configured to be housed inside the chassis. The chassis includes an interface plate incorporated therewith. The interface plate is perforated to allow air to flow through the interface plate and along peripheral cards attached to the interface plate. The air that flows along the peripheral cards then flows through perforations in a cover that is used to secure the peripheral cards into their associated card slots. The cover then directs the air into a primary air passage used to exhaust air pulled through the chassis.