Abstract: A method of making and the resultant micro well plate that includes a plurality of greensheets, either laminated or sintered together, whereby these greensheets have a plurality of vertical micro well reaction chamber openings therein, and optionally a plurality horizontal channels connecting selected well reaction chamber openings. The vertical micro well reaction chambers have at, at least one end thereof a plurality of optical micro plugs which are aligned to the vertical micro well reaction chamber openings. The plurality of optical micro plugs allow for the micro well plate to be integrated with macro analytical instrumentation for the analysis, examination, and/or testing of chemicals, reagents or samples provided within the vertical micro well reaction chamber openings.

Abstract: Screening of a workpiece utilizing a screening apparatus which includes a paste dispensing apparatus and a trailing squeegee assembly in close proximity to the paste dispensing apparatus. When the screening apparatus is operable, the squeegee assembly is in contact with the workpiece at the same time as a paste is dispensed from the paste dispensing apparatus.

Abstract: A method for displacing an article using first and second pallets for holding and transporting an article between two process stations and an H-bar assembly for receiving the first and second pallets, the method including the steps of: receiving the first and second pallets and articles thereon by the H-bar assembly at one of the two process stations; performing a first process on the articles while received by the H-bar assembly; moving the first and second pallets and articles thereon to a second process station; and performing a second process on the articles while at the second process station.

Abstract: Screening of a workpiece utilizing a screening apparatus which includes a paste dispensing apparatus and a trailing squeegee assembly in close proximity to the paste dispensing apparatus. When the screening apparatus is operable, the squeegee assembly is in contact with the workpiece at the same time as a paste is dispensed from the paste dispensing apparatus.

Abstract: An apparatus for displacing an article including first and second pallets for holding and transporting an article between two process stations; an H-bar assembly for receiving the first and second pallets at one of the two process stations; wherein, in operation, a process is performed on the articles while the first and second pallets are received by the H-bar assembly, the pallets then being transported to the second process station where a second process is performed on the articles.

Abstract: An apparatus for displacing an article including first and second pallets for holding and transporting an article between two process stations; an H-bar assembly for receiving the first and second pallets at one of the two process stations; wherein, in operation, a process is performed on the articles while the first and second pallets are received by the H-bar assembly, the pallets then being transported to the second process station where a second process is performed on the articles.

Abstract: A method for displacing an article using first and second pallets for holding and transporting an article between two process stations and an H-bar assembly for receiving the first and second pallets, the method including the steps of: receiving the first and second pallets and articles thereon by the H-bar assembly at one of the two process stations; performing a first process on the articles while received by the H-bar assembly; moving the first and second pallets and articles thereon to a second process station; and performing a second process on the articles while at the second process station.

Abstract: A process for partially repairing defective Multi-Chip Module (MCM) Thin-Film (TF) wiring nets. The process comprises the steps of locating a short circuit between any two nets of the MCM, identifying a site to cut in one of the two nets, and deleting an internal portion of one of the two nets at the identified site.

Abstract: A process for partially repairing defective Multi-Chip Module (MCM) Thin-Film (TF) wiring nets. The process comprises the steps of locating a short circuit between any two nets of the MCM, identifying a site to cut in one of the two nets, and deleting an internal portion of one of the two nets at the identified site.

Abstract: A Process for graphically assisting the partial repair of defective MCM TF wiring nets. The process comprises the steps of inserting the wiring layer of the thin-film device in a tester, scanning the wiring layer of the thin-film device with the tester, identifying defects in the wiring nets, prioritizing the defects based on a function of each of the defective wiring nets, and repairing the defects based on priority.

Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a thermally decomposable surface layer is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the thermally decomposable surface layer is conveniently removed in pyrolysis and binder removal segments of the sinter process without causing damage to the cavity shelves or paste pull-outs.

Abstract: The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a thermally decomposable surface layer is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the thermally decomposable surface layer is conveniently removed in pyrolysis and binder removal segments of the sinter process without causing damage to the cavity shelves or paste pull-outs.

Abstract: Missing thin film metallurgy on substrates is replaced during the manufacture of thin film electronic circuits. The process allows the missing thin film metallurgy, such as an input/output (I/O) pad or pads, to be replaced quickly and simply, without damaging the other I/O pads or thin film metallurgy already applied to the substrate. The process essentially uses lift-off technology without building a complete lift-off stencil.

Abstract: Current processes for the formation of hybrid composite sandwich structures are expensive, often result in weak unsound products, require time and labor intensive secondary operations and are not readily adaptable for custom design work. These and other problems are solved by a relatively simple and inexpensive process producing hybrid composite sandwiched structures which includes placing core materials 24 sandwiched by multiples layers including at least one ceramic layer 46 or metallic layer 38 and having polymeric films 32, 34, 40, 42 positioned between substantially all the layers in a mold cavity 18. When the contents of the mold cavity 18 are heated to consolidate this structure, the polymeric films 32, 34, 40, 42 melt and act as an adhesive between the layers of the structure formed.

Abstract: Processes using high temperature thermoplastic polymers in the in-situ fabrication in the formation of foamed composite sandwich or foam articles often result in weak unsound products which may be avoided by utilizing a high temperature thermoplastic in powder form (22), a blowing agent having a high decomposition temperature (24), and, if desired, reinforcers and/or fillers, (28), mixing the thermoplastic, blowing agent and reinforcer and fillers (30), placing the mixture in a mold and, if forming a composite structure, in abutment with at least one skin (34), and applying sufficient heat and/or pressure to the mold and its contents to melt the thermoplastic and generate gas within said mixture by decomposition of the blowing agent (38). Also, an activator may be included with the blowing agent which promotes the production of gas (26). The thermoplastic should be free from any material which will react with the blowing agent or the activator at temperatures below the melting point of the thermoplastic.

Abstract: The present invention is a mask and methods for making masks for use with a laser projection etching system. The unique mask is able to withstand the fluences of the high energy and high power lasers used without degrading. Specifically, the new projection etching masks are fabricated of patterned multiple dielectric layers having alternating high and low indices of refraction on a UV grade synthetic fused silica substrate in order to achieve maximum reflectivity of the laser energy in the opague areas and maximum transmissivity of the laser energy in the transparent areas of the mask.