Patents by Inventor Kurt Ac

Kurt Ac has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper foil for the manufacture of printed circuit boards and method of producing the same
    Patent number: 5447619
    Abstract: A surface of copper foil is protected from oxidation and tarnishing by electrodepositing on the surface a protective layer containing metallic zinc and one or more compound of tri-valent chromium, which protection layer is easily removable by dissolution in a dilute aqueous alkaline solution and which preferably has a zinc to chromium weight ratio of 1:1 or greater. An electrodeposited copper foil especially suited for multilayer printed circuit boards has such a protective layer electrodeposited on the matte side thereof and an electrodeposited copper bonding treatment on the shiny side thereof.
    Type: Grant
    Filed: November 24, 1993
    Date of Patent: September 5, 1995
    Assignee: Circuit Foil USA, Inc.
    Inventors: Adam M. Wolski, Paul Dufresne, Kurt Ac, Michel Mathieu